Chia-Mei Peng

Person

Pingchun City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package structure and method of manufacturing th...
- Patent number 11,824,012
- Issue date Nov 21, 2023
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and manufacturing method thereof
- Patent number 11,764,120
- Issue date Sep 19, 2023
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,710,690
- Issue date Jul 25, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,612
- Issue date Jun 20, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,665,832
- Issue date May 30, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,516,910
- Issue date Nov 29, 2022
- Unimicron Technology Corp.
- Chia-Yu Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-band broadband antenna with mal-position feed structure
- Patent number 8,836,599
- Issue date Sep 16, 2014
- Chia-Mei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quasi-balanced fed antenna structure for reducing SAR and HAC
- Patent number 8,587,484
- Issue date Nov 19, 2013
- Chia-Mei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-frequency antenna with single layer and feeding point
- Patent number 6,870,506
- Issue date Mar 22, 2005
- Auden Techno Corp.
- I-Fong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
U-shaped multi-frequency antenna of high efficiency
- Patent number 6,850,199
- Issue date Feb 1, 2005
- Auden Techno Corp.
- I-Fong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dipole antenna array
- Patent number 6,809,699
- Issue date Oct 26, 2004
- Auden Techno Corp.
- I-Fong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138059
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE
- Publication number 20240014145
- Publication date Jan 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING DEVICE AND ETCHING METHOD
- Publication number 20230335419
- Publication date Oct 19, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220344248
- Publication date Oct 27, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336333
- Publication date Oct 20, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20220328387
- Publication date Oct 13, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220256717
- Publication date Aug 11, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220208630
- Publication date Jun 30, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220069489
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20220068832
- Publication date Mar 3, 2022
- UNIMICRON TECHNOLOGY CORPORATION
- KAI-MING YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BAND BROADBAND ANNTENNA WITH MAL-POSITION FEED STRUCTURE
- Publication number 20130234895
- Publication date Sep 12, 2013
- Chia-Mei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-BALANCED FED ANTENNA STRUCTURE FOR REDUCING SAR AND HAC
- Publication number 20130069830
- Publication date Mar 21, 2013
- I-Fong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
U-shaped multi-frequency antenna of high efficiency
- Publication number 20040252056
- Publication date Dec 16, 2004
- AUDEN TECHNO CORP.
- I-Fong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-frequency antenna with single layer and feeding point
- Publication number 20040246179
- Publication date Dec 9, 2004
- AUDEN TECHNO CORP.
- I-Fong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dipole antenna array
- Publication number 20040145532
- Publication date Jul 29, 2004
- AUDEN TECHNO CORP.
- I-Fong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Chia-Mei Peng

Person

Patents Grantslast 30 patents

Circuit board structure and manufacturing method thereof

Integrated circuit package structure and method of manufacturing th...

Chip packaging structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Multi-band broadband antenna with mal-position feed structure

Quasi-balanced fed antenna structure for reducing SAR and HAC

Multi-frequency antenna with single layer and feeding point

U-shaped multi-frequency antenna of high efficiency

Dipole antenna array

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE STRUCTURE

ETCHING DEVICE AND ETCHING METHOD

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

MULTI-BAND BROADBAND ANNTENNA WITH MAL-POSITION FEED STRUCTURE

QUASI-BALANCED FED ANTENNA STRUCTURE FOR REDUCING SAR AND HAC

U-shaped multi-frequency antenna of high efficiency

Multi-frequency antenna with single layer and feeding point

Dipole antenna array