Chung Wen Ho

Person

Monte Sereno, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bare die carrier
- Patent number 6,937,044
- Issue date Aug 30, 2005
- Kulicke and Soffa Industries, Inc.
- Fariborz Agahdel
- G01 - MEASURING TESTING
Information Patent Grant
Low cost decal material used for packaging
- Patent number 6,586,846
- Issue date Jul 1, 2003
- Thin Film Module, Inc.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density cavity-up wire bond BGA
- Patent number 6,455,926
- Issue date Sep 24, 2002
- Thin Film Module, Inc.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to make a tall solder ball by placing a eutectic solder bal...
- Patent number 6,424,037
- Issue date Jul 23, 2002
- Aptos Corporation
- Chung W Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density flip chip BGA
- Patent number 6,331,447
- Issue date Dec 18, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quick turn around fabrication process for packaging substrates and...
- Patent number 6,320,256
- Issue date Nov 20, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost high density thin film processing
- Patent number 6,294,477
- Issue date Sep 25, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost decal material used for packaging
- Patent number 6,287,890
- Issue date Sep 11, 2001
- Thin Film Module, Inc.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to make a tall solder ball by placing a eutectic solder bal...
- Patent number 6,281,041
- Issue date Aug 28, 2001
- Aptos Corporation
- Chung W Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BGA package for high density cavity-up wire bond device connections...
- Patent number 6,277,672
- Issue date Aug 21, 2001
- Thin Film Module, Inc.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density wire bond BGA
- Patent number 6,242,279
- Issue date Jun 5, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density flip chip BGA
- Patent number 6,221,693
- Issue date Apr 24, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quick turn around fabrication process for packaging substrates and...
- Patent number 6,197,614
- Issue date Mar 6, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die carrier
- Patent number 6,049,215
- Issue date Apr 11, 2000
- Kulicke & Soffa Ind. Inc.
- Fariborz Agahdel
- G01 - MEASURING TESTING
Information Patent Grant
Packaging and interconnect system for integrated circuits
- Patent number 5,998,859
- Issue date Dec 7, 1999
- Micromodule Systems, Inc.
- Bradley L. Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging and interconnect system for integrated circuits
- Patent number 5,796,164
- Issue date Aug 18, 1998
- Micromodule Systems, Inc.
- Mark T. McGraw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density, high speed, semiconductor interconnect using-multilay...
- Patent number 5,508,558
- Issue date Apr 16, 1996
- Digital Equipment Corporation
- William C. Robinette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing semiconductor chips with reusable test package
- Patent number 5,456,404
- Issue date Oct 10, 1995
- Digital Equipment Corporation
- William C. Robinette
- G01 - MEASURING TESTING
Information Patent Grant
Packaging and interconnect system for integrated circuits
- Patent number 5,422,514
- Issue date Jun 6, 1995
- Micromodule Systems, Inc.
- Bradley L. Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die carrier
- Patent number 5,402,077
- Issue date Mar 28, 1995
- Micromodule Systems, Inc.
- Fariborz Agahdel
- G01 - MEASURING TESTING
Information Patent Grant
Package for multiple removable integrated circuits
- Patent number 5,267,867
- Issue date Dec 7, 1993
- Digital Equipment Corporation
- Fariborz Agahdel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a multilevel interconnection device
- Patent number 4,812,191
- Issue date Mar 14, 1989
- Digital Equipment Corporation
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process to make a tall solder ball by placing a eutectic solder bal...
- Publication number 20020025599
- Publication date Feb 28, 2002
- Aptos Corporation
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density cavity-up wire bond BGA
- Publication number 20010046725
- Publication date Nov 29, 2001
- THIN FILM MODULE, INC.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low cost decal material used for packaging
- Publication number 20010016370
- Publication date Aug 23, 2001
- THIN FILM MODULE, INC.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS

Chung Wen Ho

Person

Patents Grantslast 30 patents

Bare die carrier

Low cost decal material used for packaging

High density cavity-up wire bond BGA

Process to make a tall solder ball by placing a eutectic solder bal...

High density flip chip BGA

Quick turn around fabrication process for packaging substrates and...

Low cost high density thin film processing

Low cost decal material used for packaging

Process to make a tall solder ball by placing a eutectic solder bal...

BGA package for high density cavity-up wire bond device connections...

High density wire bond BGA

High density flip chip BGA

Quick turn around fabrication process for packaging substrates and...

Bare die carrier

Packaging and interconnect system for integrated circuits

Packaging and interconnect system for integrated circuits

High density, high speed, semiconductor interconnect using-multilay...

Method of testing semiconductor chips with reusable test package

Packaging and interconnect system for integrated circuits

Bare die carrier

Package for multiple removable integrated circuits

Method of forming a multilevel interconnection device

Patents Applicationslast 30 patents

Process to make a tall solder ball by placing a eutectic solder bal...

High density cavity-up wire bond BGA

Low cost decal material used for packaging