John H. Lau

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and optical signal transmitter
- Patent number 11,860,428
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure and method of manufacturing th...
- Patent number 11,824,012
- Issue date Nov 21, 2023
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card testing device
- Patent number 11,808,787
- Issue date Nov 7, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,710,690
- Issue date Jul 25, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,612
- Issue date Jun 20, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,665,832
- Issue date May 30, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of the chip package structure having at least...
- Patent number 11,562,972
- Issue date Jan 24, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,540,396
- Issue date Dec 27, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,516,910
- Issue date Nov 29, 2022
- Unimicron Technology Corp.
- Chia-Yu Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,410,933
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having at least one chip and at least one th...
- Patent number 11,145,610
- Issue date Oct 12, 2021
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having embedded interposer and fabrication meth...
- Patent number 9,385,056
- Issue date Jul 5, 2016
- Unimicron Technology Corporation
- Dyi-Chung Hu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thinned integrated circuit device and manufacturing process for the...
- Patent number 9,252,054
- Issue date Feb 2, 2016
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method of semiconductor device
- Patent number 8,673,658
- Issue date Mar 18, 2014
- Industrial Technology Research Institute
- Ming-Che Hsieh
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 8,674,491
- Issue date Mar 18, 2014
- Industrial Technology Research Institute
- Chun-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging structure
- Patent number 8,536,701
- Issue date Sep 17, 2013
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stacking structure and fabricating method of the chip stacking...
- Patent number 8,519,524
- Issue date Aug 27, 2013
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring apparatus that includes a chip having a through silicon v...
- Patent number 8,502,224
- Issue date Aug 6, 2013
- Industrial Technology Research Institute
- Ra-Min Tain
- G01 - MEASURING TESTING
Information Patent Grant
Filled through-silicon via with conductive composite material
- Patent number 8,456,017
- Issue date Jun 4, 2013
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method and testing method of semiconductor device and m...
- Patent number 8,397,584
- Issue date Mar 19, 2013
- Industrial Technology Research Institute
- Ming-Che Hsieh
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240248264
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234371
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE
- Publication number 20240014145
- Publication date Jan 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402441
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER
- Publication number 20230400649
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230163074
- Publication date May 25, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20230137841
- Publication date May 4, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER STRUCTURE
- Publication number 20230067112
- Publication date Mar 2, 2023
- Unimicron Technology Corp.
- Ra-Min Tain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220344248
- Publication date Oct 27, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336333
- Publication date Oct 20, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20220328387
- Publication date Oct 13, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220256717
- Publication date Aug 11, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220130781
- Publication date Apr 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220108953
- Publication date Apr 7, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220069489
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071000
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071015
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20220068832
- Publication date Mar 3, 2022
- UNIMICRON TECHNOLOGY CORPORATION
- KAI-MING YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD TESTING DEVICE
- Publication number 20220065897
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF THE CHIP PACKAGE STRUCTURE
- Publication number 20210398925
- Publication date Dec 23, 2021
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210247147
- Publication date Aug 12, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210251107
- Publication date Aug 12, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210202407
- Publication date Jul 1, 2021
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED INTEGRATED CIRCUIT DEVICE AND MANUFACTURING PROCESS FOR THE...
- Publication number 20150076682
- Publication date Mar 19, 2015
- Industrial Technology Research Institute
- Sheng-Tsai WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130171747
- Publication date Jul 4, 2013
- Industrial Technology Research Institute
- Ming-Che Hsieh
- G01 - MEASURING TESTING
Information Patent Application
PACKAGING SUBSTRATE HAVING EMBEDDED INTERPOSER AND FABRICATION METH...
- Publication number 20130032390
- Publication date Feb 7, 2013
- Industrial Technology Research Institute
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20120322249
- Publication date Dec 20, 2012
- Industrial Technology Research Institute
- Jui-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING STRUCTURE
- Publication number 20120280385
- Publication date Nov 8, 2012
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF
- Publication number 20120273939
- Publication date Nov 1, 2012
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE AND MEASUREMENT METHOD THEREOF
- Publication number 20120249176
- Publication date Oct 4, 2012
- Industrial Technology Research Institute
- Heng-Chieh Chien
- G01 - MEASURING TESTING

John H. Lau

Person

Patents Grantslast 30 patents

Package structure and optical signal transmitter

Integrated circuit package structure and method of manufacturing th...

Probe card testing device

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Manufacturing method of the chip package structure having at least...

Circuit board structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Package structure and manufacturing method thereof

Chip package structure having at least one chip and at least one th...

Packaging substrate having embedded interposer and fabrication meth...

Thinned integrated circuit device and manufacturing process for the...

Fabricating method of semiconductor device

Semiconductor device

Electronic device packaging structure

Chip stacking structure and fabricating method of the chip stacking...

Measuring apparatus that includes a chip having a through silicon v...

Filled through-silicon via with conductive composite material

Fabricating method and testing method of semiconductor device and m...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER

CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE

VAPOR CHAMBER STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

PROBE CARD TESTING DEVICE

MANUFACTURING METHOD OF THE CHIP PACKAGE STRUCTURE

VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF

VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

THINNED INTEGRATED CIRCUIT DEVICE AND MANUFACTURING PROCESS FOR THE...

FABRICATING METHOD OF SEMICONDUCTOR DEVICE

PACKAGING SUBSTRATE HAVING EMBEDDED INTERPOSER AND FABRICATION METH...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

ELECTRONIC DEVICE PACKAGING STRUCTURE

FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF

TEST STRUCTURE AND MEASUREMENT METHOD THEREOF