Donald S. Farquhar

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
- Patent number 7,981,245
- Issue date Jul 19, 2011
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
- Patent number 7,777,136
- Issue date Aug 17, 2010
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Security cloth design and assembly
- Patent number 7,679,921
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Mario L. Cesana
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for producing Z-axis interconnection assembly...
- Patent number 7,402,254
- Issue date Jul 22, 2008
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with optimized lamination process
- Patent number 7,329,816
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing Z-axis interconnection assembly of printed wir...
- Patent number 7,303,639
- Issue date Dec 4, 2007
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
- Patent number 7,301,108
- Issue date Nov 27, 2007
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 7,240,430
- Issue date Jul 10, 2007
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z-interconnections with liquid crystal polymer dielectric films
- Patent number 7,128,256
- Issue date Oct 31, 2006
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid via layer to layer interconnect
- Patent number 7,076,869
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced design and process for a conductive adhesive
- Patent number 7,063,756
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Donald Seton Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with optimized lamination process
- Patent number 7,059,049
- Issue date Jun 13, 2006
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a thermoset-containing dielectric mater...
- Patent number 7,014,731
- Issue date Mar 21, 2006
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for improved fold retention on a security encl...
- Patent number 7,007,171
- Issue date Feb 28, 2006
- International Business Machines Corporaton
- Giuseppe Butturini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Formation of multisegmented plated through holes
- Patent number 6,996,903
- Issue date Feb 14, 2006
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Security cloth design and assembly
- Patent number 6,982,642
- Issue date Jan 3, 2006
- International Business Machines Corporation
- Mario L. Cesana
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for producing Z-axis interconnection assembly...
- Patent number 6,969,436
- Issue date Nov 29, 2005
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lamination of liquid crystal polymer dielectric films
- Patent number 6,967,705
- Issue date Nov 22, 2005
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making and interconnect structure
- Patent number 6,931,726
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-responding encapsulated enclosure having flexible protective...
- Patent number 6,929,900
- Issue date Aug 16, 2005
- International Business Machines Corporation
- Donald S. Farquhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 6,902,869
- Issue date Jun 7, 2005
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accelerated etching of chromium
- Patent number 6,843,929
- Issue date Jan 18, 2005
- International Business Machines Corporation
- Donald S. Farquhar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a multi-layered interconnect structure
- Patent number 6,829,823
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Francis J. Downes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
- Patent number 6,826,830
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lamination of liquid crystal polymer dielectric films
- Patent number 6,819,373
- Issue date Nov 16, 2004
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of removing holefill residue from a metallic surface of an...
- Patent number 6,776,852
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z-interconnections with liquid crystal polymer dielectric films
- Patent number 6,764,748
- Issue date Jul 20, 2004
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of multisegmented plated through holes
- Patent number 6,700,078
- Issue date Mar 2, 2004
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 6,684,497
- Issue date Feb 3, 2004
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-responding encapsulated enclosure having flexible protective...
- Patent number 6,686,539
- Issue date Feb 3, 2004
- International Business Machines Corporation
- Donald S. Farquhar
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...
- Publication number 20100218891
- Publication date Sep 2, 2010
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...
- Publication number 20080217050
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...
- Publication number 20080178999
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS
- Publication number 20080022519
- Publication date Jan 31, 2008
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Security cloth design and assembly
- Publication number 20060080348
- Publication date Apr 13, 2006
- International Business Machines Corporation
- Mario L. Cesana
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for producing Z-axis interconnection assembly of printed wir...
- Publication number 20050280136
- Publication date Dec 22, 2005
- International Business Machines Corporation
- Brian E. Curcio
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic package with optimized lamination process
- Publication number 20050224961
- Publication date Oct 13, 2005
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20050124096
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Formation of multisegmented plated through holes
- Publication number 20050079289
- Publication date Apr 14, 2005
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layered interconnect structure using liquid crystalline polym...
- Publication number 20050057908
- Publication date Mar 17, 2005
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lamination of liquid crystal polymer dielectric films
- Publication number 20050019527
- Publication date Jan 27, 2005
- Donald S. Farquhar
- B32 - LAYERED PRODUCTS
Information Patent Application
Tamper-responding encapsulated enclosure having flexible protective...
- Publication number 20040195001
- Publication date Oct 7, 2004
- Donald S. Farquhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Z-interconnections with liquid crystal polymer dielectric films
- Publication number 20040182509
- Publication date Sep 23, 2004
- Donald S. Farquhar
- B32 - LAYERED PRODUCTS
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20040091821
- Publication date May 13, 2004
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for producing Z-axis interconnection assembly...
- Publication number 20040084137
- Publication date May 6, 2004
- International Business Machines Corporation
- Brian E. Curcio
- B32 - LAYERED PRODUCTS
Information Patent Application
Lamination of liquid crystal polymer dielectric films
- Publication number 20040066478
- Publication date Apr 8, 2004
- International Business Machines Corporation
- Donald S. Farquhar
- B32 - LAYERED PRODUCTS
Information Patent Application
Method and structure for producing Z-axis interconnection assembly...
- Publication number 20040052945
- Publication date Mar 18, 2004
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hole fill composition and method for filling holes in a substrate
- Publication number 20030216490
- Publication date Nov 20, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect structure and method of making same
- Publication number 20030172525
- Publication date Sep 18, 2003
- International Business Machines Corporation
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layered interconnect structure using liquid crystalline polym...
- Publication number 20030147227
- Publication date Aug 7, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhanced design and process for a conductive adhesive
- Publication number 20030140488
- Publication date Jul 31, 2003
- International Business Machines Corporation
- Donald Seton Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process of removing holefill residue from a metallic surface of an...
- Publication number 20030131870
- Publication date Jul 17, 2003
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming metallic z-interconnects for laminate chip packag...
- Publication number 20030127495
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Brian E. Curcio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect structure and method of making same
- Publication number 20030070839
- Publication date Apr 17, 2003
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solid via layer to layer interconnect
- Publication number 20030035272
- Publication date Feb 20, 2003
- Brian E. Curcio
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Electronic package with optimized lamination process
- Publication number 20030020156
- Publication date Jan 30, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for producing Z-axis interconnection assembly...
- Publication number 20020192444
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Brian E. Curcio
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Platen for use in laminating press and method of lamination
- Publication number 20020189755
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Varaprasad Venkata Calmidi
- B30 - PRESSES
Information Patent Application
Hole fill composition and method for filling holes in a substrate
- Publication number 20020187316
- Publication date Dec 12, 2002
- International Business Machines Corporation
- Donald S. Farquhar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and article for filling apertures in a high performance elec...
- Publication number 20020182832
- Publication date Dec 5, 2002
- Donald S. Farquhar
- H01 - BASIC ELECTRIC ELEMENTS

