Chian-Chi Lin

Person

Kaoshiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 8,288,853
- Issue date Oct 16, 2012
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical microphone packaging system
- Patent number 7,945,062
- Issue date May 17, 2011
- Advanced Semiconductor Engineering, Inc.
- Wei-Chung Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip package manufacturing method and structure thereof
- Patent number 7,790,505
- Issue date Sep 7, 2010
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,741,152
- Issue date Jun 22, 2010
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,642,132
- Issue date Jan 5, 2010
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding method for wire-bonding apparatus
- Patent number 7,581,666
- Issue date Sep 1, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-stage die-bonding method for simultaneous die-bonding of multip...
- Patent number 7,547,575
- Issue date Jun 16, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,528,053
- Issue date May 5, 2009
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,446,404
- Issue date Nov 4, 2008
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and manufacturing method thereof
- Patent number 7,445,944
- Issue date Nov 4, 2008
- ASE (Shanghai) Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level bumping process
- Patent number 7,223,683
- Issue date May 29, 2007
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chips module package and manufacturing method thereof
- Patent number 7,221,041
- Issue date May 22, 2007
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chips bumpless assembly package and manufacturing method thereof
- Patent number 7,045,391
- Issue date May 16, 2006
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhance MCM package and manufacturing method thereof
- Patent number 7,002,805
- Issue date Feb 21, 2006
- Advanced Semiconductor Engineering Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Three-Dimensional Package and Method of Making the Same
- Publication number 20100052136
- Publication date Mar 4, 2010
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrate and manufacturing method thereof
- Publication number 20080124836
- Publication date May 29, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method for wire-bonding apparatus
- Publication number 20080102539
- Publication date May 1, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE MANUFACTURING METHOD AND STRUCTURE THEREOF
- Publication number 20080096321
- Publication date Apr 24, 2008
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDER AND DIE BONDING METHOD THEREOF
- Publication number 20080085571
- Publication date Apr 10, 2008
- Advanced Semiconductor Engeneering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrate and method of manufacturing the same
- Publication number 20080044931
- Publication date Feb 21, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-bonding apparatus and wire-bonding method thereof
- Publication number 20080035706
- Publication date Feb 14, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectromechanical microphone packaging system
- Publication number 20070205499
- Publication date Sep 6, 2007
- Wei-Chung Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multi-chips module package and manufacturing method thereof
- Publication number 20070176269
- Publication date Aug 2, 2007
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172986
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172983
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172982
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172984
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package structure
- Publication number 20070090507
- Publication date Apr 26, 2007
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package structure
- Publication number 20070090508
- Publication date Apr 26, 2007
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chips bumpless assembly package and manufacturing method thereof
- Publication number 20050121765
- Publication date Jun 9, 2005
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chips module package and manufacturing method thereof
- Publication number 20050023667
- Publication date Feb 3, 2005
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process
- Publication number 20050009317
- Publication date Jan 13, 2005
- Advanced Semiconductor Engineering, Inc.
- Chian-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhance MCM package and manufacturing method thereof
- Publication number 20040150102
- Publication date Aug 5, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhance MCM package
- Publication number 20040124512
- Publication date Jul 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with thermal enhance film and manufacturing m...
- Publication number 20040065964
- Publication date Apr 8, 2004
- Advanced Semiconductor Engineering, Inc.
- Chun-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS

Chian-Chi Lin

Person

Patents Grantslast 30 patents

Three-dimensional package and method of making the same

Microelectromechanical microphone packaging system

Semiconductor chip package manufacturing method and structure thereof

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Wire-bonding method for wire-bonding apparatus

Two-stage die-bonding method for simultaneous die-bonding of multip...

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Packaging substrate and manufacturing method thereof

Wafer level bumping process

Multi-chips module package and manufacturing method thereof

Multi-chips bumpless assembly package and manufacturing method thereof

Thermal enhance MCM package and manufacturing method thereof

Patents Applicationslast 30 patents

Three-Dimensional Package and Method of Making the Same

Packaging substrate and manufacturing method thereof

Wire-bonding method for wire-bonding apparatus

SEMICONDUCTOR CHIP PACKAGE MANUFACTURING METHOD AND STRUCTURE THEREOF

DIE BONDER AND DIE BONDING METHOD THEREOF

Packaging substrate and method of manufacturing the same

Wire-bonding apparatus and wire-bonding method thereof

Microelectromechanical microphone packaging system

Multi-chips module package and manufacturing method thereof

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Multi-chip package structure

Multi-chip package structure

Multi-chips bumpless assembly package and manufacturing method thereof

Multi-chips module package and manufacturing method thereof

Bumping process

Thermal enhance MCM package and manufacturing method thereof

Thermal enhance MCM package

Semiconductor package with thermal enhance film and manufacturing m...