Bill A. Wofford

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for alignment marks
- Patent number 9,899,334
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Fuchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP process for processing STI on two distinct silicon planes
- Patent number 8,551,886
- Issue date Oct 8, 2013
- Texas Instruments Incorporated
- Kyle P. Hunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved oxide thickness at a shallow t...
- Patent number 7,808,071
- Issue date Oct 5, 2010
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LDMOS transistor double diffused region formation process
- Patent number 7,713,825
- Issue date May 11, 2010
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit capacitor having antireflective dielectric
- Patent number 7,595,525
- Issue date Sep 29, 2009
- Texas Instruments Incorporated
- Bill Alan Wofford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having an alignment...
- Patent number 7,435,659
- Issue date Oct 14, 2008
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit capacitor having antireflective dielectric
- Patent number 7,118,959
- Issue date Oct 10, 2006
- Texas Instruments Incorporated
- Bill Alan Wofford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High precision integrated circuit capacitors
- Patent number 6,806,196
- Issue date Oct 19, 2004
- Texas Instruments Incorporated
- Bill Alan Wofford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High precision integrated circuit capacitors
- Patent number 6,686,237
- Issue date Feb 3, 2004
- Texas Instruments Incorporated
- Bill Alan Wofford
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIELD PLATES FOR INTEGRATED CIRCUITS
- Publication number 20240332369
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Fuchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-N DEVICE WITH PLANARIZED TOPOLOGICAL STRUCTURE
- Publication number 20240213333
- Publication date Jun 27, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Fuchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL STACK TO IMPROVE STACK THERMAL STABILITY
- Publication number 20230134596
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Fuchao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method For Producing Two N-Type Buried Layers In An Integrated Circuit
- Publication number 20180076038
- Publication date Mar 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Tony Phan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PLASMA DIELECTRIC DESPOSITION FOR VOID FREE GAP FILL
- Publication number 20100041241
- Publication date Feb 18, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Joseph A. GALLEGOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Improved Oxide Thickness at a Shallow T...
- Publication number 20100001364
- Publication date Jan 7, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shallow Trench Isolation Process Using Two Liners
- Publication number 20090191688
- Publication date Jul 30, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP PROCESS FOR PROCESSING STI ON TWO DISTINCT SILICON PLANES
- Publication number 20090170317
- Publication date Jul 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kyle P. Hunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIQUE LDMOS PROCESS INTEGRATION
- Publication number 20080293206
- Publication date Nov 27, 2008
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and systems for capacitors
- Publication number 20080137262
- Publication date Jun 12, 2008
- Texas Instruments Inc.
- Pushpa Mahalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CAPACITOR HAVING ANTIREFLECTIVE DIELECTRIC
- Publication number 20070105332
- Publication date May 10, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Bill Alan Wofford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CAPACITOR HAVING ANTIREFLECTIVE DIELECTRIC
- Publication number 20060205140
- Publication date Sep 14, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Bill Alan Wofford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device having an alignment...
- Publication number 20060194401
- Publication date Aug 31, 2006
- Texas Instruments, Incorporated
- Binghua Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for selective plasma etch of an oxide layer
- Publication number 20060105573
- Publication date May 18, 2006
- Texas Instruments, Inc.
- Pushpa Mahalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High precision integrated circuit capacitors
- Publication number 20040127053
- Publication date Jul 1, 2004
- Bill Alan Wofford
- H01 - BASIC ELECTRIC ELEMENTS

Bill A. Wofford

Person

Patents Grantslast 30 patents

Methods and apparatus for alignment marks

CMP process for processing STI on two distinct silicon planes

Semiconductor device having improved oxide thickness at a shallow t...

LDMOS transistor double diffused region formation process

Integrated circuit capacitor having antireflective dielectric

Method for manufacturing a semiconductor device having an alignment...

Integrated circuit capacitor having antireflective dielectric

High precision integrated circuit capacitors

High precision integrated circuit capacitors

Patents Applicationslast 30 patents

FIELD PLATES FOR INTEGRATED CIRCUITS

III-N DEVICE WITH PLANARIZED TOPOLOGICAL STRUCTURE

METAL STACK TO IMPROVE STACK THERMAL STABILITY

Method For Producing Two N-Type Buried Layers In An Integrated Circuit

HIGH DENSITY PLASMA DIELECTRIC DESPOSITION FOR VOID FREE GAP FILL

Semiconductor Device Having Improved Oxide Thickness at a Shallow T...

Shallow Trench Isolation Process Using Two Liners

CMP PROCESS FOR PROCESSING STI ON TWO DISTINCT SILICON PLANES

UNIQUE LDMOS PROCESS INTEGRATION

Methods and systems for capacitors

INTEGRATED CIRCUIT CAPACITOR HAVING ANTIREFLECTIVE DIELECTRIC

INTEGRATED CIRCUIT CAPACITOR HAVING ANTIREFLECTIVE DIELECTRIC

Method for manufacturing a semiconductor device having an alignment...

Method for selective plasma etch of an oxide layer

High precision integrated circuit capacitors