Charles J. Hendricks

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ionization test for electrical verification
- Patent number 7,808,257
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Christopher W. Cline
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package repair process
- Patent number 7,294,909
- Issue date Nov 13, 2007
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for testing multi-chip integrated circuit modules
- Patent number 6,984,997
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Yuet-Ying Yu
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package repair process
- Patent number 6,916,670
- Issue date Jul 12, 2005
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect package cluster probe short removal apparatus and method
- Patent number 6,753,688
- Issue date Jun 22, 2004
- International Business Machines Corporation
- Roger M. Eddy
- G01 - MEASURING TESTING
Information Patent Grant
Interposer for maintaining temporary contact between a substrate an...
- Patent number 6,281,692
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Paul F. Bodenweber
- G01 - MEASURING TESTING
Information Patent Grant
Seed metal delete process for thin film repair solutions using dire...
- Patent number 6,235,544
- Issue date May 22, 2001
- International Business Machines Corporation
- Peter A. Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for testing circuit board integrity
- Patent number 6,054,863
- Issue date Apr 25, 2000
- International Business Machines Corporation
- Thomas Morrison
- G01 - MEASURING TESTING
Information Patent Grant
Mounting and/or removing of components using optical fiber tools
- Patent number 5,904,868
- Issue date May 18, 1999
- International Business Machines Corporation
- Laertis Economikos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma etching reactor with reduced plasma potential
- Patent number 4,600,464
- Issue date Jul 15, 1986
- International Business Machines Corporation
- Brian H. Desilets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single wafer plasma etch reactor
- Patent number 4,534,816
- Issue date Aug 13, 1985
- International Business Machines Corporation
- Lee Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified RIE chamber for uniform silicon etching
- Patent number 4,340,461
- Issue date Jul 20, 1982
- International Business Machines Corp.
- Charles J. Hendricks
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ionization test for electrical verification
- Publication number 20070108984
- Publication date May 17, 2007
- International Business Machines Corporation
- Christopher W. Cline
- G01 - MEASURING TESTING
Information Patent Application
Electronic package repair process
- Publication number 20050176255
- Publication date Aug 11, 2005
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system of testing complex MCM's
- Publication number 20050104608
- Publication date May 19, 2005
- International Business Machines Corporation
- Yuet-Ying Yu
- G01 - MEASURING TESTING
Information Patent Application
Electronic package repair process
- Publication number 20040148765
- Publication date Aug 5, 2004
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible conductive sheet
- Publication number 20020179320
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Yuet-Ying Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect package cluster probe short removal apparatus and method
- Publication number 20020145434
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Roger M. Eddy
- G01 - MEASURING TESTING

Charles J. Hendricks

Person

Patents Grantslast 30 patents

Ionization test for electrical verification

Electronic package repair process

Method and system for testing multi-chip integrated circuit modules

Electronic package repair process

Interconnect package cluster probe short removal apparatus and method

Interposer for maintaining temporary contact between a substrate an...

Seed metal delete process for thin film repair solutions using dire...

System for testing circuit board integrity

Mounting and/or removing of components using optical fiber tools

Plasma etching reactor with reduced plasma potential

Single wafer plasma etch reactor

Modified RIE chamber for uniform silicon etching

Patents Applicationslast 30 patents

Ionization test for electrical verification

Electronic package repair process

Method and system of testing complex MCM's

Electronic package repair process

Flexible conductive sheet

Interconnect package cluster probe short removal apparatus and method