Charles David Paynter

Person

Encinitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising channel interconnects located between solder int...
- Patent number 12,243,855
- Issue date Mar 4, 2025
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package comprising integrated devices coupled through a metallizati...
- Patent number 11,784,157
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and a high-density interconnect inte...
- Patent number 11,605,594
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch substrate configured as a shield located over a cavity of a b...
- Patent number 11,452,246
- Issue date Sep 20, 2022
- QUALCOMM Incorporated
- Charles David Paynter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit (IC) module comprising an integrated circuit (IC...
- Patent number 10,321,575
- Issue date Jun 11, 2019
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered power structure in a power distribution network (PDN)
- Patent number 10,231,324
- Issue date Mar 12, 2019
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Toroid inductor with reduced electromagnetic field leakage
- Patent number 10,170,232
- Issue date Jan 1, 2019
- QUALCOMM Incorporated
- Yue Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor embedded in a package substrate
- Patent number 10,008,316
- Issue date Jun 26, 2018
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for routing die signals using external interco...
- Patent number 9,871,012
- Issue date Jan 16, 2018
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for shielding differential signal pin pairs
- Patent number 9,514,966
- Issue date Dec 6, 2016
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for thermal dissipation
- Patent number 9,484,281
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
- Patent number 9,263,186
- Issue date Feb 16, 2016
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) integrated device comprising a redistribut...
- Patent number 9,153,560
- Issue date Oct 6, 2015
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor module structure
- Patent number 9,041,176
- Issue date May 26, 2015
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME
- Publication number 20250069965
- Publication date Feb 27, 2025
- QUALCOMM Incorporated
- Ryan LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICES
- Publication number 20250062285
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...
- Publication number 20240107665
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES
- Publication number 20240038672
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Mahalingam NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACIT...
- Publication number 20240038831
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Ryan LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INT...
- Publication number 20230163113
- Publication date May 25, 2023
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...
- Publication number 20220392867
- Publication date Dec 8, 2022
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH SUBSTRATE CONFIGURED AS A SHIELD LOCATED OVER A CAVITY OF A...
- Publication number 20210307218
- Publication date Sep 30, 2021
- QUALCOMM Incorporated
- Charles David PAYNTER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...
- Publication number 20210296246
- Publication date Sep 23, 2021
- QUALCOMM Incorporated
- Ryan LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-EMBEDDED SUBSTRATE
- Publication number 20200020624
- Publication date Jan 16, 2020
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL TEST PADS FOR INLINE TEST ACCESS
- Publication number 20180315672
- Publication date Nov 1, 2018
- QUALCOMM Incorporated
- Amer Christophe CASSIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOROID INDUCTOR WITH REDUCED ELECTROMAGNETIC FIELD LEAKAGE
- Publication number 20170125152
- Publication date May 4, 2017
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC...
- Publication number 20170064837
- Publication date Mar 2, 2017
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THERMAL DISSIPATION
- Publication number 20160049349
- Publication date Feb 18, 2016
- QUALCOMM Incorporated
- Ryan David LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOM ORIENTATION OF SOCKET PINS TO ACHIEVE HIGH ISOLATION BETWEEN...
- Publication number 20150372425
- Publication date Dec 24, 2015
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED POWER STRUCTURE IN A POWER DISTRIBUTION NETWORK (PDN)
- Publication number 20150313006
- Publication date Oct 29, 2015
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR SHIELDING DIFFERENTIAL SIGNAL PIN PAIRS
- Publication number 20150294945
- Publication date Oct 15, 2015
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR EMBEDDED IN A PACKAGE SUBTRATE
- Publication number 20150279545
- Publication date Oct 1, 2015
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A REDISTRIBUT...
- Publication number 20150206854
- Publication date Jul 23, 2015
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR
- Publication number 20140252544
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR MODULE STRUCTURE
- Publication number 20140097512
- Publication date Apr 10, 2014
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCO...
- Publication number 20140061642
- Publication date Mar 6, 2014
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor Die Design for Small Form Factors
- Publication number 20100123215
- Publication date May 20, 2010
- QUALCOMM Incorporated
- Yuancheng Christopher Pan
- H01 - BASIC ELECTRIC ELEMENTS

Charles David Paynter

Person

Patents Grantslast 30 patents

Package comprising channel interconnects located between solder int...

Providing a lower inductance path in a routing substrate for a capa...

Package comprising integrated devices coupled through a metallizati...

Package comprising a substrate and a high-density interconnect inte...

Patch substrate configured as a shield located over a cavity of a b...

Integrated circuit (IC) module comprising an integrated circuit (IC...

Staggered power structure in a power distribution network (PDN)

Toroid inductor with reduced electromagnetic field leakage

Inductor embedded in a package substrate

Method and apparatus for routing die signals using external interco...

Apparatus and methods for shielding differential signal pin pairs

Systems and methods for thermal dissipation

DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor

Package on package (PoP) integrated device comprising a redistribut...

Hybrid semiconductor module structure

Patents Applicationslast 30 patents

PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME

STACKED INTEGRATED CIRCUIT DEVICES

PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...

PACKAGE COMPRISING INTEGRATED DEVICES

PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACIT...

PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INT...

PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...

PATCH SUBSTRATE CONFIGURED AS A SHIELD LOCATED OVER A CAVITY OF A...

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...

SUBSTRATE-EMBEDDED SUBSTRATE

SACRIFICIAL TEST PADS FOR INLINE TEST ACCESS

TOROID INDUCTOR WITH REDUCED ELECTROMAGNETIC FIELD LEAKAGE

INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC...

SYSTEMS AND METHODS FOR THERMAL DISSIPATION

CUSTOM ORIENTATION OF SOCKET PINS TO ACHIEVE HIGH ISOLATION BETWEEN...

STAGGERED POWER STRUCTURE IN A POWER DISTRIBUTION NETWORK (PDN)

APPARATUS AND METHODS FOR SHIELDING DIFFERENTIAL SIGNAL PIN PAIRS

INDUCTOR EMBEDDED IN A PACKAGE SUBTRATE

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A REDISTRIBUT...

DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR

HYBRID SEMICONDUCTOR MODULE STRUCTURE

METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCO...

Capacitor Die Design for Small Form Factors