Bryan Black

Person

Spicewood, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with identification system
- Patent number 10,290,606
- Issue date May 14, 2019
- Advanced Micro Devices, Inc.
- Michael Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-operation generator for deriving a plurality of single-destin...
- Patent number 9,977,674
- Issue date May 22, 2018
- Intel Corporation
- Jeffrey P. Rupley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposer with beyond reticle field conductor pads
- Patent number 9,806,014
- Issue date Oct 31, 2017
- Advanced Micro Devices, Inc.
- Michael S. Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor workpiece with selective backside metallization
- Patent number 9,793,239
- Issue date Oct 17, 2017
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with thermal interface tape
- Patent number 9,627,281
- Issue date Apr 18, 2017
- Advanced Micro Device, Inc.
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 9,437,561
- Issue date Sep 6, 2016
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips with thermal management
- Patent number 9,385,055
- Issue date Jul 5, 2016
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with support structure
- Patent number 9,263,364
- Issue date Feb 16, 2016
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data bus inversion coding
- Patent number 8,909,840
- Issue date Dec 9, 2014
- Advanced Micro Devices, Inc.
- Aaron J. Nygren
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor chip device with polymeric filler trench
- Patent number 8,866,276
- Issue date Oct 21, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die processor
- Patent number 8,860,199
- Issue date Oct 14, 2014
- Intel Corporation
- Bryan P. Black
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor chip device with thermal management circuit b...
- Patent number 8,796,842
- Issue date Aug 5, 2014
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unified data masking, data poisoning, and data bus inversion signaling
- Patent number 8,726,139
- Issue date May 13, 2014
- Advanced Micro Devices, Inc.
- James O'Connor
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Thermal management of stacked semiconductor chips with electrically...
- Patent number 8,704,353
- Issue date Apr 22, 2014
- Advanced Micro Devices, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with underfill
- Patent number 8,691,626
- Issue date Apr 8, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with polymeric filler trench
- Patent number 8,617,926
- Issue date Dec 31, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with liquid thermal interface material
- Patent number 8,574,965
- Issue date Nov 5, 2013
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chip device with thermal management
- Patent number 8,472,190
- Issue date Jun 25, 2013
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die stacking, testing and packaging for yield
- Patent number 8,451,014
- Issue date May 28, 2013
- Advanced Micro Devices, Inc.
- Bryan Black
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing and assembling semiconductor chips with off...
- Patent number 8,394,672
- Issue date Mar 12, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reinforcing through-silicon-vias
- Patent number 8,338,961
- Issue date Dec 25, 2012
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reinforcing through-silicon-vias
- Patent number 8,193,039
- Issue date Jun 5, 2012
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for incorporating existing silicon die into 3D integrated stack
- Patent number 8,110,899
- Issue date Feb 7, 2012
- Intel Corporation
- Paul A. Reed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array on more than one die
- Patent number 8,059,441
- Issue date Nov 15, 2011
- Intel Corporation
- Mohammed H. Taufique
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermal interface material with support structure
- Patent number 8,034,662
- Issue date Oct 11, 2011
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prefetching from dynamic random access memory to a static random ac...
- Patent number 8,032,711
- Issue date Oct 4, 2011
- Intel Corporation
- Bryan Black
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Memory array on more than one die
- Patent number 7,692,946
- Issue date Apr 6, 2010
- Intel Corporation
- Mohammed H. Taufique
- G11 - INFORMATION STORAGE
Information Patent Grant
Efficient Bloom filter
- Patent number 7,620,781
- Issue date Nov 17, 2009
- Intel Corporation
- Mauricio Breternitz, Jr.
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...
- Publication number 20240337799
- Publication date Oct 10, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- G02 - OPTICS
Information Patent Application
Low-Equivalent-Series-Resistance Capacitors with Solid-State Curren...
- Publication number 20240258041
- Publication date Aug 1, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Prevention, Cessation, Detection, and Moni...
- Publication number 20240120293
- Publication date Apr 11, 2024
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Assembly and Method of Attaching Multi-Height Dies/Modules...
- Publication number 20230411174
- Publication date Dec 21, 2023
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductors Embedded in Package Substrate and Board and Method and Sy...
- Publication number 20230395305
- Publication date Dec 7, 2023
- Chipletz, Inc.
- Siddharth Ravichandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Package Vertical Interconnect and Method of Making Same
- Publication number 20230343687
- Publication date Oct 26, 2023
- Chipletz, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20230031099
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- BRYAN BLACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH BEYOND RETICLE FIELD CONDUCTOR PADS
- Publication number 20170213787
- Publication date Jul 27, 2017
- Michael S. Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CAPACITOR
- Publication number 20170092712
- Publication date Mar 30, 2017
- Joseph R. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WORKPIECE WITH SELECTIVE BACKSIDE METALLIZATION
- Publication number 20170092616
- Publication date Mar 30, 2017
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20160365335
- Publication date Dec 15, 2016
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH OFFLOADED LOGIC
- Publication number 20160329312
- Publication date Nov 10, 2016
- Sean M. O'Mullan
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH
- Publication number 20140103506
- Publication date Apr 17, 2014
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH IDENTIFICATION SYSTEM
- Publication number 20130341783
- Publication date Dec 26, 2013
- Michael Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE
- Publication number 20130342231
- Publication date Dec 26, 2013
- Michael Alfano
- G01 - MEASURING TESTING
Information Patent Application
THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY...
- Publication number 20130256872
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
- Publication number 20130256895
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMI...
- Publication number 20130256913
- Publication date Oct 3, 2013
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH OFFSET PADS
- Publication number 20130161814
- Publication date Jun 27, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA BUS INVERSION CODING
- Publication number 20130159584
- Publication date Jun 20, 2013
- Advanced Micro Devices, Inc.
- Aaron J. Nygren
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Unified Data Masking, Data Poisoning, and Data Bus Inversion Signaling
- Publication number 20130159818
- Publication date Jun 20, 2013
- Advanced Micro Devices, Inc.
- James O'Connor
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Interconnect Redundancy for Multi-Interconnect Device
- Publication number 20130159587
- Publication date Jun 20, 2013
- Aaron Nygren
- G11 - INFORMATION STORAGE
Information Patent Application
HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS
- Publication number 20130147028
- Publication date Jun 13, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MULTI-CHIP PROCESSING
- Publication number 20130141442
- Publication date Jun 6, 2013
- John W. Brothers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS
- Publication number 20120205791
- Publication date Aug 16, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL
- Publication number 20120098119
- Publication date Apr 26, 2012
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT
- Publication number 20120075807
- Publication date Mar 29, 2012
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS
- Publication number 20120074579
- Publication date Mar 29, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH
- Publication number 20120061852
- Publication date Mar 15, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20120061821
- Publication date Mar 15, 2012
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS

Bryan Black

Person

Patents Grantslast 30 patents

Semiconductor chip with redundant thru-silicon-vias

Semiconductor chip with redundant thru-silicon-vias

Interposer with identification system

Micro-operation generator for deriving a plurality of single-destin...

Interposer with beyond reticle field conductor pads

Semiconductor workpiece with selective backside metallization

Semiconductor chip with thermal interface tape

Semiconductor chip with redundant thru-silicon-vias

Stacked semiconductor chips with thermal management

Thermal interface material with support structure

Data bus inversion coding

Semiconductor chip device with polymeric filler trench

Multi-die processor

Stacked semiconductor chip device with thermal management circuit b...

Unified data masking, data poisoning, and data bus inversion signaling

Thermal management of stacked semiconductor chips with electrically...

Semiconductor chip device with underfill

Semiconductor chip device with polymeric filler trench

Semiconductor chip device with liquid thermal interface material

Stacked semiconductor chip device with thermal management

Die stacking, testing and packaging for yield

Method of manufacturing and assembling semiconductor chips with off...

Semiconductor chip with reinforcing through-silicon-vias

Semiconductor chip with reinforcing through-silicon-vias

Method for incorporating existing silicon die into 3D integrated stack

Memory array on more than one die

Thermal interface material with support structure

Prefetching from dynamic random access memory to a static random ac...

Memory array on more than one die

Efficient Bloom filter

Patents Applicationslast 30 patents

Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...

Low-Equivalent-Series-Resistance Capacitors with Solid-State Curren...

Method and Apparatus for Prevention, Cessation, Detection, and Moni...

Package Assembly and Method of Attaching Multi-Height Dies/Modules...

Inductors Embedded in Package Substrate and Board and Method and Sy...

Through Package Vertical Interconnect and Method of Making Same

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

INTERPOSER WITH BEYOND RETICLE FIELD CONDUCTOR PADS

VIA CAPACITOR

SEMICONDUCTOR WORKPIECE WITH SELECTIVE BACKSIDE METALLIZATION

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

SEMICONDUCTOR CHIP WITH OFFLOADED LOGIC

SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH

INTERPOSER WITH IDENTIFICATION SYSTEM

SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE

THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY...

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMI...

SEMICONDUCTOR CHIP WITH OFFSET PADS

DATA BUS INVERSION CODING

Unified Data Masking, Data Poisoning, and Data Bus Inversion Signaling

Interconnect Redundancy for Multi-Interconnect Device

HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS

METHOD AND APPARATUS FOR MULTI-CHIP PROCESSING

SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS

SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL

STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT

SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS

SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS