Chuichi Miyazaki

Person

Akishima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 10,002,808
- Issue date Jun 19, 2018
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with modified regions for dividing the chip
- Patent number 9,070,560
- Issue date Jun 30, 2015
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device...
- Patent number 8,883,566
- Issue date Nov 11, 2014
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method using laser irradiation a...
- Patent number 8,772,135
- Issue date Jul 8, 2014
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device...
- Patent number 8,729,698
- Issue date May 20, 2014
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,546,244
- Issue date Oct 1, 2013
- Renesas Electronics Corporation
- Yoshiyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,518,744
- Issue date Aug 27, 2013
- Renesas Electronics Corporation
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer and manufacturing method...
- Patent number 8,378,459
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Yasuhiro Naka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method comprising a metal patter...
- Patent number 8,084,334
- Issue date Dec 27, 2011
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,923,292
- Issue date Apr 12, 2011
- Renesas Electronics Corporation
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method comprising a metal patter...
- Patent number 7,892,949
- Issue date Feb 22, 2011
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,795,741
- Issue date Sep 14, 2010
- Renesas Technology Corp.
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,759,224
- Issue date Jul 20, 2010
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method
- Patent number 7,737,001
- Issue date Jun 15, 2010
- Renesas Technology Corp.
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 7,514,294
- Issue date Apr 7, 2009
- Renesas Technology Corp.
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,452,787
- Issue date Nov 18, 2008
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,420,284
- Issue date Sep 2, 2008
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 7,265,035
- Issue date Sep 4, 2007
- Renesas Technology Corp.
- Hiroshi Honma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film semiconductor device and a method...
- Patent number 7,202,570
- Issue date Apr 10, 2007
- Renesas Technology Corp.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,148,081
- Issue date Dec 12, 2006
- Renesas Technology Corp.
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,091,620
- Issue date Aug 15, 2006
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring tape for semiconductor device including a buffer layer havin...
- Patent number 7,038,325
- Issue date May 2, 2006
- Hitachi Cable, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,916,686
- Issue date Jul 12, 2005
- Renesas Technology Corporation
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,791,194
- Issue date Sep 14, 2004
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,670,215
- Issue date Dec 30, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ball grid array type semiconductor package
- Patent number 6,664,135
- Issue date Dec 16, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device by monolithically fo...
- Patent number 6,645,794
- Issue date Nov 11, 2003
- Hitachi, Ltd.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,642,083
- Issue date Nov 4, 2003
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,639,323
- Issue date Oct 28, 2003
- Hitachi, Ltd.
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,521,981
- Issue date Feb 18, 2003
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20180277456
- Publication date Sep 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20170092554
- Publication date Mar 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20150235973
- Publication date Aug 20, 2015
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki ABE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140252643
- Publication date Sep 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20140220740
- Publication date Aug 7, 2014
- Rohm Co., Ltd.
- Tadahiro MORIFUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20130143359
- Publication date Jun 6, 2013
- RENESAS ELECTRONICS CORPORATION
- Tomoko HIGASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120184068
- Publication date Jul 19, 2012
- Renesas Electronics Corporation
- Yoshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120077332
- Publication date Mar 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110159641
- Publication date Jun 30, 2011
- Renesas Electronics Corporation
- Takashi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING A METAL PATTER...
- Publication number 20110124180
- Publication date May 26, 2011
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20110074017
- Publication date Mar 31, 2011
- Rohm Co., Ltd.
- Tadahiro MORIFUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100311205
- Publication date Dec 9, 2010
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD...
- Publication number 20100308442
- Publication date Dec 9, 2010
- RENESAS ELECTRONICS CORPORATION
- Yasuhiro NAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20100213594
- Publication date Aug 26, 2010
- Renesas Technology Corp.
- Tomoko HIGASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20090191667
- Publication date Jul 30, 2009
- Renesas Technology Corp.
- Tomoko HIGASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR
- Publication number 20090121337
- Publication date May 14, 2009
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Method of Semiconductor Integrated Circuit Device
- Publication number 20080318362
- Publication date Dec 25, 2008
- Chuichi Miyazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Fabrication Method of Semiconductor Integrated Circuit Device
- Publication number 20080286948
- Publication date Nov 20, 2008
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080251897
- Publication date Oct 16, 2008
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20070141752
- Publication date Jun 21, 2007
- Yoshiyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070114672
- Publication date May 24, 2007
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor manufacturing method
- Publication number 20070066044
- Publication date Mar 22, 2007
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and a manufacturing method of the same
- Publication number 20070037321
- Publication date Feb 15, 2007
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060261494
- Publication date Nov 23, 2006
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a semiconductor device
- Publication number 20050260829
- Publication date Nov 24, 2005
- Toshihide Uematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing metthod thereof
- Publication number 20050212142
- Publication date Sep 29, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050200019
- Publication date Sep 15, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20050142815
- Publication date Jun 30, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20040241907
- Publication date Dec 2, 2004
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film semiconductor device and a method...
- Publication number 20040224149
- Publication date Nov 11, 2004
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS

Chuichi Miyazaki

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method and semiconductor device

Semiconductor chip with modified regions for dividing the chip

Method of manufacturing semiconductor device, semiconductor device...

Semiconductor device manufacturing method using laser irradiation a...

Method of manufacturing semiconductor device, semiconductor device...

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device, semiconductor wafer and manufacturing method...

Semiconductor device manufacturing method comprising a metal patter...

Semiconductor device

Semiconductor device manufacturing method comprising a metal patter...

Semiconductor device

Fabrication method of semiconductor integrated circuit device

Semiconductor manufacturing method

Semiconductor device and a manufacturing method of the same

Fabrication method of semiconductor integrated circuit device

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacturing method

Circuit tape having adhesive film semiconductor device and a method...

Method of manufacturing a semiconductor device

Semiconductor device and manufacturing method thereof

Wiring tape for semiconductor device including a buffer layer havin...

Method of manufacturing a semiconductor device

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device and manufacturing method thereof

Method of manufacturing a ball grid array type semiconductor package

Method of manufacturing a semiconductor device by monolithically fo...

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING A METAL PATTER...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR

Manufacturing Method of Semiconductor Integrated Circuit Device

Fabrication Method of Semiconductor Integrated Circuit Device

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Semiconductor device and method of manufacturing the same

Semiconductor manufacturing method

Semiconductor device and a manufacturing method of the same

Semiconductor device and manufacturing method thereof

Manufacturing method of a semiconductor device

Semiconductor device and manufacturing metthod thereof

Semiconductor device and manufacturing method thereof

Fabrication method of semiconductor integrated circuit device

Method of manufacturing a semiconductor device

Circuit tape having adhesive film semiconductor device and a method...