Donald S. Farquhar

Person

Patents Grantslast 30 patents

Multi-layered interconnect structure using liquid crystalline polym...

Multi-layered interconnect structure using liquid crystalline polym...

Security cloth design and assembly

Method and structure for producing Z-axis interconnection assembly...

Electronic package with optimized lamination process

Method for producing Z-axis interconnection assembly of printed wir...

Multi-layered interconnect structure using liquid crystalline polym...

Manufacturing methods for printed circuit boards

Z-interconnections with liquid crystal polymer dielectric films

Solid via layer to layer interconnect

Enhanced design and process for a conductive adhesive

Electronic package with optimized lamination process

Semiconductor device having a thermoset-containing dielectric mater...

Method and apparatus for improved fold retention on a security encl...

Formation of multisegmented plated through holes

Security cloth design and assembly

Method and structure for producing Z-axis interconnection assembly...

Lamination of liquid crystal polymer dielectric films

Method of making and interconnect structure

Tamper-responding encapsulated enclosure having flexible protective...

Manufacturing methods for printed circuit boards

Accelerated etching of chromium

Method of making a multi-layered interconnect structure

Multi-layered interconnect structure using liquid crystalline polym...

Lamination of liquid crystal polymer dielectric films

Process of removing holefill residue from a metallic surface of an...

Z-interconnections with liquid crystal polymer dielectric films

Formation of multisegmented plated through holes

Manufacturing methods for printed circuit boards

Tamper-responding encapsulated enclosure having flexible protective...

Patents Applicationslast 30 patents

MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...

MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...

MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...

ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS

Security cloth design and assembly

Method for producing Z-axis interconnection assembly of printed wir...

Electronic package with optimized lamination process

Manufacturing methods for printed circuit boards

Formation of multisegmented plated through holes

Multi-layered interconnect structure using liquid crystalline polym...

Lamination of liquid crystal polymer dielectric films

Tamper-responding encapsulated enclosure having flexible protective...

Z-interconnections with liquid crystal polymer dielectric films

Manufacturing methods for printed circuit boards

Method and structure for producing Z-axis interconnection assembly...

Lamination of liquid crystal polymer dielectric films

Method and structure for producing Z-axis interconnection assembly...

Hole fill composition and method for filling holes in a substrate

Interconnect structure and method of making same

Multi-layered interconnect structure using liquid crystalline polym...

Enhanced design and process for a conductive adhesive

Process of removing holefill residue from a metallic surface of an...

Method of forming metallic z-interconnects for laminate chip packag...

Interconnect structure and method of making same

Solid via layer to layer interconnect

Electronic package with optimized lamination process

Method and structure for producing Z-axis interconnection assembly...

Platen for use in laminating press and method of lamination

Hole fill composition and method for filling holes in a substrate

Method and article for filling apertures in a high performance elec...