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Dario S. Filoteo JR.
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Chip scale module package in BGA semiconductor package
Patent number
9,281,300
Issue date
Mar 8, 2016
STATS ChipPAC, Ltd.
Leo A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with open substrate and method of manufa...
Patent number
9,034,693
Issue date
May 19, 2015
ST Assembly Test Services Ltd.
Il Kwon Shim
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Integrated circuit package system with bonding in via
Patent number
9,000,579
Issue date
Apr 7, 2015
Stats Chippac Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit heat spreader stacking system
Patent number
8,421,221
Issue date
Apr 16, 2013
Stats Chippac Ltd.
Dario S. Filoteo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with heatspreader
Patent number
8,395,254
Issue date
Mar 12, 2013
Stats Chippac Ltd.
Emmanuel Espiritu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader anchoring and grounding method and thermally enhanced...
Patent number
6,875,634
Issue date
Apr 5, 2005
ST Assembly Test Services PTE LTD
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader anchoring & grounding method & therma...
Patent number
6,737,298
Issue date
May 18, 2004
ST Assembly Test Services Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING IN VIA
Publication number
20080237873
Publication date
Oct 2, 2008
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
Publication number
20080185719
Publication date
Aug 7, 2008
Philip Lyndon Cablao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT VIA WIRE BONDING AND METHOD OF ASSEMBLING THE SAME
Publication number
20080136022
Publication date
Jun 12, 2008
STATS ChipPAC, Inc.
Dario S. Filoteo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE SEMICONDUCTOR PACKAGE
Publication number
20080067658
Publication date
Mar 20, 2008
STATS ChipPAC, Inc.
Philip Lyndon R. Cablao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE
Publication number
20080042265
Publication date
Feb 21, 2008
Leo A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUAD FLAT PACKAGE
Publication number
20080036051
Publication date
Feb 14, 2008
Emmanuel A. Espiritu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE STACKING
Publication number
20080029862
Publication date
Feb 7, 2008
Dario S. Filoteo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
Publication number
20080029905
Publication date
Feb 7, 2008
STATS ChipPAC Ltd.
Leo A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
Publication number
20080012122
Publication date
Jan 17, 2008
STATS ChipPAC Ltd.
Dario S. Filoteo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER
Publication number
20070235859
Publication date
Oct 11, 2007
STATS ChipPAC Ltd.
Emmanuel Espiritu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS
Publication number
20070210432
Publication date
Sep 13, 2007
STATS ChipPAC Ltd.
Philip Lyndon Cablao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
Publication number
20070210436
Publication date
Sep 13, 2007
STATS ChipPAC Ltd.
Dario S. Filoteo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE STACKING
Publication number
20070200205
Publication date
Aug 30, 2007
STATS ChipPAC Ltd.
Dario S. Filoteo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HIGH-DENSITY SMALL FOOT...
Publication number
20070096282
Publication date
May 3, 2007
STATS ChipPAC Ltd.
IL Kwon Shim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP SCALE PACKAGE WITH OPEN SUBSTRATE
Publication number
20060055009
Publication date
Mar 16, 2006
STATS ChipPAC Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
Publication number
20060043560
Publication date
Mar 2, 2006
STATS ChipPAC Ltd.
IL Kwon SHIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SCALE PACKAGE WITH OPEN SUBSTRATE
Publication number
20050277227
Publication date
Dec 15, 2005
ST ASSEMBLY TEST SERVICES LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Array-molded package heat spreader and fabrication method therefor
Publication number
20050046015
Publication date
Mar 3, 2005
ST ASSEMBLY TEST SERVICES LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat spreader anchoring and grounding method and thermally enhanced...
Publication number
20040180525
Publication date
Sep 16, 2004
ST ASSEMBLY TEST SERVICES LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat spreader anchoring & grounding method & thermally enhanced PBG...
Publication number
20030138994
Publication date
Jul 24, 2003
ST ASSEMBLY TEST SERVICES PTE LTD
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS