Ilyas Mohammed

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structures for making direct metal-to-metal bonds at low temp...
- Patent number 12,136,605
- Issue date Nov 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable film assembly with conductive traces
- Patent number 12,124,035
- Issue date Oct 22, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked optical waveguides
- Patent number 11,914,148
- Issue date Feb 27, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- G02 - OPTICS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 11,894,345
- Issue date Feb 6, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked IC structure with orthogonal interconnect layers
- Patent number 11,881,454
- Issue date Jan 23, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for releveled bump planes for chiplets
- Patent number 11,862,604
- Issue date Jan 2, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over and under interconnects
- Patent number 11,830,804
- Issue date Nov 28, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 11,824,042
- Issue date Nov 21, 2023
- Xcelsis Corporation
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directly bonded structures without intervening adhesive and methods...
- Patent number 11,817,409
- Issue date Nov 14, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 11,557,516
- Issue date Jan 17, 2023
- Adeia Semiconductor Inc.
- Javier DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 11,515,291
- Issue date Nov 29, 2022
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures without intervening adhesive
- Patent number 11,476,213
- Issue date Oct 18, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 11,387,202
- Issue date Jul 12, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for releveled bump planes for chiplets
- Patent number 11,348,898
- Issue date May 31, 2022
- Xcelsis Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded lamination for improved image clarity in optical devices
- Patent number 11,256,004
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- G02 - OPTICS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Configurable smart object system with methods of making modules and...
- Patent number 11,246,230
- Issue date Feb 8, 2022
- Xcelsis Corporation
- Belgacem Haba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable smart object system with clip-based connectors
- Patent number 11,239,587
- Issue date Feb 1, 2022
- Xcelsis Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D processor having stacked integrated circuit die
- Patent number 11,152,336
- Issue date Oct 19, 2021
- Xcelsis Corporation
- Steven L. Teig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of a light-emitting diode display
- Patent number 11,024,220
- Issue date Jun 1, 2021
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structures for making direct metal-to-metal bonds at low temp...
- Patent number 11,011,494
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density three-dimensional integrated capacitors
- Patent number 11,004,930
- Issue date May 11, 2021
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,991,676
- Issue date Apr 27, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing power interconnect layer
- Patent number 10,978,348
- Issue date Apr 13, 2021
- Xcelsis Corporation
- Javier DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OVER AND UNDER INTERCONNECTS
- Publication number 20240347443
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED OPTICAL WAVEGUIDES
- Publication number 20240345399
- Publication date Oct 17, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- G02 - OPTICS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS
- Publication number 20240312957
- Publication date Sep 19, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP SHARING DATA BUS
- Publication number 20240266325
- Publication date Aug 8, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20240234320
- Publication date Jul 11, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR RELEVELED BUMP PLANES FOR CHIPLETS
- Publication number 20240162190
- Publication date May 16, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE
- Publication number 20230420399
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK
- Publication number 20230137580
- Publication date May 4, 2023
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMP...
- Publication number 20230118156
- Publication date Apr 20, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20230105341
- Publication date Apr 6, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS
- Publication number 20230090121
- Publication date Mar 23, 2023
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20220375891
- Publication date Nov 24, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE
- Publication number 20220199560
- Publication date Jun 23, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LAMINATION FOR IMPROVED IMAGE CLARITY IN OPTICAL DEVICES
- Publication number 20220155490
- Publication date May 19, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem HABA
- G02 - OPTICS
Information Patent Application
3D PROCESSOR
- Publication number 20220068890
- Publication date Mar 3, 2022
- Xcelsis Corporation
- Steven L. Teig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMP...
- Publication number 20220005784
- Publication date Jan 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Three-dimensional Integrated Capacitors
- Publication number 20210265460
- Publication date Aug 26, 2021
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Releveled Bump Planes for Chiplets
- Publication number 20210249383
- Publication date Aug 12, 2021
- Xcelsis Corporation
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20210202387
- Publication date Jul 1, 2021
- Xcelsis Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP SHARING DATA BUS
- Publication number 20210202445
- Publication date Jul 1, 2021
- Xcelsis Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES
- Publication number 20210181511
- Publication date Jun 17, 2021
- Invensas Corporation
- Belgacem Haba
- G02 - OPTICS
Information Patent Application
Systems and Methods for Releveled Bump Planes for Chiplets
- Publication number 20210175206
- Publication date Jun 10, 2021
- Xcelsis Corporation
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK
- Publication number 20210104436
- Publication date Apr 8, 2021
- Xcelsis Corporation
- Javier DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
- Publication number 20210050322
- Publication date Feb 18, 2021
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE OPTICAL ENGINE FOR VIRTUAL REALITY OR AUGMENTED REALITY HEAD...
- Publication number 20200409157
- Publication date Dec 31, 2020
- Invensas Corporation
- Belgacem Haba
- G02 - OPTICS
Information Patent Application
OVER AND UNDER INTERCONNECTS
- Publication number 20200321275
- Publication date Oct 8, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Ilyas Mohammed

Person

Patents Grantslast 30 patents

3D chip with shared clock distribution network

Layer structures for making direct metal-to-metal bonds at low temp...

Stretchable film assembly with conductive traces

Bonded structures with integrated passive component

Stacked optical waveguides

Integrated voltage regulator and passive components

Stacked IC structure with orthogonal interconnect layers

Systems and methods for releveled bump planes for chiplets

Over and under interconnects

Package-on-package assembly with wire bonds to encapsulation surface

3D chip sharing data bus

Directly bonded structures without intervening adhesive and methods...

Bonded structures with integrated passive component

3D chip with shared clock distribution network

Integrated voltage regulator and passive components

Bonded structures without intervening adhesive

Package-on-package assembly with wire bonds to encapsulation surface

Seal for microelectronic assembly

Nanowire bonding interconnect for fine-pitch microelectronics

Systems and methods for releveled bump planes for chiplets

Direct-bonded lamination for improved image clarity in optical devices

Seal for microelectronic assembly

Configurable smart object system with methods of making modules and...

Configurable smart object system with clip-based connectors

3D processor having stacked integrated circuit die

Formation of a light-emitting diode display

Layer structures for making direct metal-to-metal bonds at low temp...

High density three-dimensional integrated capacitors

Systems and methods for flash stacking

3D chip sharing power interconnect layer

Patents Applicationslast 30 patents

OVER AND UNDER INTERCONNECTS

STACKED OPTICAL WAVEGUIDES

INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS

3D CHIP SHARING DATA BUS

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SYSTEMS AND METHODS FOR RELEVELED BUMP PLANES FOR CHIPLETS

SEAL FOR MICROELECTRONIC ASSEMBLY

BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE

3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK

LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMP...

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS

SEAL FOR MICROELECTRONIC ASSEMBLY

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE

DIRECT-BONDED LAMINATION FOR IMPROVED IMAGE CLARITY IN OPTICAL DEVICES

3D PROCESSOR

LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMP...

High Density Three-dimensional Integrated Capacitors

Systems and Methods for Releveled Bump Planes for Chiplets

SYSTEMS AND METHODS FOR FLASH STACKING

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

3D CHIP SHARING DATA BUS

STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES

Systems and Methods for Releveled Bump Planes for Chiplets

3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK

Package-On-Package Assembly With Wire Bonds To Encapsulation Surface

REMOTE OPTICAL ENGINE FOR VIRTUAL REALITY OR AUGMENTED REALITY HEAD...

OVER AND UNDER INTERCONNECTS