Chengjie Zuo

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High performance inductors
- Patent number 11,024,454
- Issue date Jun 1, 2021
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid passive-on-glass (POG) acoustic filter
- Patent number 10,944,379
- Issue date Mar 9, 2021
- QUALCOMM Incorporated
- David Francis Berdy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Passive-on-glass (POG) device and method
- Patent number 10,607,980
- Issue date Mar 31, 2020
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D pillar inductor
- Patent number 10,553,671
- Issue date Feb 4, 2020
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate including passive-on-glass device and semiconductor...
- Patent number 10,523,253
- Issue date Dec 31, 2019
- QUALCOMM Incorporated
- Changhan Yun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated device comprising a capacitor and inductor structure com...
- Patent number 10,498,307
- Issue date Dec 3, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-dimensional structure to form an embedded three-dimensional str...
- Patent number 10,490,348
- Issue date Nov 26, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array (LGA) packaging of passive-on-glass (POG) structure
- Patent number 10,361,149
- Issue date Jul 23, 2019
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varying thickness inductor
- Patent number 10,354,795
- Issue date Jul 16, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solenoid inductor
- Patent number 10,332,671
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside drill embedded die substrate
- Patent number 10,325,855
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly and method of making same
- Patent number 10,319,694
- Issue date Jun 11, 2019
- QUALCOMM Incorporated
- Daniel Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising switches and filters
- Patent number 10,312,193
- Issue date Jun 4, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising an embedded inductor and a thin film magnetic...
- Patent number 10,290,414
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Skewed co-spiral inductor structure
- Patent number 10,283,257
- Issue date May 7, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic integration of antenna switch and diplexer
- Patent number 10,256,863
- Issue date Apr 9, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stacked substrate inductor
- Patent number 10,249,580
- Issue date Apr 2, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartment shielding in flip-chip (FC) module
- Patent number 10,242,957
- Issue date Mar 26, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable matching network
- Patent number 10,187,031
- Issue date Jan 22, 2019
- QUALCOMM Incorporated
- Yunfei Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
RF multiplexer with integrated directional couplers
- Patent number 10,171,112
- Issue date Jan 1, 2019
- QUALCOMM Incorporated
- Yunfei Ma
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Interposer device including at least one transistor and at least on...
- Patent number 10,163,771
- Issue date Dec 25, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive device assembly for accurate ground plane control
- Patent number 10,154,591
- Issue date Dec 11, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-density MIM capacitor for improved passive on glass (POG) mul...
- Patent number 10,141,908
- Issue date Nov 27, 2018
- QUALCOMM Incorporated
- Niranjan Sunil Mudakatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive components implemented on a plurality of stacked insulators
- Patent number 10,141,353
- Issue date Nov 27, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Double-sided circuit
- Patent number 10,103,703
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside ground plane for integrated circuit
- Patent number 10,103,135
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Open-passivation ball grid array pads
- Patent number 10,103,116
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package (WLP) ball support using cavity structure
- Patent number 10,074,625
- Issue date Sep 11, 2018
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of acoustic resonator devices
- Patent number 10,069,474
- Issue date Sep 4, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Nested through glass via transformer
- Patent number 10,049,815
- Issue date Aug 14, 2018
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE COMPRISING A CAPACITOR AND INDUCTOR STRUCTURE COM...
- Publication number 20190081607
- Publication date Mar 14, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED CIRCUIT WAFERS
- Publication number 20190035621
- Publication date Jan 31, 2019
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...
- Publication number 20180316374
- Publication date Nov 1, 2018
- Qualcomm Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL
- Publication number 20180177052
- Publication date Jun 21, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PASSIVE-ON-GLASS (POG) ACOUSTIC FILTER
- Publication number 20180167054
- Publication date Jun 14, 2018
- QUALCOMM Incorporated
- David Francis Berdy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PASSIVE-ON-GLASS (POG) DEVICE AND METHOD
- Publication number 20180145062
- Publication date May 24, 2018
- Qualcomm Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE GROUND PLANE FOR INTEGRATED CIRCUIT
- Publication number 20180090475
- Publication date Mar 29, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE MULTIPLEXER CIRCUIT LAYOUT
- Publication number 20180083589
- Publication date Mar 22, 2018
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRODE WRAP-AROUND CAPACITORS FOR RADIO FREQUENCY (RF) APPLICATIONS
- Publication number 20180083588
- Publication date Mar 22, 2018
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVES IN THIN FILM
- Publication number 20180077803
- Publication date Mar 15, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PROFILE PASSIVE ON GLASS (PoG) DEVICE COMPRISING A DIE
- Publication number 20180061775
- Publication date Mar 1, 2018
- QUALCOMM Incorporated
- Mario Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-CHIP MULTI-FREQUENCY FILM BULK ACOUSTIC-WAVE RESONATORS
- Publication number 20180062617
- Publication date Mar 1, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DENSITY MIM CAPACITOR FOR IMPROVED PASSIVE ON GLASS (POG) MUL...
- Publication number 20180054177
- Publication date Feb 22, 2018
- QUALCOMM Incorporated
- Niranjan Sunil Mudakatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY (LGA) PACKAGING OF PASSIVE-ON-GLASS (POG) STRUCTURE
- Publication number 20180047660
- Publication date Feb 15, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SWITCHES AND FILTERS
- Publication number 20180047673
- Publication date Feb 15, 2018
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD OF MAKING SAME
- Publication number 20180047687
- Publication date Feb 15, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER DEVICE INCLUDING AT LEAST ONE TRANSISTOR AND AT LEAST ON...
- Publication number 20180040547
- Publication date Feb 8, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...
- Publication number 20180026666
- Publication date Jan 25, 2018
- QUALCOMM Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE KERF PROBING OF PASSIVE DEVICES
- Publication number 20170372975
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL STRUCTURE TO FORM AN EMBEDDED THREE-DIMENSIONAL STR...
- Publication number 20170372831
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Mario Francisco VELEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED SIDE-WALL AND LGA ASSEMBLY
- Publication number 20170372989
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE INDUCTOR
- Publication number 20170373025
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A SUBSTRATE THAT INCLUDES AN IRRADIATED PORTION O...
- Publication number 20170365570
- Publication date Dec 21, 2017
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED CIRCUIT
- Publication number 20170338788
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE COMPONENTS IMPLEMENTED ON A PLURALITY OF STACKED INSULATORS
- Publication number 20170338255
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH 3D WIREWOUND INDUCTOR INTEGRATED WITHIN A SUBSTRATE
- Publication number 20170338034
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE MATCHING NETWORK
- Publication number 20170331445
- Publication date Nov 16, 2017
- QUALCOMM Incorporated
- Yunfei Ma
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LC FILTER LAYER STACKING BY LAYER TRANSFER TO MAKE 3D MULTIPLEXER S...
- Publication number 20170288707
- Publication date Oct 5, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RF MULTIPLEXER WITH INTEGRATED DIRECTIONAL COUPLERS
- Publication number 20170279469
- Publication date Sep 28, 2017
- QUALCOMM Incorporated
- Yunfei Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL
- Publication number 20170280562
- Publication date Sep 28, 2017
- QUALCOMM Incorporated
- Chengjie Zuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chengjie Zuo

