Jeremy A. Theil

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low temperature bonded structures
- Patent number 12,132,020
- Issue date Oct 29, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 12,125,784
- Issue date Oct 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,100,676
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,046,571
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,837,582
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a surface for direct-bonding
- Patent number 11,804,377
- Issue date Oct 31, 2023
- Adeia Semiconductor Bonding Technologies, Inc.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,764,189
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,756,880
- Issue date Sep 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 11,515,279
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 11,244,916
- Issue date Feb 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,158,606
- Issue date Oct 26, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,158,573
- Issue date Oct 26, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding surfaces for microelectronics
- Patent number 11,056,348
- Issue date Jul 6, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 10,840,205
- Issue date Nov 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 10,790,262
- Issue date Sep 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of colorimetric transducers and detector
- Patent number 7,939,022
- Issue date May 10, 2011
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jeremy A. Theil
- G01 - MEASURING TESTING
Information Patent Grant
Scented material dispense system for a hand-held device
- Patent number 7,152,758
- Issue date Dec 26, 2006
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Ronald Shane Fazzio
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integration of thermal regulation and electronic fluid sensing
- Patent number 7,096,716
- Issue date Aug 29, 2006
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Jeremy A. Theil
- G01 - MEASURING TESTING
Information Patent Grant
Simplified upper electrode contact structure for PIN diode active p...
- Patent number 6,902,946
- Issue date Jun 7, 2005
- Agilent Technologies, Inc.
- Jeremy A. Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature photonic crystal structures
- Patent number 6,786,968
- Issue date Sep 7, 2004
- Agilent Technologies, Inc.
- Jeremy A. Theil
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Image sensor with pixel isolation system and manufacturing method t...
- Patent number 6,759,262
- Issue date Jul 6, 2004
- Agilent Technologies, Inc.
- Jeremy A. Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation of alpha silicon diode sensors through ion implantation
- Patent number 6,759,724
- Issue date Jul 6, 2004
- Agilent Technologies, Inc.
- Min Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for stub tunable resonant cavity for photonic...
- Patent number 6,747,773
- Issue date Jun 8, 2004
- Agilent Technologies, Inc.
- Jeremy A. Theil
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Simplified upper electrode contact structure for PIN diode active p...
- Patent number 6,649,993
- Issue date Nov 18, 2003
- Agilent Technologies, Inc.
- Jeremy A Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation of alpha silicon diode sensors through ion implantation
- Patent number 6,586,812
- Issue date Jul 1, 2003
- Agilent Technologies, Inc.
- Min Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo diode pixel sensor array having a guard ring
- Patent number 6,545,711
- Issue date Apr 8, 2003
- Agilent Technologies, Inc.
- Frederick A. Perner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical vapor deposition method for amorphous silicon and resultin...
- Patent number 6,436,488
- Issue date Aug 20, 2002
- Agilent Technologies, Inc.
- Jeremy A Theil
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive mesh bias connection for an array of elevated active pix...
- Patent number 6,396,118
- Issue date May 28, 2002
- Agilent Technologies, Inc.
- Jeremy A. Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for bonding layers in a semiconductor device
- Patent number 6,387,736
- Issue date May 14, 2002
- Agilent Technologies, Inc.
- Min Cao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE MATERIALS FOR DIRECT BONDING
- Publication number 20250006679
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240379539
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT BONDED AND INTERCONNECTED STACK
- Publication number 20240243103
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
- Publication number 20240234159
- Publication date Jul 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...
- Publication number 20240213191
- Publication date Jun 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
- Publication number 20240136196
- Publication date Apr 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20240113059
- Publication date Apr 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240047344
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROL FOR BONDING
- Publication number 20230299029
- Publication date Sep 21, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230268300
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20230268307
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT BONDED AND INTERCONNECTED STACK
- Publication number 20230253367
- Publication date Aug 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS DIRECT HYBRID BONDING
- Publication number 20230197655
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING AND DEBONDING OF ELEMENTS
- Publication number 20230197496
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF...
- Publication number 20230197453
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20230140107
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20220165692
- Publication date May 26, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT BONDED AND INTERCONNECTED STACK
- Publication number 20220020729
- Publication date Jan 20, 2022
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20220013456
- Publication date Jan 13, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SURFACES FOR MICROELECTRONICS
- Publication number 20210287910
- Publication date Sep 16, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Jeremy Alfred THEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20200381389
- Publication date Dec 3, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20200126906
- Publication date Apr 23, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20200051937
- Publication date Feb 13, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT BONDED AND INTERCONNECTED STACK
- Publication number 20200013754
- Publication date Jan 9, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20190319007
- Publication date Oct 17, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS

Jeremy A. Theil

Person

Patents Grantslast 30 patents

Low temperature bonded structures

Interconnect structures

Low temperature bonded structures

Low temperature bonded structures

Molded direct bonded and interconnected stack

Method for preparing a surface for direct-bonding

Molded direct bonded and interconnected stack

Interconnect structures

Chemical mechanical polishing for hybrid bonding

Low temperature bonded structures

Low temperature bonded structures

Molded direct bonded and interconnected stack

Interconnect structures

Bonding surfaces for microelectronics

Chemical mechanical polishing for hybrid bonding

Low temperature bonded structures

Integration of colorimetric transducers and detector

Scented material dispense system for a hand-held device

Integration of thermal regulation and electronic fluid sensing

Simplified upper electrode contact structure for PIN diode active p...

Method for low temperature photonic crystal structures

Image sensor with pixel isolation system and manufacturing method t...

Isolation of alpha silicon diode sensors through ion implantation

Method and structure for stub tunable resonant cavity for photonic...

Simplified upper electrode contact structure for PIN diode active p...

Isolation of alpha silicon diode sensors through ion implantation

Photo diode pixel sensor array having a guard ring

Chemical vapor deposition method for amorphous silicon and resultin...

Conductive mesh bias connection for an array of elevated active pix...

Method and structure for bonding layers in a semiconductor device

Patents Applicationslast 30 patents

CONDUCTIVE MATERIALS FOR DIRECT BONDING

INTERCONNECT STRUCTURES

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING

CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...

METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING

LOW TEMPERATURE BONDED STRUCTURES

INTERCONNECT STRUCTURES

LOW TEMPERATURE DIRECT BONDING

EXPANSION CONTROL FOR BONDING

BONDED STRUCTURES

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

LOW TEMPERATURE BONDED STRUCTURES

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

LOW STRESS DIRECT HYBRID BONDING

DIRECT BONDING AND DEBONDING OF ELEMENTS

STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF...

DIRECT BONDING METHODS AND STRUCTURES

LOW TEMPERATURE BONDED STRUCTURES

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

INTERCONNECT STRUCTURES

BONDING SURFACES FOR MICROELECTRONICS

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

LOW TEMPERATURE BONDED STRUCTURES

INTERCONNECT STRUCTURES

LOW TEMPERATURE BONDED STRUCTURES

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

LOW TEMPERATURE BONDED STRUCTURES