Andrew Michael Seman

Person

Kirkwood, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a circuitized substrate
- Patent number 7,596,862
- Issue date Oct 6, 2009
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuitized substrate
- Patent number 7,325,299
- Issue date Feb 5, 2008
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 7,240,430
- Issue date Jul 10, 2007
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuitized substrate
- Patent number 7,185,428
- Issue date Mar 6, 2007
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced design and process for a conductive adhesive
- Patent number 7,063,756
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Donald Seton Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating printed circuit board with mixed metallurgy pads
- Patent number 6,931,722
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 6,902,869
- Issue date Jun 7, 2005
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine line circuitization
- Patent number 6,822,332
- Issue date Nov 23, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 6,684,497
- Issue date Feb 3, 2004
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mixed metallurgy pads and method of fabr...
- Patent number 6,586,683
- Issue date Jul 1, 2003
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced design and process for a conductive adhesive
- Patent number 6,534,724
- Issue date Mar 18, 2003
- International Business Machines Corporation
- Donald Seton Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for forming the same of a printed wiring board...
- Patent number 6,429,390
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Michael J. Cummings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with continuous connective bumps
- Patent number 6,222,136
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive bonding design and method for aluminum backed circuits
- Patent number 6,178,630
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Lisa Jeanine Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive bonding design for metal backed circuits
- Patent number 5,920,037
- Issue date Jul 6, 1999
- International Business Machines Corporation
- Lisa Jeanine Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical and/or thermal interconnections and methods for obtainin...
- Patent number 5,189,261
- Issue date Feb 23, 1993
- IBM Corporation
- Lawrence C. Alexander
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A CIRCUITIZED SUBSTRATE
- Publication number 20080014409
- Publication date Jan 17, 2008
- Frank D. Egitto
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MAKING A CIRCUITIZED SUBSTRATE
- Publication number 20070102396
- Publication date May 10, 2007
- Frank D. Egitto
- B32 - LAYERED PRODUCTS
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20050124096
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fine line circuitization
- Publication number 20040130003
- Publication date Jul 8, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B32 - LAYERED PRODUCTS
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20040091821
- Publication date May 13, 2004
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fine line circuitization
- Publication number 20040056330
- Publication date Mar 25, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20030177635
- Publication date Sep 25, 2003
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhanced design and process for a conductive adhesive
- Publication number 20030140488
- Publication date Jul 31, 2003
- International Business Machines Corporation
- Donald Seton Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20020157861
- Publication date Oct 31, 2002
- International Business Machines Corporation
- Edward L. Arrington
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20010032828
- Publication date Oct 25, 2001
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Andrew Michael Seman

Person

Patents Grantslast 30 patents

Method of making a circuitized substrate

Method of making a circuitized substrate

Manufacturing methods for printed circuit boards

Method of making a circuitized substrate

Enhanced design and process for a conductive adhesive

Method of fabricating printed circuit board with mixed metallurgy pads

Manufacturing methods for printed circuit boards

Fine line circuitization

Manufacturing methods for printed circuit boards

Printed circuit board with mixed metallurgy pads and method of fabr...

Enhanced design and process for a conductive adhesive

Structure and method for forming the same of a printed wiring board...

Printed circuit board with continuous connective bumps

Conductive bonding design and method for aluminum backed circuits

Conductive bonding design for metal backed circuits

Electrical and/or thermal interconnections and methods for obtainin...

Patents Applicationslast 30 patents

METHOD OF MAKING A CIRCUITIZED SUBSTRATE

METHOD OF MAKING A CIRCUITIZED SUBSTRATE

Manufacturing methods for printed circuit boards

Fine line circuitization

Manufacturing methods for printed circuit boards

Fine line circuitization

Printed circuit board with mixed metallurgy pads and method of fabr...

Enhanced design and process for a conductive adhesive

Printed circuit board with mixed metallurgy pads and method of fabr...

Manufacturing methods for printed circuit boards