Atsushi Fujisawa

Person

Hakodate, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 9,324,644
- Issue date Apr 26, 2016
- Renesas Electronics Corporation
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,263,274
- Issue date Feb 16, 2016
- Renesas Electronics Corporation
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 9,184,142
- Issue date Nov 10, 2015
- Renesas Electronics Corporation
- Atsushi Fujisawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,087,850
- Issue date Jul 21, 2015
- Renesas Electronics Corporation
- Atsushi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,006,871
- Issue date Apr 14, 2015
- Renesas Electronics Corporation
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,609,468
- Issue date Dec 17, 2013
- Renesas Electronics Corporation
- Atsushi Fujisawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,466,540
- Issue date Jun 18, 2013
- Renesas Electronics Corporation
- Shigeki Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,399,302
- Issue date Mar 19, 2013
- Renesas Electronics Corporation
- Shigeki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor devices and semiconductor de...
- Patent number 8,193,024
- Issue date Jun 5, 2012
- Renesas Electronics Corporation
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package configuration with improved lead portion arra...
- Patent number 7,579,674
- Issue date Aug 25, 2009
- Renesas Technology Corp.
- Kenji Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 7,348,659
- Issue date Mar 25, 2008
- Renesas Technology Corp.
- Kenji Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method with leads that h...
- Patent number 6,924,548
- Issue date Aug 2, 2005
- Hitachi, Ltd.
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device using the lead frame and method...
- Patent number 6,909,179
- Issue date Jun 21, 2005
- Renesas Technology Corp.
- Shigeki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package including forming a r...
- Patent number 6,887,739
- Issue date May 3, 2005
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a resin encapsulated semiconductor device t...
- Patent number 6,764,878
- Issue date Jul 20, 2004
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having resin sealing body
- Patent number 6,759,279
- Issue date Jul 6, 2004
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,590,275
- Issue date Jul 8, 2003
- Hitachi, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,551,862
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Riyouichi Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,476,466
- Issue date Nov 5, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,448,111
- Issue date Sep 10, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,437,428
- Issue date Aug 20, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device using the lead frame and method...
- Patent number 6,265,762
- Issue date Jul 24, 2001
- Hitachi, Ltd.
- Shigeki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip mounted on a flexible substrate...
- Patent number 6,232,650
- Issue date May 15, 2001
- Hitachi, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150294870
- Publication date Oct 15, 2015
- RENESAS ELECTRONICS CORPORATION
- Atsushi FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20150187687
- Publication date Jul 2, 2015
- RENESAS ELECTRONICS CORPORATION
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140061953
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Atsushi FUJISAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130020692
- Publication date Jan 24, 2013
- Renesas Electronics Corporation
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120267772
- Publication date Oct 25, 2012
- RENESAS ELECTRONICS CORPORATION
- Atsushi FUJISAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120108013
- Publication date May 3, 2012
- Renesas Electronics Corporation
- Atsushi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110300670
- Publication date Dec 8, 2011
- Renesas Electronics Corporation
- Shigeki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Therefor
- Publication number 20100193923
- Publication date Aug 5, 2010
- Renesas Technology Corp.
- Shigeki Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of manufacturing thereof
- Publication number 20050029640
- Publication date Feb 10, 2005
- Kenji Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20040046240
- Publication date Mar 11, 2004
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20040005733
- Publication date Jan 8, 2004
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20020192872
- Publication date Dec 19, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a resin encapsulated semiconductor device t...
- Publication number 20020182776
- Publication date Dec 5, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array type semiconductor package having a flexible substrate
- Publication number 20020079579
- Publication date Jun 27, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array type semiconductor package having a flexible substrate
- Publication number 20020070462
- Publication date Jun 13, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020050642
- Publication date May 2, 2002
- Riyouichi Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A method of manufacturing a semiconductor device
- Publication number 20020039811
- Publication date Apr 4, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame and semiconductor device using the lead frame and method...
- Publication number 20010050419
- Publication date Dec 13, 2001
- Shigeki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20010015489
- Publication date Aug 23, 2001
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS

Atsushi Fujisawa

Person

Patents Grantslast 30 patents

Semiconductor device

Method for manufacturing semiconductor device

Semiconductor device and manufacturing method of the same

Method for manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

Method of manufacturing semiconductor device

Manufacturing method for semiconductor devices and semiconductor de...

Semiconductor package configuration with improved lead portion arra...

Semiconductor device and method of manufacturing thereof

Semiconductor device and its manufacturing method with leads that h...

Lead frame and semiconductor device using the lead frame and method...

Method of manufacturing semiconductor package including forming a r...

Method of manufacturing a resin encapsulated semiconductor device t...

Method of manufacturing semiconductor device having resin sealing body

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device and method of manufacturing the same

Ball grid array type semiconductor package having a flexible substrate

Method of manufacturing a semiconductor device

Ball grid array type semiconductor package having a flexible substrate

Lead frame and semiconductor device using the lead frame and method...

Semiconductor device having a chip mounted on a flexible substrate...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device and Manufacturing Method Therefor

Semiconductor device and method of manufacturing thereof

Semiconductor device and its manufacturing method

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing a resin encapsulated semiconductor device t...

Ball grid array type semiconductor package having a flexible substrate

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device

Lead frame and semiconductor device using the lead frame and method...

Semiconductor device and its manufacturing method