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George J. Saxenmeyer Jr.
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Apalachin, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method and apparatus for in-situ testing of integrated circuit chips
Patent number
6,414,509
Issue date
Jul 2, 2002
International Business Machines Corporation
Anilkumar Chinuprasad Bhatt
G01 - MEASURING TESTING
Information
Patent Grant
Selectively filled adhesives for semiconductor chip interconnection...
Patent number
5,813,870
Issue date
Sep 29, 1998
International Business Machines Corporation
Michael Anthony Gaynes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a decoupling capacitor structure
Patent number
5,799,379
Issue date
Sep 1, 1998
International Business Machines Corporation
John Galvagni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Decoupling capacitor structure
Patent number
5,517,385
Issue date
May 14, 1996
International Business Machines Corporation
John Galvagni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density connector
Patent number
5,248,262
Issue date
Sep 28, 1993
International Business Machines Corporation
Raymond A. Busacco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a conductive end portion on a flexible circuit me...
Patent number
5,237,743
Issue date
Aug 24, 1993
International Business Machines Corporation
Raymond A. Busacco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical assembly with flexible circuit
Patent number
5,199,879
Issue date
Apr 6, 1993
International Business Machines Corporation
Harold Kohn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating nendritic materials
Patent number
5,185,073
Issue date
Feb 9, 1993
International Business Machines Corporation
Perminder S. Bindra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Separable electrical connection technology
Patent number
5,137,461
Issue date
Aug 11, 1992
International Business Machines Corporation
Perminder S. Bindra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Restorable backbond for LSI chips using liquid metal coated dendrites
Patent number
4,254,431
Issue date
Mar 3, 1981
International Business Machines Corporation
Robert Babuka
H01 - BASIC ELECTRIC ELEMENTS