Fu Chiung Chong

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structures and processes for fabrication of probe card assemblies w...
- Patent number 8,575,954
- Issue date Nov 5, 2013
- Advantest (Singapore) Pte Ltd
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
Construction structures and manufacturing processes for integrated...
- Patent number 7,952,373
- Issue date May 31, 2011
- Verigy (Singapore) Pte. Ltd.
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Grant
High density interconnect system having rapid fabrication cycle
- Patent number 7,884,634
- Issue date Feb 8, 2011
- Verigy (Singapore) PTE, Ltd.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
High density interconnect system having rapid fabrication cycle
- Patent number 7,872,482
- Issue date Jan 18, 2011
- Verigy (Singapore) Pte. Ltd.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
High density interconnect system for IC packages and interconnect a...
- Patent number 7,812,626
- Issue date Oct 12, 2010
- Verigy (Singapore) Pte. Ltd.
- Wilmer R. Bottoms
- G01 - MEASURING TESTING
Information Patent Grant
Massively parallel interface for electronic circuit
- Patent number 7,772,860
- Issue date Aug 10, 2010
- NanoNexus, Inc.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
Systems for testing and packaging integrated circuits
- Patent number 7,621,761
- Issue date Nov 24, 2009
- NanoNexus, Inc.
- Sammy Mok
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density interconnect system for IC packages and interconnect a...
- Patent number 7,579,848
- Issue date Aug 25, 2009
- NanoNexus, Inc.
- Wilmer R. Bottoms
- G01 - MEASURING TESTING
Information Patent Grant
Massively parallel interface for electronic circuit
- Patent number 7,403,029
- Issue date Jul 22, 2008
- Nanonexus Corporation
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
High density interconnect system having rapid fabrication cycle
- Patent number 7,382,142
- Issue date Jun 3, 2008
- NanoNexus, Inc.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced compliant probe card systems having improved planarity
- Patent number 7,349,223
- Issue date Mar 25, 2008
- NanoNexus, Inc.
- Joseph Michael Haemer
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced stress metal spring contactor
- Patent number 7,247,035
- Issue date Jul 24, 2007
- NanoNexus, Inc.
- Sammy Mok
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Miniaturized contact spring
- Patent number 7,137,830
- Issue date Nov 21, 2006
- NanoNexus, Inc.
- Syamal Kumar Lahiri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Massively parallel interface for electronic circuit
- Patent number 7,138,818
- Issue date Nov 21, 2006
- NanoNexus, Inc.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
Miniaturized contact spring
- Patent number 7,126,220
- Issue date Oct 24, 2006
- NanoNexus, Inc.
- Syamal Kumar Lahiri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Construction structures and manufacturing processes for integrated...
- Patent number 7,126,358
- Issue date Oct 24, 2006
- NanoNexus, Inc.
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Grant
Massively parallel interface for electronic circuit
- Patent number 7,009,412
- Issue date Mar 7, 2006
- NanoNexus, Inc.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
Construction structures and manufacturing processes for probe card...
- Patent number 6,917,525
- Issue date Jul 12, 2005
- NanoNexus, Inc.
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Grant
Construction structures and manufacturing processes for integrated...
- Patent number 6,815,961
- Issue date Nov 9, 2004
- NanoNexus, Inc.
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Grant
Massively parallel interface for electronic circuits
- Patent number 6,812,718
- Issue date Nov 2, 2004
- NanoNexus, Inc.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
Construction structures and manufacturing processes for integrated...
- Patent number 6,799,976
- Issue date Oct 5, 2004
- NanoNexus, Inc.
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Grant
Systems for testing and packaging integrated circuits
- Patent number 6,791,171
- Issue date Sep 14, 2004
- NanoNexus, Inc.
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Grant
Mosaic decal probe
- Patent number 6,710,609
- Issue date Mar 23, 2004
- NanoNexus, Inc.
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Grant
Programmable high-density electronic device testing
- Patent number 5,973,504
- Issue date Oct 26, 1999
- Kulicke and Soffa Industries, Inc.
- Fu Chiung Chong
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Producing Controlled Stresses and Stress G...
- Publication number 20130186746
- Publication date Jul 25, 2013
- ADVANTEST (SINGAPORE) PTE LTD
- Pierre H. Giauque
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Construction Structures and Manufacturing Processes for Integrated...
- Publication number 20120212248
- Publication date Aug 23, 2012
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED...
- Publication number 20120023730
- Publication date Feb 2, 2012
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
Structures and Processes for Fabrication of Probe Card Assemblies w...
- Publication number 20100244867
- Publication date Sep 30, 2010
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT A...
- Publication number 20100066393
- Publication date Mar 18, 2010
- W. R. Bottoms
- G01 - MEASURING TESTING
Information Patent Application
Construction Structures and Manufacturing Processes for Integrated...
- Publication number 20100026331
- Publication date Feb 4, 2010
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
High Density Interconnect System Having Rapid Fabrication Cycle
- Publication number 20090153165
- Publication date Jun 18, 2009
- Fu Chiung CHONG
- G01 - MEASURING TESTING
Information Patent Application
Method and Apparatus for Producing Controlled Stresses and Stress G...
- Publication number 20090090617
- Publication date Apr 9, 2009
- Pierre H. Giauque
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUIT
- Publication number 20080297186
- Publication date Dec 4, 2008
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE
- Publication number 20080246500
- Publication date Oct 9, 2008
- Fu Chiung CHONG
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS FOR TESTING AND PACKAGING INTEGRATED CIRCUITS
- Publication number 20080090429
- Publication date Apr 17, 2008
- Sammy Mok
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD
- Publication number 20070245553
- Publication date Oct 25, 2007
- Fu Chiung CHONG
- G01 - MEASURING TESTING
Information Patent Application
Miniaturized Contact Spring
- Publication number 20070144841
- Publication date Jun 28, 2007
- Fu Chiung Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUIT
- Publication number 20070057684
- Publication date Mar 15, 2007
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
Construction Structures and Manufacturing Processes for Integrated...
- Publication number 20070046304
- Publication date Mar 1, 2007
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Application
Systems for testing and packaging integrated circuits
- Publication number 20060240690
- Publication date Oct 26, 2006
- Sammy Mok
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
High density interconnect system for IC packages and interconnect a...
- Publication number 20060186906
- Publication date Aug 24, 2006
- W. R. Bottoms
- G01 - MEASURING TESTING
Information Patent Application
Massively parallel interface for electronic circuit
- Publication number 20060119377
- Publication date Jun 8, 2006
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
High density interconnect system having rapid fabrication cycle
- Publication number 20050275418
- Publication date Dec 15, 2005
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
Standardized layout patterns and routing structures for integrated...
- Publication number 20050068054
- Publication date Mar 31, 2005
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Application
Massively parallel interface for electronic circuit
- Publication number 20050051353
- Publication date Mar 10, 2005
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Application
Construction structures and manufacturing processes for integrated...
- Publication number 20050042932
- Publication date Feb 24, 2005
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Application
Systems for testing and packaging integrated circuits
- Publication number 20050026476
- Publication date Feb 3, 2005
- Sammy Mok
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Enhanced compliant probe card systems having improved planarity
- Publication number 20040223309
- Publication date Nov 11, 2004
- Joseph Michael Haemer
- G01 - MEASURING TESTING
Information Patent Application
Mosaic decal probe
- Publication number 20040075455
- Publication date Apr 22, 2004
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Application
Construction structures and manufacturing processes for integrated...
- Publication number 20040022042
- Publication date Feb 5, 2004
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Application
MOSAIC DECAL PROBE
- Publication number 20040008045
- Publication date Jan 15, 2004
- Sammy Mok
- G01 - MEASURING TESTING
Information Patent Application
Miniaturized contact spring
- Publication number 20030218244
- Publication date Nov 27, 2003
- Syamal Kumar Lahiri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Miniaturized contact spring
- Publication number 20030214045
- Publication date Nov 20, 2003
- Syamal Kumar Lahiri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Construction structures and manufacturing processes for probe card...
- Publication number 20030099097
- Publication date May 29, 2003
- Sammy Mok
- G01 - MEASURING TESTING

