Claims
- 1. A semiconductor device comprising:
a substrate; a semiconductor chip mounted on one surface of said substrate, said semiconductor chip having an integrated circuit and bonding pads formed on a main surface thereof, said main surface of said semiconductor chip having a quadrilateral shape, said bonding pads being disposed along four sides of said main surface of said semiconductor chip; a plurality of conductors being disposed on said one surface of said substrate to surround said semiconductor chip along the four sides thereof; a plurality of bonding wires electrically connecting said bonding pads with tips of said plurality of conductors, respectively; and a resin body sealing said semiconductor chip, said plurality of conductors and said plurality of bonding wires; wherein a pitch between adjacent bonding pads increases in a direction toward four corners defined by the four sides of said main surface of said semiconductor chip.
- 2. A semiconductor device according to claim 1, wherein a largest pitch of the tips of the conductors of two adjacent conductors at the vicinity of each of the four corners of said semiconductor chip is less than twice a smallest pitch with respect to pitches of respective tips of said plurality of conductors surrounding said semiconductor chip.
- 3. A semiconductor device according to claim 2, wherein a relationship (L)<2×(W1)+(W2) exists, where (L) is an allowable largest spacing at points of adjacent conductors, (W1) is a smallest pitch of the adjacent conductors and (W2) is a smallest width of the conductors.
- 4. A semiconductor device according to claim 3, wherein said semiconductor chip is bonded to said substrate by a thermosetting resin.
- 5. A semiconductor device according to claim 3, wherein said substrate includes an insulating layer formed on said one surface thereof.
- 6. A semiconductor device according to claim 3, wherein said conductors are formed of a material whose principal component is copper.
Priority Claims (2)
Number |
Date |
Country |
Kind |
9-008964 |
Jan 1997 |
JP |
|
8-060421 |
Mar 1996 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATION
[0001] This is a continuation of U.S. application Ser. No. 08/820,228, filed Mar. 18, 1997, the subject matter of which is incorporated by reference herein.
Continuations (1)
|
Number |
Date |
Country |
Parent |
08820228 |
Mar 1997 |
US |
Child |
09904839 |
Jul 2001 |
US |