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Charles W.C. Lin
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Patents Grants
last 30 patents
Information
Patent Grant
Leadframe substrate having modulator and crack inhibiting structure...
Patent number
11,291,146
Issue date
Mar 29, 2022
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect substrate with stiffener and warp balancer and semicon...
Patent number
10,804,205
Issue date
Oct 13, 2020
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of making wiring substrate for stackable semiconductor asse...
Patent number
10,546,808
Issue date
Jan 28, 2020
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Face-to-face semiconductor assembly having semiconductor device in...
Patent number
10,446,526
Issue date
Oct 15, 2019
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board having electrical isolator and moisture inhibiting cap...
Patent number
10,420,204
Issue date
Sep 17, 2019
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board having isolator and bridging element and method of mak...
Patent number
10,361,151
Issue date
Jul 23, 2019
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assembly with electromagnetic shielding and thermally...
Patent number
10,354,984
Issue date
Jul 16, 2019
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board with dual stiffeners and dual routing circuitries inte...
Patent number
10,306,777
Issue date
May 28, 2019
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board having component integrated with leadframe and method...
Patent number
10,269,722
Issue date
Apr 23, 2019
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate for stackable semiconductor assembly and stackable...
Patent number
10,242,964
Issue date
Mar 26, 2019
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board with embedded component and integrated stiffener, meth...
Patent number
10,217,710
Issue date
Feb 26, 2019
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect substrate having cavity for stackable semiconductor as...
Patent number
10,199,321
Issue date
Feb 5, 2019
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package semiconductor assembly having bottom device conf...
Patent number
10,177,090
Issue date
Jan 8, 2019
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assembly having anti-warping controller and vertical...
Patent number
10,177,130
Issue date
Jan 8, 2019
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced semiconductor assembly with three dimensional in...
Patent number
10,134,711
Issue date
Nov 20, 2018
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced face-to-face semiconductor assembly with built-i...
Patent number
10,121,768
Issue date
Nov 6, 2018
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Face-to-face semiconductor assembly having semiconductor device in...
Patent number
10,096,573
Issue date
Oct 9, 2018
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assembly with built-in stiffener and integrated dual...
Patent number
10,062,663
Issue date
Aug 28, 2018
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board with embedded component and integrated stiffener and m...
Patent number
9,947,625
Issue date
Apr 17, 2018
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of making stackable wiring board having electronic componen...
Patent number
9,913,385
Issue date
Mar 6, 2018
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect substrate having cavity for stackable semiconductor as...
Patent number
9,825,009
Issue date
Nov 21, 2017
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with package-on-package stacking capability a...
Patent number
9,640,518
Issue date
May 2, 2017
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced semiconductor assembly with heat spreader and in...
Patent number
9,570,372
Issue date
Feb 14, 2017
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with face-to-face chips on interposer and meth...
Patent number
9,349,711
Issue date
May 24, 2016
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with package-on-package stacking capability a...
Patent number
9,318,411
Issue date
Apr 19, 2016
BRODGE SEMICONDUCTOR CORPORATION
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assembly and method of manufacturing the same
Patent number
9,299,651
Issue date
Mar 29, 2016
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having chip embedded in heat spreader and elec...
Patent number
9,230,901
Issue date
Jan 5, 2016
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with package-on-package stacking capability a...
Patent number
9,209,154
Issue date
Dec 8, 2015
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect substrate with embedded semiconductor device and built...
Patent number
9,147,587
Issue date
Sep 29, 2015
Bridge Semiconductor Corporation
Charles W. C. Lin
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Semiconductor device with face-to-face chips on interposer and meth...
Patent number
9,147,667
Issue date
Sep 29, 2015
Bridge Semiconductor Corporation
Charles W. C. Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...
Publication number
20240363499
Publication date
Oct 31, 2024
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LEVEL STAGGERED TERMINAL STRUCTURE AND SEMICONDUCTOR PACKAGE...
Publication number
20240096780
Publication date
Mar 21, 2024
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLY HAVING DUAL CONDUCTION CHANNELS FOR ELECTRIC...
Publication number
20240063105
Publication date
Feb 22, 2024
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT SUBSTRATE HAVING BUFFER MATERIAL AND CRACK STOPPER AND...
Publication number
20210289678
Publication date
Sep 16, 2021
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED ASSEMBLY WITH METALLIC INTERFACIAL STRUCTURE BET...
Publication number
20200303280
Publication date
Sep 24, 2020
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SEMICONDUCTOR ASSEMBLY HAVING DUAL WIRING STRUCTURES AND WARP BALANCER
Publication number
20200146192
Publication date
May 7, 2020
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERCONNECT SUBSTRATE WITH ETCHING STOPPERS WITHIN CAVITY AND META...
Publication number
20200135630
Publication date
Apr 30, 2020
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...
Publication number
20200091116
Publication date
Mar 19, 2020
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD HAVING BRIDGING ELEMENT STRADDLING OVER INTERFACES
Publication number
20190333850
Publication date
Oct 31, 2019
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME SUBSTRATE HAVING MODULATOR AND CRACK INHIBITING STRUCTURE...
Publication number
20190182997
Publication date
Jun 13, 2019
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERCONNECT SUBSTRATE HAVING STRESS MODULATOR AND FLIP CHIP ASSEMB...
Publication number
20190090391
Publication date
Mar 21, 2019
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FACE-TO-FACE SEMICONDUCTOR ASSEMBLY HAVING SEMICONDUCTOR DEVICE IN...
Publication number
20190019778
Publication date
Jan 17, 2019
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
Publication number
20180374827
Publication date
Dec 27, 2018
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MAKING INTERCONNECT SUBSTRATE HAVING STRESS MODULATOR AN...
Publication number
20180359886
Publication date
Dec 13, 2018
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD HAVING COMPONENT INTEGRATED WITH LEADFRAME AND METHOD...
Publication number
20180204802
Publication date
Jul 19, 2018
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD WITH EMBEDDED COMPONENT AND INTEGRATED STIFFENER, METH...
Publication number
20180197818
Publication date
Jul 12, 2018
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...
Publication number
20180190622
Publication date
Jul 5, 2018
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING WIRING BOARD WITH INTERPOSER AND ELECTRONIC COMPON...
Publication number
20180166373
Publication date
Jun 14, 2018
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MAKING WIRING SUBSTRATE FOR STACKABLE SEMICONDUCTOR ASSE...
Publication number
20180158770
Publication date
Jun 7, 2018
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...
Publication number
20180146559
Publication date
May 24, 2018
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME SUBSTRATE WITH ELECTRONIC COMPONENT INCORPORATED THEREIN...
Publication number
20180130723
Publication date
May 10, 2018
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT SUBSTRATE HAVING CAVITY FOR STACKABLE SEMICONDUCOTR AS...
Publication number
20180040551
Publication date
Feb 8, 2018
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING INTERCONNECT SUBSTRATE HAVING ROUTING CIRCUITRY CO...
Publication number
20180040531
Publication date
Feb 8, 2018
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME SUBSTRATE WITH ISOLATOR INCORPORATED THEREIN AND SEMICOND...
Publication number
20170301617
Publication date
Oct 19, 2017
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD WITH ELECTRICAL ISOLATOR AND BASE BOARD INCORPORATED T...
Publication number
20170263546
Publication date
Sep 14, 2017
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...
Publication number
20170243803
Publication date
Aug 24, 2017
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...
Publication number
20170207200
Publication date
Jul 20, 2017
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...
Publication number
20170194300
Publication date
Jul 6, 2017
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLY HAVING ANTI-WARPING CONTROLLER AND VERTICAL...
Publication number
20170162556
Publication date
Jun 8, 2017
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...
Publication number
20170133352
Publication date
May 11, 2017
Bridge Semiconductor Corporation
Charles W.C. LIN
H01 - BASIC ELECTRIC ELEMENTS