Glenn F. Urbish

Person

Coral Springs, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method of forming capped chips
- Patent number 7,351,641
- Issue date Apr 1, 2008
- Tessera, Inc.
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-frequency chip packages
- Patent number 7,268,426
- Issue date Sep 11, 2007
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency chip packages with connecting elements
- Patent number 7,176,506
- Issue date Feb 13, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable fuel cell power supply
- Patent number 6,268,077
- Issue date Jul 31, 2001
- Motorola, Inc.
- Ronald J. Kelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with absorptive radiation shield
- Patent number 6,025,804
- Issue date Feb 15, 2000
- Motorola, Inc.
- James Lynn Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless electrical interconnection including metallized hook and...
- Patent number 5,774,341
- Issue date Jun 30, 1998
- Motorola, Inc.
- Glenn F. Urbish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quality forecasting engine
- Patent number 5,761,093
- Issue date Jun 2, 1998
- Motorola, Inc.
- Glenn F. Urbish
- G05 - CONTROLLING REGULATING
Information Patent Grant
One-way optical highway communication system
- Patent number 5,734,343
- Issue date Mar 31, 1998
- Motorola, Inc.
- Glenn F. Urbish
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multipoint electrical interconnection having deformable J-hooks
- Patent number 5,694,296
- Issue date Dec 2, 1997
- Motorola, Inc.
- Glenn F. Urbish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptable mold base
- Patent number 5,662,946
- Issue date Sep 2, 1997
- Motorola, Inc.
- Steven Duane Pratt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Rapid product realization process
- Patent number 5,659,478
- Issue date Aug 19, 1997
- Motorola, Inc.
- Robert W. Pennisi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method of molding precision parts
- Patent number 5,639,416
- Issue date Jun 17, 1997
- Motorola, Inc.
- Robert W. Pennisi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Microprocessor controlled portable battery charger and method of ch...
- Patent number 5,565,756
- Issue date Oct 15, 1996
- Motorola, Inc.
- Glenn F. Urbish
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Liquid crystal display with integral heater and method of fabricati...
- Patent number 5,559,614
- Issue date Sep 24, 1996
- Motorola, Inc.
- Glenn F. Urbish
- G02 - OPTICS
Information Patent Grant
Chip carrier having copper pattern plated with gold on one surface...
- Patent number 5,446,625
- Issue date Aug 29, 1995
- Motorola, Inc.
- Glenn F. Urbish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for producing molded parts
- Patent number 5,439,622
- Issue date Aug 8, 1995
- Motorola, Inc.
- Robert W. Pennisi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of making a substrate having selectively releasing conductiv...
- Patent number 5,338,391
- Issue date Aug 16, 1994
- Motorola, Inc.
- Anthony B. Suppelsa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Encapsulated electronic package
- Patent number 5,313,365
- Issue date May 17, 1994
- Motorola, Inc.
- Robert W. Pennisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively releasing conductive runner and substrate assembly
- Patent number 5,280,139
- Issue date Jan 18, 1994
- Motorola, Inc.
- Anthony B. Suppelsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless pad array chip carrier
- Patent number 5,241,133
- Issue date Aug 31, 1993
- Motorola, Inc.
- William B. Mullen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnection verification
- Patent number 5,184,768
- Issue date Feb 9, 1993
- Motorola, Inc.
- Robert S. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive adhesive and encapsulant material
- Patent number 5,136,365
- Issue date Aug 4, 1992
- Motorola, Inc.
- Robert W. Pennisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for photoimaging a three dimensional printed circuit substrate
- Patent number 5,001,038
- Issue date Mar 19, 1991
- Motorola, Inc.
- Dale W. Dorinski
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Moldable/foldable radio housing
- Patent number 4,939,792
- Issue date Jul 3, 1990
- Motorola, Inc.
- Glenn F. Urbish
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ultra thin radio housing with integral antenna
- Patent number 4,894,663
- Issue date Jan 16, 1990
- Motorola, Inc.
- Glenn F. Urbish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a one-piece injection molded battery contact assembly
- Patent number 4,877,569
- Issue date Oct 31, 1989
- Motorola, Inc.
- Glenn F. Urbish
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High density electrical lead
- Patent number 4,598,972
- Issue date Jul 8, 1986
- Motorola, Inc.
- William B. Mullen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High frequency chip packages with connecting elements
- Publication number 20070096160
- Publication date May 3, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method of forming capped chips
- Publication number 20060033189
- Publication date Feb 16, 2006
- Tessera, Inc.
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip handling methods and apparatus
- Publication number 20060013680
- Publication date Jan 19, 2006
- Tessera, Inc.
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Foldover packages and manufacturing and test methods therefor
- Publication number 20050150813
- Publication date Jul 14, 2005
- Tessera, Inc.
- Jesse Burl Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-frequency chip packages
- Publication number 20040238934
- Publication date Dec 2, 2004
- Tessera, Inc.
- Michael Warner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
High frequency chip packages with connecting elements
- Publication number 20040238857
- Publication date Dec 2, 2004
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS

Glenn F. Urbish

Person

Patents Grantslast 30 patents

Structure and method of forming capped chips

High-frequency chip packages

High frequency chip packages with connecting elements

Portable fuel cell power supply

Antenna with absorptive radiation shield

Solderless electrical interconnection including metallized hook and...

Quality forecasting engine

One-way optical highway communication system

Multipoint electrical interconnection having deformable J-hooks

Adaptable mold base

Rapid product realization process

Method of molding precision parts

Microprocessor controlled portable battery charger and method of ch...

Liquid crystal display with integral heater and method of fabricati...

Chip carrier having copper pattern plated with gold on one surface...

Method and apparatus for producing molded parts

Method of making a substrate having selectively releasing conductiv...

Encapsulated electronic package

Selectively releasing conductive runner and substrate assembly

Leadless pad array chip carrier

Solder interconnection verification

Anisotropic conductive adhesive and encapsulant material

Process for photoimaging a three dimensional printed circuit substrate

Moldable/foldable radio housing

Ultra thin radio housing with integral antenna

Method of making a one-piece injection molded battery contact assembly

High density electrical lead

Patents Applicationslast 30 patents

High frequency chip packages with connecting elements

Structure and method of forming capped chips

Chip handling methods and apparatus

Foldover packages and manufacturing and test methods therefor

High-frequency chip packages

High frequency chip packages with connecting elements