Person

Patents Grantslast 30 patents

High performance inductors

Hybrid passive-on-glass (POG) acoustic filter

Passive-on-glass (POG) device and method

3D pillar inductor

Glass substrate including passive-on-glass device and semiconductor...

Integrated device comprising a capacitor and inductor structure com...

Two-dimensional structure to form an embedded three-dimensional str...

Land grid array (LGA) packaging of passive-on-glass (POG) structure

Varying thickness inductor

Solenoid inductor

Backside drill embedded die substrate

Semiconductor assembly and method of making same

Package comprising switches and filters

Substrate comprising an embedded inductor and a thin film magnetic...

Skewed co-spiral inductor structure

Monolithic integration of antenna switch and diplexer

Stacked substrate inductor

Compartment shielding in flip-chip (FC) module

Tunable matching network

RF multiplexer with integrated directional couplers

Interposer device including at least one transistor and at least on...

Passive device assembly for accurate ground plane control

Multi-density MIM capacitor for improved passive on glass (POG) mul...

Passive components implemented on a plurality of stacked insulators

Double-sided circuit

Backside ground plane for integrated circuit

Open-passivation ball grid array pads

Wafer level package (WLP) ball support using cavity structure

Encapsulation of acoustic resonator devices

Nested through glass via transformer

Patents Applicationslast 30 patents

INTEGRATED DEVICE COMPRISING A CAPACITOR AND INDUCTOR STRUCTURE COM...

SHAPED CIRCUIT WAFERS

GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...

PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL

HYBRID PASSIVE-ON-GLASS (POG) ACOUSTIC FILTER

PASSIVE-ON-GLASS (POG) DEVICE AND METHOD

BACKSIDE GROUND PLANE FOR INTEGRATED CIRCUIT

FACE-TO-FACE MULTIPLEXER CIRCUIT LAYOUT

ELECTRODE WRAP-AROUND CAPACITORS FOR RADIO FREQUENCY (RF) APPLICATIONS

PASSIVES IN THIN FILM

LOW PROFILE PASSIVE ON GLASS (PoG) DEVICE COMPRISING A DIE

SINGLE-CHIP MULTI-FREQUENCY FILM BULK ACOUSTIC-WAVE RESONATORS

MULTI-DENSITY MIM CAPACITOR FOR IMPROVED PASSIVE ON GLASS (POG) MUL...

LAND GRID ARRAY (LGA) PACKAGING OF PASSIVE-ON-GLASS (POG) STRUCTURE

PACKAGE COMPRISING SWITCHES AND FILTERS

SEMICONDUCTOR ASSEMBLY AND METHOD OF MAKING SAME

INTERPOSER DEVICE INCLUDING AT LEAST ONE TRANSISTOR AND AT LEAST ON...

GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...

INLINE KERF PROBING OF PASSIVE DEVICES

TWO-DIMENSIONAL STRUCTURE TO FORM AN EMBEDDED THREE-DIMENSIONAL STR...

EXPOSED SIDE-WALL AND LGA ASSEMBLY

STACKED SUBSTRATE INDUCTOR

DEVICE COMPRISING A SUBSTRATE THAT INCLUDES AN IRRADIATED PORTION O...

DOUBLE-SIDED CIRCUIT

PASSIVE COMPONENTS IMPLEMENTED ON A PLURALITY OF STACKED INSULATORS

APPARATUS WITH 3D WIREWOUND INDUCTOR INTEGRATED WITHIN A SUBSTRATE

TUNABLE MATCHING NETWORK

LC FILTER LAYER STACKING BY LAYER TRANSFER TO MAKE 3D MULTIPLEXER S...

RF MULTIPLEXER WITH INTEGRATED DIRECTIONAL COUPLERS

PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL