Hung Jen Wang

Person

Gueishan Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Thin double-sided package substrate and manufacture method thereof
- Patent number 8,013,434
- Issue date Sep 6, 2011
- Light Ocean Technology Corp.
- Chi Chih Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF
- Publication number 20090294952
- Publication date Dec 3, 2009
- TAIWAN SOLUTIONS SYSTEMS CORP.
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN DOUBLE-SIDED PACKAGE SUBSTRATE AND MANUFACTURE METHOD THEREOF
- Publication number 20080315239
- Publication date Dec 25, 2008
- Taiwan Solutions System Corp.
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package substrate and structure thereof
- Publication number 20080217759
- Publication date Sep 11, 2008
- Taiwan Solutions Systems Corp.
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor package
- Publication number 20080182360
- Publication date Jul 31, 2008
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor package and structure thereof
- Publication number 20080135939
- Publication date Jun 12, 2008
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating chip package structure
- Publication number 20070228541
- Publication date Oct 4, 2007
- Taiwan Solutions Systems Corp.
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate of chip package and chip package structure thereof
- Publication number 20070194430
- Publication date Aug 23, 2007
- Taiwan Solutions Systems Corp.
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS

Hung Jen Wang

Person

Patents Grantslast 30 patents

Thin double-sided package substrate and manufacture method thereof

Patents Applicationslast 30 patents

CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF

THIN DOUBLE-SIDED PACKAGE SUBSTRATE AND MANUFACTURE METHOD THEREOF

Chip package substrate and structure thereof

Fabrication method of semiconductor package

Fabrication method of semiconductor package and structure thereof

Method for fabricating chip package structure

Substrate of chip package and chip package structure thereof