Ismail C. Noyan

Person

Chappaqua, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for flattening a warped substrate
- Patent number 7,214,548
- Issue date May 8, 2007
- International Business Machines Corporation
- Mohammed F. Fayaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lightweight electronic equipment conductor with coolant permeable s...
- Patent number 6,734,363
- Issue date May 11, 2004
- International Business Machines Corporation
- Raymond Robert Horton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnects with Ti-containing liners
- Patent number 6,503,641
- Issue date Jan 7, 2003
- International Business Machines Corporation
- Cyril Cabral
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Growth of epitaxial semiconductor films in presence of reactive metal
- Patent number 6,211,042
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Fenton Read McFeely
- C30 - CRYSTAL GROWTH
Information Patent Grant
Computing system having a system supervisor and a collection of com...
- Patent number 6,029,199
- Issue date Feb 22, 2000
- International Business Machines Corporation
- Mark John Allen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductivity improvement in thin films of refractory metal
- Patent number 6,017,401
- Issue date Jan 25, 2000
- International Business Machines Corporation
- Fenton Read McFeely
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High efficiency thermal interposer
- Patent number 5,915,462
- Issue date Jun 29, 1999
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightweight packaging
- Patent number 5,847,926
- Issue date Dec 8, 1998
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging shaped beam lead fabrication
- Patent number 5,768,770
- Issue date Jun 23, 1998
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging shaped beam lead fabrication
- Patent number 5,734,196
- Issue date Mar 31, 1998
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for multilayer conductor chip packaging
- Patent number 5,675,884
- Issue date Oct 14, 1997
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency thermal interposer
- Patent number 5,669,437
- Issue date Sep 23, 1997
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder application system using helix to control solder meniscus
- Patent number 5,446,261
- Issue date Aug 29, 1995
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate multiple location conductor attachment technology
- Patent number 5,322,204
- Issue date Jun 21, 1994
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond removal apparatus using alternating fluid stream
- Patent number 5,263,620
- Issue date Nov 23, 1993
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate multiple location conductor attachment technology
- Patent number 5,233,221
- Issue date Aug 3, 1993
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding dielectric mounted conductors to semiconductor c...
- Patent number 5,229,328
- Issue date Jul 20, 1993
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fluxless solder bonding
- Patent number 5,205,461
- Issue date Apr 27, 1993
- International Business Machines Corporation
- Harry R. Bickford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device elastomeric mounting and interconnection technology
- Patent number 5,186,632
- Issue date Feb 16, 1993
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate multiple location conductor attachment technology
- Patent number 5,117,275
- Issue date May 26, 1992
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical connectors
- Patent number 5,093,879
- Issue date Mar 3, 1992
- International Business Machines Corporation
- Mark F. Bregman
- G02 - OPTICS
Information Patent Grant
Optical bus for computer systems
- Patent number 5,093,890
- Issue date Mar 3, 1992
- International Business Machines Corporation
- Mark F. Bregman
- G02 - OPTICS
Information Patent Grant
Composition and coating to prevent current induced electrochemical...
- Patent number 5,074,969
- Issue date Dec 24, 1991
- IBM Corporation
- William D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High strength low stress encapsulation of interconnected semiconduc...
- Patent number 5,047,834
- Issue date Sep 10, 1991
- International Business Machines Corporation
- Caroline A. Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and coating to prevent current induced electrochemical...
- Patent number 5,038,195
- Issue date Aug 6, 1991
- IBM
- William D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional microelectric packaging
- Patent number 5,006,925
- Issue date Apr 9, 1991
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Atomic laminates for diffucion barrier applications
- Publication number 20090302474
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Katayun Barmak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic laminates for diffusion barrier applications
- Publication number 20050070097
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Katayun Barmak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects with Ti-containing liners
- Publication number 20020076574
- Publication date Jun 20, 2002
- International Business Machines Corporation
- Cyril Cabral
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Ismail C. Noyan

Person

Patents Grantslast 30 patents

Apparatus and method for flattening a warped substrate

Lightweight electronic equipment conductor with coolant permeable s...

Interconnects with Ti-containing liners

Growth of epitaxial semiconductor films in presence of reactive metal

Computing system having a system supervisor and a collection of com...

Conductivity improvement in thin films of refractory metal

High efficiency thermal interposer

Lightweight packaging

Electronic packaging shaped beam lead fabrication

Electronic packaging shaped beam lead fabrication

Apparatus for multilayer conductor chip packaging

High efficiency thermal interposer

Solder application system using helix to control solder meniscus

Electronic substrate multiple location conductor attachment technology

Wirebond removal apparatus using alternating fluid stream

Electronic substrate multiple location conductor attachment technology

Method for bonding dielectric mounted conductors to semiconductor c...

Method and apparatus for fluxless solder bonding

Electronic device elastomeric mounting and interconnection technology

Electronic substrate multiple location conductor attachment technology

Electro-optical connectors

Optical bus for computer systems

Composition and coating to prevent current induced electrochemical...

High strength low stress encapsulation of interconnected semiconduc...

Composition and coating to prevent current induced electrochemical...

Three dimensional microelectric packaging

Patents Applicationslast 30 patents

Atomic laminates for diffucion barrier applications

Atomic laminates for diffusion barrier applications

Interconnects with Ti-containing liners