Fu Chiung Chong

Person

Patents Grantslast 30 patents

Structures and processes for fabrication of probe card assemblies w...

Construction structures and manufacturing processes for integrated...

High density interconnect system having rapid fabrication cycle

High density interconnect system having rapid fabrication cycle

High density interconnect system for IC packages and interconnect a...

Massively parallel interface for electronic circuit

Systems for testing and packaging integrated circuits

High density interconnect system for IC packages and interconnect a...

Massively parallel interface for electronic circuit

High density interconnect system having rapid fabrication cycle

Enhanced compliant probe card systems having improved planarity

Enhanced stress metal spring contactor

Miniaturized contact spring

Massively parallel interface for electronic circuit

Miniaturized contact spring

Construction structures and manufacturing processes for integrated...

Massively parallel interface for electronic circuit

Construction structures and manufacturing processes for probe card...

Construction structures and manufacturing processes for integrated...

Massively parallel interface for electronic circuits

Construction structures and manufacturing processes for integrated...

Systems for testing and packaging integrated circuits

Mosaic decal probe

Programmable high-density electronic device testing

Patents Applicationslast 30 patents

Method and Apparatus for Producing Controlled Stresses and Stress G...

Construction Structures and Manufacturing Processes for Integrated...

CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED...

Structures and Processes for Fabrication of Probe Card Assemblies w...

HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT A...

Construction Structures and Manufacturing Processes for Integrated...

High Density Interconnect System Having Rapid Fabrication Cycle

Method and Apparatus for Producing Controlled Stresses and Stress G...

MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUIT

HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE

SYSTEMS FOR TESTING AND PACKAGING INTEGRATED CIRCUITS

FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD

Miniaturized Contact Spring

MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUIT

Construction Structures and Manufacturing Processes for Integrated...

Systems for testing and packaging integrated circuits

High density interconnect system for IC packages and interconnect a...

Massively parallel interface for electronic circuit

High density interconnect system having rapid fabrication cycle

Standardized layout patterns and routing structures for integrated...

Massively parallel interface for electronic circuit

Construction structures and manufacturing processes for integrated...

Systems for testing and packaging integrated circuits

Enhanced compliant probe card systems having improved planarity

Mosaic decal probe

Construction structures and manufacturing processes for integrated...

MOSAIC DECAL PROBE

Miniaturized contact spring

Miniaturized contact spring

Construction structures and manufacturing processes for probe card...