Diann-Fang Lin

Person

Zhubei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dartboard structure and method for manufacturing the same
- Patent number 11,927,430
- Issue date Mar 12, 2024
- Asmeditron Inc.
- Huai-Fang Tsai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package structure
- Patent number 8,749,048
- Issue date Jun 10, 2014
- ADL Engineering Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 8,058,102
- Issue date Nov 15, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with multi-chips and method of the same
- Patent number 7,763,494
- Issue date Jul 27, 2010
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-chips with side-by-side c...
- Patent number 7,525,185
- Issue date Apr 28, 2009
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module having build-in package cavity and the method o...
- Patent number 7,498,556
- Issue date Mar 3, 2009
- Adavanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DARTING SYSTEM, PROCESSING METHOD FOR AN ELECTRONIC DART...
- Publication number 20220404127
- Publication date Dec 22, 2022
- Asmeditron Inc.
- HUAI-FANG TSAI
- F41 - WEAPONS
Information Patent Application
MAGNETIC INDUCTION DART AND MAGNETIC INDUCTION DARTING SYSTEM
- Publication number 20220325989
- Publication date Oct 13, 2022
- Asmeditron Inc.
- HUAI-FANG TSAI
- F42 - AMMUNITION BLASTING
Information Patent Application
DARTBOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210302132
- Publication date Sep 30, 2021
- Asmeditron Inc.
- HUAI-FANG TSAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20110209908
- Publication date Sep 1, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20110193216
- Publication date Aug 11, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20110180891
- Publication date Jul 28, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20110108977
- Publication date May 12, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20110031594
- Publication date Feb 10, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20110031607
- Publication date Feb 10, 2011
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND MET...
- Publication number 20090008777
- Publication date Jan 8, 2009
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with multi-chips and method of the same
- Publication number 20080274593
- Publication date Nov 6, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME
- Publication number 20080265393
- Publication date Oct 30, 2008
- Advanced Chip Engineering Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND...
- Publication number 20080258293
- Publication date Oct 23, 2008
- ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package having multi-chips with side-by-side c...
- Publication number 20080251908
- Publication date Oct 16, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package having multi-chips with side-by-side c...
- Publication number 20080230884
- Publication date Sep 25, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module having build-in package cavity and the method o...
- Publication number 20080224248
- Publication date Sep 18, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device package
- Publication number 20080224276
- Publication date Sep 18, 2008
- ADVANCED CHIP ENGINEERING TECHNOLOGY
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure to improve the reliability for WLP
- Publication number 20080211080
- Publication date Sep 4, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND...
- Publication number 20080211075
- Publication date Sep 4, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with multi-chips and method of the same
- Publication number 20080197480
- Publication date Aug 21, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CO...
- Publication number 20080197478
- Publication date Aug 21, 2008
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with multi-chips and method of the same
- Publication number 20080197474
- Publication date Aug 21, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package with die receiving opening and method of the same
- Publication number 20080191333
- Publication date Aug 14, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND...
- Publication number 20080191335
- Publication date Aug 14, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOL...
- Publication number 20080083980
- Publication date Apr 10, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Diann-Fang Lin

Person

Patents Grantslast 30 patents

Dartboard structure and method for manufacturing the same

Package structure

Package structure and manufacturing method thereof

Semiconductor device package with multi-chips and method of the same

Semiconductor device package having multi-chips with side-by-side c...

Image sensor module having build-in package cavity and the method o...

Patents Applicationslast 30 patents

ELECTRONIC DARTING SYSTEM, PROCESSING METHOD FOR AN ELECTRONIC DART...

MAGNETIC INDUCTION DART AND MAGNETIC INDUCTION DARTING SYSTEM

DARTBOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

PACKAGE STRUCTURE

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND MET...

Semiconductor device package with multi-chips and method of the same

STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND...

Semiconductor device package having multi-chips with side-by-side c...

Semiconductor device package having multi-chips with side-by-side c...

Image sensor module having build-in package cavity and the method o...

Semiconductor device package

Package structure to improve the reliability for WLP

IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND...

Semiconductor device package with multi-chips and method of the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CO...

Semiconductor device package with multi-chips and method of the same

Image sensor package with die receiving opening and method of the same

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND...

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOL...