Benjamin DUONG

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Glass interposer optical switching device and method
- Patent number 12,353,070
- Issue date Jul 8, 2025
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Grant
Die last and waveguide last architecture for silicon photonic packa...
- Patent number 12,345,932
- Issue date Jul 1, 2025
- Intel Corporation
- Bai Nie
- G02 - OPTICS
Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having integrated magnetic core inductors
- Patent number 12,249,584
- Issue date Mar 11, 2025
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency antennas and waveguides for communication between i...
- Patent number 12,165,994
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,159,844
- Issue date Dec 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,057,252
- Issue date Aug 6, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch barrier for microelectronic packaging conductive structures
- Patent number 11,948,898
- Issue date Apr 2, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMU...
- Publication number 20250216636
- Publication date Jul 3, 2025
- Intel Corporation
- Vinod ADIVARAHAN
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR MICRO-LED OPTICAL COMMUNICATION VIA GLASS WAVEGUIDES
- Publication number 20250216608
- Publication date Jul 3, 2025
- Benjamin T. Duong
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...
- Publication number 20250218983
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES
- Publication number 20250219032
- Publication date Jul 3, 2025
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE
- Publication number 20250218963
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE
- Publication number 20250218915
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...
- Publication number 20250218961
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES
- Publication number 20250218898
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...
- Publication number 20250220819
- Publication date Jul 3, 2025
- Intel Corporation
- Pratyasha MOHAPATRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR EMBEDDED COMPONENT IN CORE
- Publication number 20250218952
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES
- Publication number 20250210469
- Publication date Jun 26, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...
- Publication number 20250201787
- Publication date Jun 19, 2025
- Intel Corporation
- Marcel M. Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...
- Publication number 20250201732
- Publication date Jun 19, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONNECTOR FERRULE
- Publication number 20250110289
- Publication date Apr 3, 2025
- Intel Corporation
- Benjamin T. Duong
- G02 - OPTICS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105209
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Publication number 20250096053
- Publication date Mar 20, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Publication number 20250022786
- Publication date Jan 16, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
- Publication number 20250014954
- Publication date Jan 9, 2025
- Soham Agarwal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Publication number 20250006671
- Publication date Jan 2, 2025
- Intel Corporation
- Marcel Arlan Wall
- H01 - BASIC ELECTRIC ELEMENTS

Benjamin DUONG

Person

Patents Grantslast 30 patents

Glass interposer optical switching device and method

Die last and waveguide last architecture for silicon photonic packa...

Capacitors in through glass vias

Microelectronic assemblies having integrated magnetic core inductors

Radio frequency antennas and waveguides for communication between i...

Electronic substrates having embedded inductors

Electronic substrates having embedded inductors

Etch barrier for microelectronic packaging conductive structures

Patents Applicationslast 30 patents

OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMU...

TECHNOLOGIES FOR MICRO-LED OPTICAL COMMUNICATION VIA GLASS WAVEGUIDES

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...

TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

Technologies for Components Embedded in a Substrate Core

PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE

METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...

RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES

COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...

SPACER FOR EMBEDDED COMPONENT IN CORE

MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES

APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...

MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

OPTICAL CONNECTOR FERRULE

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH

METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER