Donald V. Perino

Person

North Potamac, MD, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having stacked dies and impedance balance...
- Patent number RE43720
- Issue date Oct 9, 2012
- Rambus Inc.
- Donald V. Perino
- 257 - Active solid-state devices
Information Patent Grant
Chip socket assembly and chip file assembly for semiconductor chips
- Patent number 8,096,812
- Issue date Jan 17, 2012
- Rambus Inc.
- Donald V. Perino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with a controlled impedance bus and method of...
- Patent number 8,076,759
- Issue date Dec 13, 2011
- Rambus Inc.
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for transmitting data with reduced coupling noise
- Patent number 8,036,284
- Issue date Oct 11, 2011
- Rambus Inc.
- Mark A. Horowitz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for transmitting data with reduced coupling noise
- Patent number 7,627,043
- Issue date Dec 1, 2009
- Rambus Inc.
- Mark A. Horowitz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package with a controlled impedance bus
- Patent number 7,626,248
- Issue date Dec 1, 2009
- Rambus Inc.
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Expandable slave device system with buffered subsystems
- Patent number 7,536,494
- Issue date May 19, 2009
- Rambus Inc.
- Bruno W. Garlepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Expandable slave device system
- Patent number 7,222,209
- Issue date May 22, 2007
- Rambus, Inc.
- Bruno W. Garlepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Active impedance compensation
- Patent number 7,134,101
- Issue date Nov 7, 2006
- Rambus Inc.
- Haw-Jyh Liaw
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip-to-chip communication system using an ac-coupled bus and devic...
- Patent number 7,130,944
- Issue date Oct 31, 2006
- Rambus Inc.
- Donald V. Perino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock data recovery with selectable phase control
- Patent number 7,099,424
- Issue date Aug 29, 2006
- Rambus Inc.
- Kun-Yung K. Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Connector with integral transmission line bus
- Patent number RE39153
- Issue date Jul 4, 2006
- Rambus Inc.
- Donald V. Perino
- 439 - Electrical connectors
Information Patent Grant
Semiconductor package with a controlled impedance bus and method of...
- Patent number 6,999,332
- Issue date Feb 14, 2006
- Rambus Inc.
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for operating a master-slave system with a clo...
- Patent number 6,968,024
- Issue date Nov 22, 2005
- Rambus Inc.
- Donald V. Perino
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit device having a capacitive coupling element
- Patent number 6,854,030
- Issue date Feb 8, 2005
- Rambus Inc.
- Donald V. Perino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for reducing worst case power
- Patent number 6,731,545
- Issue date May 4, 2004
- Rambus Inc.
- Craig Edward Hampel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package with a controlled impedance bus and method of...
- Patent number 6,714,431
- Issue date Mar 30, 2004
- Rambus Inc.
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Expandable slave device system
- Patent number 6,687,780
- Issue date Feb 3, 2004
- Rambus Inc.
- Bruno W. Garlepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spread spectrum clocking of digital signals
- Patent number 6,687,319
- Issue date Feb 3, 2004
- Rambus Inc.
- Donald V. Perino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple channel modules and bus systems using same
- Patent number 6,657,871
- Issue date Dec 2, 2003
- Rambus Inc.
- Donald V. Perino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method for controlling edge rates of digital signals
- Patent number 6,657,468
- Issue date Dec 2, 2003
- Rambus Inc.
- Scott C. Best
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip socket assembly and chip file assembly for semiconductor chips
- Patent number 6,619,973
- Issue date Sep 16, 2003
- Rambus, Inc.
- Donald V. Perino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit device having stacked dies and impedance balance...
- Patent number 6,621,155
- Issue date Sep 16, 2003
- Rambus Inc.
- Donald V. Perino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for utilizing a lossy dielectric substrate in...
- Patent number 6,621,373
- Issue date Sep 16, 2003
- Rambus Inc.
- Donald R. Mullen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip socket assembly and chip file assembly for semiconductor chips
- Patent number 6,589,059
- Issue date Jul 8, 2003
- Rambus, Inc.
- Donald V. Perino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with a controlled impedance bus and method of...
- Patent number 6,583,035
- Issue date Jun 24, 2003
- Rambus Inc.
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple channel modules and bus systems using same
- Patent number 6,545,875
- Issue date Apr 8, 2003
- Rambus, Inc.
- Donald V. Perino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Active impedance compensation
- Patent number 6,530,062
- Issue date Mar 4, 2003
- Rambus Inc.
- Haw-Jyh Liaw
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Redistributed bond pads in stacked integrated circuit die package
- Patent number 6,514,794
- Issue date Feb 4, 2003
- Rambus Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for multilevel signaling
- Patent number 6,504,875
- Issue date Jan 7, 2003
- Rambus Inc.
- Donald V. Perino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package With a Controlled Impedance Bus and Method of...
- Publication number 20100072605
- Publication date Mar 25, 2010
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Transmitting Data With Reduced Coupling Noise
- Publication number 20100067586
- Publication date Mar 18, 2010
- Mark A. Horowitz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Expandable Slave Device System with Buffered Subsystems
- Publication number 20070220188
- Publication date Sep 20, 2007
- Bruno W. Garlepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor package with a controlled impedance bus and method of...
- Publication number 20060133124
- Publication date Jun 22, 2006
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip socket assembly and chip file assembly for semiconductor chips
- Publication number 20060014402
- Publication date Jan 19, 2006
- Donald V. Perino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for transmitting data with reduced coupling noise
- Publication number 20050208838
- Publication date Sep 22, 2005
- Mark A. Horowitz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Chip-to-chip communication system using an ac-coupled bus and devic...
- Publication number 20050135182
- Publication date Jun 23, 2005
- Donald V. Perino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Expandable slave device system
- Publication number 20040196064
- Publication date Oct 7, 2004
- Rambus Inc.
- Bruno W. Garlepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor package with a controlled impedance bus and method of...
- Publication number 20040155318
- Publication date Aug 12, 2004
- Rambus Inc.
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package with a controlled impedance bus and method of...
- Publication number 20030202373
- Publication date Oct 30, 2003
- Rambus Inc.
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Active impedance compensation
- Publication number 20030110454
- Publication date Jun 12, 2003
- Rambus, Inc.
- Haw-Jyh Liaw
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated circuit device having a capacitive coupling element
- Publication number 20030105908
- Publication date Jun 5, 2003
- Donald V. Perino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multiple channel modules and bus systems using same
- Publication number 20030007337
- Publication date Jan 9, 2003
- Rambus Inc.
- Donald V. Perino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus for multilevel signaling
- Publication number 20020186777
- Publication date Dec 12, 2002
- Donald V. Perino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Redistributed bond pads in stacked integrated circuit die package
- Publication number 20020127775
- Publication date Sep 12, 2002
- Rambus Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with a controlled impedance bus and method of...
- Publication number 20020058347
- Publication date May 16, 2002
- Nader Gamini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip socket assembly and chip file assembly for semiconductor chips
- Publication number 20020055285
- Publication date May 9, 2002
- Rambus, Inc.
- Donald V. Perino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip socket assembly and chip file assembly for semiconductor chips
- Publication number 20020031923
- Publication date Mar 14, 2002
- Donald V. Perino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for reducing worst case power
- Publication number 20020027447
- Publication date Mar 7, 2002
- Rambus, Inc.
- Craig Edward Hampel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Chip socket assembly and chip file assembly for semiconductor chips
- Publication number 20020016091
- Publication date Feb 7, 2002
- Rambus, Inc.
- Donald V. Perino
- H01 - BASIC ELECTRIC ELEMENTS

