Chao Wen Shih

Person

Hsin-chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure and method for manufacturing the same
- Patent number 8,158,891
- Issue date Apr 17, 2012
- Unimicron Technology Corp.
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with identifiable information and method for fabricat...
- Patent number 8,070,932
- Issue date Dec 6, 2011
- Unimicron Technology Corp.
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate having electrically connecting structure
- Patent number 8,022,530
- Issue date Sep 20, 2011
- Unimicron Technology Corp.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and fabrication method thereof
- Patent number 7,964,801
- Issue date Jun 21, 2011
- Unimicron Technology Corp.
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 7,948,085
- Issue date May 24, 2011
- Unimicron Technology Corp.
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically connecting terminal structure of circuit board and man...
- Patent number 7,719,853
- Issue date May 18, 2010
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structures for electrically conductive pads of circuit b...
- Patent number 7,659,193
- Issue date Feb 9, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electrical conductive structure of circuit b...
- Patent number 7,553,750
- Issue date Jun 30, 2009
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for repairing circuit board having defective pre-soldering...
- Patent number 7,546,682
- Issue date Jun 16, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating circuit board having different electrical con...
- Patent number 7,419,897
- Issue date Sep 2, 2008
- Phoenix Precision Technology Corporation
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with identifiable information and method for fabricat...
- Patent number 7,365,272
- Issue date Apr 29, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating circuit board with conductive structure
- Patent number 7,350,298
- Issue date Apr 1, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating conductive bump of circuit board
- Patent number 7,341,934
- Issue date Mar 11, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating connection terminal of circuit board
- Patent number 7,174,630
- Issue date Feb 13, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electrical connection structure of circuit b...
- Patent number 7,151,050
- Issue date Dec 19, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Packaging substrate
- Publication number 20100096750
- Publication date Apr 22, 2010
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METH...
- Publication number 20090308652
- Publication date Dec 17, 2009
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING ELECTRICALLY CONNECTING STRUCTURE
- Publication number 20090146317
- Publication date Jun 11, 2009
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND FABRICATION METHOD THEREOF
- Publication number 20090090548
- Publication date Apr 9, 2009
- Phoenix Precision Technology Corporation
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board structure and method for manufacturing the same
- Publication number 20090065246
- Publication date Mar 12, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-chip substrate
- Publication number 20080230260
- Publication date Sep 25, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chao-Wen SHIH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20080174009
- Publication date Jul 24, 2008
- Phoenix Precision Technology Corporation
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD OF THE SAME
- Publication number 20080176035
- Publication date Jul 24, 2008
- Phoenix Precision Technology Corporation
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with identifiable information and method for fabricat...
- Publication number 20080166497
- Publication date Jul 10, 2008
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Repaired pre-soldering structure of circuit board and method thereof
- Publication number 20080083819
- Publication date Apr 10, 2008
- Shih-Ping Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for repairing metal finish layer on surface of electrical co...
- Publication number 20080083115
- Publication date Apr 10, 2008
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier board structure with semiconductor chip embedded therein
- Publication number 20080054443
- Publication date Mar 6, 2008
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Connecting Terminal Structure of Circuit Board and Man...
- Publication number 20080020602
- Publication date Jan 24, 2008
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CIRCUIT BOARD HAVING DIFFERENT ELECTRICAL CON...
- Publication number 20070281557
- Publication date Dec 6, 2007
- Phoenix Precision Technology Corporation
- Chao-Wen Shih
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR REPAIRING CONDUCTIVE STRUCTURE OF CIRCUIT BOARD
- Publication number 20070281503
- Publication date Dec 6, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING ELECTRICAL CONDUCTIVE STRUCTURE OF CIRCUIT B...
- Publication number 20070281389
- Publication date Dec 6, 2007
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REPAIRING ELECRICAL CIRCUIT OF CIRCUIT BOARD
- Publication number 20070274028
- Publication date Nov 29, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Fabricating Circuit Board with Conductive Structure
- Publication number 20070186412
- Publication date Aug 16, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive structures for electrically conductive pads of circuit b...
- Publication number 20070161223
- Publication date Jul 12, 2007
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball pad surface finish structure of circuit board and fabri...
- Publication number 20060252249
- Publication date Nov 9, 2006
- Shih-Ping Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Processing apparatus for electroplating conductive bumps on organic...
- Publication number 20060252247
- Publication date Nov 9, 2006
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating connection terminal of circuit board
- Publication number 20060090335
- Publication date May 4, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating electrical connection structure of circuit b...
- Publication number 20060079081
- Publication date Apr 13, 2006
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating conductive bump of circuit board
- Publication number 20060051952
- Publication date Mar 9, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with identifiable information and method for fabricat...
- Publication number 20050236176
- Publication date Oct 27, 2005
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chao Wen Shih

Person

Patents Grantslast 30 patents

Circuit board structure and method for manufacturing the same

Circuit board with identifiable information and method for fabricat...

Package substrate having electrically connecting structure

Circuit board structure and fabrication method thereof

Circuit board structure

Electrically connecting terminal structure of circuit board and man...

Conductive structures for electrically conductive pads of circuit b...

Method for fabricating electrical conductive structure of circuit b...

Methods for repairing circuit board having defective pre-soldering...

Method of fabricating circuit board having different electrical con...

Circuit board with identifiable information and method for fabricat...

Method for fabricating circuit board with conductive structure

Method for fabricating conductive bump of circuit board

Method for fabricating connection terminal of circuit board

Method for fabricating electrical connection structure of circuit b...

Patents Applicationslast 30 patents

Packaging substrate

PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METH...

PACKAGE SUBSTRATE HAVING ELECTRICALLY CONNECTING STRUCTURE

CIRCUIT BOARD AND FABRICATION METHOD THEREOF

Circuit board structure and method for manufacturing the same

Flip-chip substrate

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD OF THE SAME

Circuit board with identifiable information and method for fabricat...

Repaired pre-soldering structure of circuit board and method thereof

Method for repairing metal finish layer on surface of electrical co...

Carrier board structure with semiconductor chip embedded therein

Electrically Connecting Terminal Structure of Circuit Board and Man...

METHOD OF FABRICATING CIRCUIT BOARD HAVING DIFFERENT ELECTRICAL CON...

METHOD FOR REPAIRING CONDUCTIVE STRUCTURE OF CIRCUIT BOARD

METHOD FOR FABRICATING ELECTRICAL CONDUCTIVE STRUCTURE OF CIRCUIT B...

METHOD FOR REPAIRING ELECRICAL CIRCUIT OF CIRCUIT BOARD

Method for Fabricating Circuit Board with Conductive Structure

Conductive structures for electrically conductive pads of circuit b...

Solder ball pad surface finish structure of circuit board and fabri...

Processing apparatus for electroplating conductive bumps on organic...

Method for fabricating connection terminal of circuit board

Method for fabricating electrical connection structure of circuit b...

Method for fabricating conductive bump of circuit board

Circuit board with identifiable information and method for fabricat...