BRIEF DESCRIPTION OF DRAWINGS
The invention can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein:
FIGS. 1A-1C are flow schematic diagrams of repaired pre-solder structure of a circuit board and a method thereof according to the present invention; and
FIGS. 2A-2B are cross sectional views of a second embodiment of a repaired pre-solder structure of a circuit board and a method thereof according to the present invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
The following illustrative embodiments are provided to illustrate the disclosure of the present invention, these and other advantages and effects can be apparently understood by those in the art after reading the disclosure of this specification. The present invention can also be performed or applied by other different embodiments. The details of the specification may be on the basis of different points and applications, and numerous modifications and variations can be devised without departing from the spirit of the present invention.
A repaired pre-solder structure of a circuit board and a method for fabricating the repaired pre-solder structure of the present invention are applied to a fabricating process that pre-solders are already formed. In order to simplify the drawings and specification, a circuit board having a pre-solder fabricating process finished but a resist layer is not removed yet is described as an example in the following paragraphs.
FIGS. 1A-1C are flow schematic diagrams of repaired pre-solder structure for a circuit board and a method thereof of a first embodiment according to the present invention.
As shown in FIG. 1A, a circuit board 1 having a forepart fabricating cost finished is provided. The circuit board 1 comprises a plurality of electrical connection pads (or land) 10, 11 and 11′. An insulating protection layer 12 is formed on the circuit board 1. A plurality of openings 120 are formed in the insulating protection layer 12 for exposure of the electrical connection pads 10, 11 and 11′. A resist layer 13 is formed on the insulating protection layer 12. The resist layer 13 is not a material necessary to be covered on the insulating protection layer 12. A plurality of openings 130 are formed in the resist layer 13 and corresponding in position to the electrical connection pads 10, 11 and 11′ on the circuit board 1. A plurality of pre-solders 14 are formed on the electrical connection pads 10 in the openings 130. The electrical connection pads 11 and 11′ are covered without any pre-solders and covered with a defective pre-solder 140 shorter than a normal pre-solder respectively due to fabricating factors. The pre-solders 14 and 140 are tin bumps.
As shown in FIGS. 1B and 1C, a micro-droplet 2 is used to perform a chemical reaction of micro-deposition on the electrical connection pad 11, which is not covered with any pre-solders, to form a pre-solder 14a on the electrical connection pad 11, and form on the defective pre-solder 140 a repaired pre-solder 14a′, so as to repair the pre-solders 14a and 14a′ formed on the electrical connection pads 11 and 11′. The pre-solders 14a and 14a′ are one selected from the group consisting of lead, tin, silver, copper, gold, bismuth, antimony, zinc, nickel, zirconium, magnesium, indium, tellurium and gallium.
Please refer to FIG. 1C. The resist layer 13 is removed by a chemical divesting process.
Since the pre-solders 14a and 14a′ can be tin bumps, a reflow-soldering process can be performed on the tin bumps, under a temperature condition high enough to melt the pre-solders for attaching semiconductor chips or external electronic devices.
According to the above repaired method, the present invention further provides a repaired structure, which comprises a circuit board 1 having a plurality of electrical connection pads 10, 11 and 11′. An insulating protection layer 12 is formed on the circuit board 1. A plurality of openings 120 are formed on the insulating protection layer 12 for exposure of the electrical connection pads 10, 11 and 11′. A plurality of pre-solders 14 are formed on the electrical connection pad 10. The pre-solders 14 comprise at least a defective pre-solder 140 shorter than a normal pre-solder, a repaired pre-solder 14a formed on a top surface of the defective pre-solder 140 by a micro-droplet process, and an interface 15 formed between the defective pre-solder 140 and the repaired pre-solder 14a′.
FIGS. 2A-2B are cross sectional views of a second embodiment of a repaired pre-solder structure of a circuit board and a method thereof according to the present invention. Different from the first embodiment, the second embodiment provides a circuit board having drawbacks that the pre-solders have too large the size and a short circuit exists among the pre-solders.
As shown in FIG. 2A, a circuit board 1 as shown in FIG, 1A is provided. The electrical connection pads 10 and 11 are covered with a normal pre-solder 14 and at least too high a defective pre-solder 141 respectively, or a drawback of a bridge portion 142 is formed between two pre-solders 14. In other words, the two pre-solders are shorted.
Please refer to FIG. 2B. A chemical reaction of micro-droplet 2 is applied to the pre-solder 141 formed on the circuit board 1 to perform a micro etching process and remove the pre-solder 141. Therefore, a top portion of too high the detective pre-solder 141 is removed and the pre-solder 141 becomes normal. Further, the bridge portion 141 is removed. In result, two originally connected pre-solders 14 are separated and independent. Therefore, the pre-solder 141 is repaired to have a normal size and be the normal pre-solder 14. The resist layer 13 can then be further removed (not shown).
Compared with the prior art, the repaired pre-solder structure and a method thereof perform the micro deposition solder tin material on the electrical connection pads which are not covered with any pre-solders by using micro-droplets, so as to form repaired pre-solders and increase the manufacturing yield. The present invention performs a micro etching process on the pre-solders having a short circuit formed if the pre-solders are too high, to solve the drawbacks that the cost and manufacturing cycle time is increased resulting from the reworks on the circuit board.
The foregoing descriptions of the detailed embodiments are only illustrated to disclose the features and functions of the present invention and not restrictive of the scope of the present invention. It should be understood to those in the art that all modifications and variations according to the spirit and principle in the disclosure of the present invention should fall within the scope of the appended claims.
Patent Application
20080083819
