Eungnak Han

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self aligned gratings for tight pitch interconnects and methods of...
- Patent number 12,131,991
- Issue date Oct 29, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 12,087,836
- Issue date Sep 10, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colored gratings in microelectronic structures
- Patent number 12,087,594
- Issue date Sep 10, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure surface modifications by passivating agents
- Patent number 12,036,578
- Issue date Jul 16, 2024
- Intel Corporation
- Florian Gstrein
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Chemical compositions and methods of patterning microelectronic dev...
- Patent number 12,037,434
- Issue date Jul 16, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directed self-assembly structures and techniques
- Patent number 12,012,473
- Issue date Jun 18, 2024
- Intel Corporation
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate spacing in integrated circuit structures
- Patent number 12,002,678
- Issue date Jun 4, 2024
- Intel Corporation
- Charles Henry Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,953,826
- Issue date Apr 9, 2024
- Intel Corporation
- James M. Blackwell
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Chain scission photoresists and methods for forming chain scission...
- Patent number 11,846,883
- Issue date Dec 19, 2023
- Intel Corporation
- Robert Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 11,837,644
- Issue date Dec 5, 2023
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered lines for interconnect performance improvement and proces...
- Patent number 11,664,305
- Issue date May 30, 2023
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials and layout design options for DSA on transition regions o...
- Patent number 11,605,623
- Issue date Mar 14, 2023
- Intel Corporation
- Gurpreet Singh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive cap-based approaches for conductive via fabrication and...
- Patent number 11,417,567
- Issue date Aug 16, 2022
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned repeatedly stackable 3D vertical RRAM
- Patent number 11,404,482
- Issue date Aug 2, 2022
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multifunctional molecules for selective polymer formation on conduc...
- Patent number 11,398,428
- Issue date Jul 26, 2022
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chain scission resist compositions for EUV lithography applications
- Patent number 11,262,654
- Issue date Mar 1, 2022
- Intel Corporation
- Lauren Doyle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Self aligned gratings for tight pitch interconnects and methods of...
- Patent number 11,251,117
- Issue date Feb 15, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,137,681
- Issue date Oct 5, 2021
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless air gap to prevent via punch through
- Patent number 10,971,394
- Issue date Apr 6, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triblock copolymers for self-aligning vias or contacts
- Patent number 10,950,501
- Issue date Mar 16, 2021
- Intel Corporation
- Todd R. Younkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photobucket floor colors with selective grafting
- Patent number 10,892,184
- Issue date Jan 12, 2021
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differentiated molecular domains for selective hardmask fabrication...
- Patent number 10,886,175
- Issue date Jan 5, 2021
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposure activated chemically amplified directed self-assembly (DSA...
- Patent number 10,459,338
- Issue date Oct 29, 2019
- Intel Corporation
- Paul A. Nyhus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Materials and deposition schemes using photoactive materials for in...
- Patent number 10,269,622
- Issue date Apr 23, 2019
- Intel Corporation
- Rami Hourani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Maskless air gap to prevent via punch through
- Patent number 10,256,141
- Issue date Apr 9, 2019
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating alternate hardmask cap interconnect structure w...
- Patent number 10,109,583
- Issue date Oct 23, 2018
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposure activated chemically amplified directed self-assembly (DSA...
- Patent number 9,625,815
- Issue date Apr 18, 2017
- Intel Corporation
- Paul A. Nyhus
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Non-lithographically patterned directed self assembly alignment pro...
- Patent number 9,570,349
- Issue date Feb 14, 2017
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming layers of materials over small regions by selective chemica...
- Patent number 9,530,733
- Issue date Dec 27, 2016
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-lithographically patterned directed self assembly alignment pro...
- Patent number 9,418,888
- Issue date Aug 16, 2016
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...
- Publication number 20240360264
- Publication date Oct 31, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING
- Publication number 20240290651
- Publication date Aug 29, 2024
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES
- Publication number 20240249946
- Publication date Jul 25, 2024
- Intel Corporation
- Charles Henry Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DE...
- Publication number 20240222119
- Publication date Jul 4, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MA...
- Publication number 20240204083
- Publication date Jun 20, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...
- Publication number 20240203868
- Publication date Jun 20, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW
- Publication number 20240194672
- Publication date Jun 13, 2024
- Intel Corporation
- Bharath Bangalore Rajeeva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH MULTI-PITCH PATTERN FABRICATED...
- Publication number 20240194483
- Publication date Jun 13, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLAS...
- Publication number 20240186264
- Publication date Jun 6, 2024
- Intel Corporation
- Yi Yang
- B32 - LAYERED PRODUCTS
Information Patent Application
SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...
- Publication number 20240114693
- Publication date Apr 4, 2024
- Intel Corporation
- Christopher M. Neumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20240047543
- Publication date Feb 8, 2024
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT E...
- Publication number 20230307298
- Publication date Sep 28, 2023
- Intel Corporation
- Charles H. WALLACE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...
- Publication number 20230095402
- Publication date Mar 30, 2023
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...
- Publication number 20230101212
- Publication date Mar 30, 2023
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELEC...
- Publication number 20230085997
- Publication date Mar 23, 2023
- Intel Corporation
- Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA OPENING RECTIFICATION USING LAMELLAR TRIBLOCK COPOLYMER, POLYME...
- Publication number 20220199462
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDED VIAS IN MICROELECTRONIC STRUCTURES
- Publication number 20220199540
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLORED GRATINGS IN MICROELECTRONIC STRUCTURES
- Publication number 20220199420
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED GRATINGS FOR TIGHT PITCH INTERCONNECTS AND METHODS OF...
- Publication number 20220173034
- Publication date Jun 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES
- Publication number 20220102148
- Publication date Mar 31, 2022
- Intel Corporation
- Charles Henry Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES USING DIRECTED SELF-ASSEMBLY FO...
- Publication number 20220102210
- Publication date Mar 31, 2022
- Intel Corporation
- Paul A. NYHUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...
- Publication number 20210397084
- Publication date Dec 23, 2021
- Intel Corporation
- James M. BLACKWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...
- Publication number 20210371566
- Publication date Dec 2, 2021
- Intel Corporation
- Eungnak Han
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES
- Publication number 20210375745
- Publication date Dec 2, 2021
- Intel Corporation, Santa Clara, CA
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAIN SCISSION RESIST COMPOSITIONS FOR EUV LITHOGRAPHY APPLICATIONS
- Publication number 20210200085
- Publication date Jul 1, 2021
- Intel Corporation
- Lauren Doyle
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20210091194
- Publication date Mar 25, 2021
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED GRATINGS FOR TIGHT PITCH INTERCONNECTS AND METHODS OF...
- Publication number 20210074632
- Publication date Mar 11, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL MOLECULES FOR SELECTIVE POLYMER FORMATION ON CONDUC...
- Publication number 20210057337
- Publication date Feb 25, 2021
- Intel Corporation
- Eungnak HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS AND LAYOUT DESIGN OPTIONS FOR DSA ON TRANSITION REGIONS O...
- Publication number 20200411501
- Publication date Dec 31, 2020
- Intel Corporation
- Gurpreet SINGH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
STAGGERED LINES FOR INTERCONNECT PERFORMANCE IMPROVEMENT AND PROCES...
- Publication number 20200411427
- Publication date Dec 31, 2020
- Intel Corporation
- Kevin Lai LIN
- H01 - BASIC ELECTRIC ELEMENTS

Eungnak Han

Person

Patents Grantslast 30 patents

Self aligned gratings for tight pitch interconnects and methods of...

Contact over active gate structures with metal oxide-caped contacts...

Colored gratings in microelectronic structures

Interconnect structure surface modifications by passivating agents

Chemical compositions and methods of patterning microelectronic dev...

Directed self-assembly structures and techniques

Gate spacing in integrated circuit structures

Lined photobucket structure for back end of line (BEOL) interconnec...

Chain scission photoresists and methods for forming chain scission...

Contact over active gate structures with metal oxide-caped contacts...

Staggered lines for interconnect performance improvement and proces...

Materials and layout design options for DSA on transition regions o...

Conductive cap-based approaches for conductive via fabrication and...

Self-aligned repeatedly stackable 3D vertical RRAM

Multifunctional molecules for selective polymer formation on conduc...

Chain scission resist compositions for EUV lithography applications

Self aligned gratings for tight pitch interconnects and methods of...

Lined photobucket structure for back end of line (BEOL) interconnec...

Maskless air gap to prevent via punch through

Triblock copolymers for self-aligning vias or contacts

Photobucket floor colors with selective grafting

Differentiated molecular domains for selective hardmask fabrication...

Exposure activated chemically amplified directed self-assembly (DSA...

Materials and deposition schemes using photoactive materials for in...

Maskless air gap to prevent via punch through

Method for creating alternate hardmask cap interconnect structure w...

Exposure activated chemically amplified directed self-assembly (DSA...

Non-lithographically patterned directed self assembly alignment pro...

Forming layers of materials over small regions by selective chemica...

Non-lithographically patterned directed self assembly alignment pro...

Patents Applicationslast 30 patents

CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...

SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING

GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES

PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DE...

DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MA...

SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...

MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW

INTEGRATED CIRCUIT (IC) DEVICE WITH MULTI-PITCH PATTERN FABRICATED...

POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLAS...

SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT E...

CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...

CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...

METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELEC...

VIA OPENING RECTIFICATION USING LAMELLAR TRIBLOCK COPOLYMER, POLYME...

GUIDED VIAS IN MICROELECTRONIC STRUCTURES

COLORED GRATINGS IN MICROELECTRONIC STRUCTURES

SELF ALIGNED GRATINGS FOR TIGHT PITCH INTERCONNECTS AND METHODS OF...

GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES

CONTACT OVER ACTIVE GATE STRUCTURES USING DIRECTED SELF-ASSEMBLY FO...

LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...

CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...

DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES

CHAIN SCISSION RESIST COMPOSITIONS FOR EUV LITHOGRAPHY APPLICATIONS

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

SELF ALIGNED GRATINGS FOR TIGHT PITCH INTERCONNECTS AND METHODS OF...

MULTIFUNCTIONAL MOLECULES FOR SELECTIVE POLYMER FORMATION ON CONDUC...

MATERIALS AND LAYOUT DESIGN OPTIONS FOR DSA ON TRANSITION REGIONS O...

STAGGERED LINES FOR INTERCONNECT PERFORMANCE IMPROVEMENT AND PROCES...