Donald V. Perino

Person

Patents Grantslast 30 patents

Integrated circuit device having stacked dies and impedance balance...

Chip socket assembly and chip file assembly for semiconductor chips

Semiconductor package with a controlled impedance bus and method of...

Method and apparatus for transmitting data with reduced coupling noise

Method and apparatus for transmitting data with reduced coupling noise

Semiconductor package with a controlled impedance bus

Expandable slave device system with buffered subsystems

Expandable slave device system

Active impedance compensation

Chip-to-chip communication system using an ac-coupled bus and devic...

Clock data recovery with selectable phase control

Connector with integral transmission line bus

Semiconductor package with a controlled impedance bus and method of...

Apparatus and method for operating a master-slave system with a clo...

Integrated circuit device having a capacitive coupling element

Method and apparatus for reducing worst case power

Semiconductor package with a controlled impedance bus and method of...

Expandable slave device system

Spread spectrum clocking of digital signals

Multiple channel modules and bus systems using same

Apparatus and method for controlling edge rates of digital signals

Chip socket assembly and chip file assembly for semiconductor chips

Integrated circuit device having stacked dies and impedance balance...

Apparatus and method for utilizing a lossy dielectric substrate in...

Chip socket assembly and chip file assembly for semiconductor chips

Semiconductor package with a controlled impedance bus and method of...

Multiple channel modules and bus systems using same

Active impedance compensation

Redistributed bond pads in stacked integrated circuit die package

Apparatus for multilevel signaling

Patents Applicationslast 30 patents

Semiconductor Package With a Controlled Impedance Bus and Method of...

Method and Apparatus for Transmitting Data With Reduced Coupling Noise

Expandable Slave Device System with Buffered Subsystems

Semiconductor package with a controlled impedance bus and method of...

Chip socket assembly and chip file assembly for semiconductor chips

Method and apparatus for transmitting data with reduced coupling noise

Chip-to-chip communication system using an ac-coupled bus and devic...

Expandable slave device system

Semiconductor package with a controlled impedance bus and method of...

Semiconductor package with a controlled impedance bus and method of...

Active impedance compensation

Integrated circuit device having a capacitive coupling element

Multiple channel modules and bus systems using same

Apparatus for multilevel signaling

Redistributed bond pads in stacked integrated circuit die package

Semiconductor package with a controlled impedance bus and method of...

Chip socket assembly and chip file assembly for semiconductor chips

Chip socket assembly and chip file assembly for semiconductor chips

Method and apparatus for reducing worst case power

Chip socket assembly and chip file assembly for semiconductor chips