Jonathan H. Hammond

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 11,069,590
- Issue date Jul 20, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 10,964,554
- Issue date Mar 30, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 10,950,518
- Issue date Mar 16, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 10,903,132
- Issue date Jan 26, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance and manufacturing met...
- Patent number 10,882,740
- Issue date Jan 5, 2021
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,804,179
- Issue date Oct 13, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,773,952
- Issue date Sep 15, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Switch arrangements for microelectromechanical systems
- Patent number 10,770,253
- Issue date Sep 8, 2020
- Qorvo US, Inc.
- Nadim Khlat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing product wafers using carrier substrates
- Patent number 10,759,660
- Issue date Sep 1, 2020
- Qorvo US, Inc.
- Jonathan Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,679,918
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,676,348
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,636,720
- Issue date Apr 28, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,600,711
- Issue date Mar 24, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,589,993
- Issue date Mar 17, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,549,988
- Issue date Feb 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,529,639
- Issue date Jan 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,486,965
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,490,476
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,486,963
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,442,684
- Issue date Oct 15, 2019
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,442,687
- Issue date Oct 15, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,407,302
- Issue date Sep 10, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,377,627
- Issue date Aug 13, 2019
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,364,146
- Issue date Jul 30, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,239,751
- Issue date Mar 26, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,227,231
- Issue date Mar 12, 2019
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,196,260
- Issue date Feb 5, 2019
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,160,643
- Issue date Dec 25, 2018
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,155,658
- Issue date Dec 18, 2018
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,109,550
- Issue date Oct 23, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200118838
- Publication date Apr 16, 2020
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200115220
- Publication date Apr 16, 2020
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200102217
- Publication date Apr 2, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SWITCH ARRANGEMENTS FOR MICROELECTROMECHANICAL SYSTEMS
- Publication number 20190172671
- Publication date Jun 6, 2019
- Qorvo US, Inc.
- Nadim Khlat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20190057922
- Publication date Feb 21, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180047653
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180044169
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180044177
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20170334710
- Publication date Nov 23, 2017
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTACT MEMS ARCHITECTURE FOR IMPROVED CYCLE COUNT AND HOT-SWITCHIN...
- Publication number 20170018378
- Publication date Jan 19, 2017
- Qorvo US, Inc.
- Nadim Khlat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MODULE WITH ENHANCED PROPERTIES
- Publication number 20160343592
- Publication date Nov 24, 2016
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES...
- Publication number 20160023892
- Publication date Jan 28, 2016
- RF Micro Devices, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICRO-ELECTROMECHANICAL SYSTEM SWITCH AND METHOD OF MA...
- Publication number 20160027601
- Publication date Jan 28, 2016
- RF Micro Devices, Inc.
- Jonathan Hale Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS WAFER ASSEMBLY
- Publication number 20150353348
- Publication date Dec 10, 2015
- RF Micro Devices, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING PRODUCT WAFERS USING CARRIER SUBSTRATES
- Publication number 20150329355
- Publication date Nov 19, 2015
- RF Micro Devices, Inc.
- Jonathan Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RF FRONT-END CIRCUITRY WITH TRANSISTOR AND MICROELECTROMECHANICAL M...
- Publication number 20150303976
- Publication date Oct 22, 2015
- RF Micro Devices, Inc.
- Nadim Khlat
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CONTACT MEMS ARCHITECTURE FOR IMPROVED CYCLE COUNT AND HOT-SWITCHIN...
- Publication number 20140015731
- Publication date Jan 16, 2014
- Nadim Khlat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHUNT SWITCH AT COMMON PORT TO REDUCE HOT SWITCHING
- Publication number 20130207714
- Publication date Aug 15, 2013
- RF Micro Devices, Inc.
- Ruediger Bauder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER
- Publication number 20120193781
- Publication date Aug 2, 2012
- RF Micro Devices, Inc.
- Julio Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATION SIGNAL FOR MICROACTUATOR BOUNCE AND RING SUPPRESSION
- Publication number 20120175230
- Publication date Jul 12, 2012
- RF Micro Devices, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICRO-ELECTROMECHANICAL SYSTEM SWITCH AND METHOD OF MA...
- Publication number 20120175715
- Publication date Jul 12, 2012
- RF Micro Devices, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS device and method of fabrication
- Publication number 20070090474
- Publication date Apr 26, 2007
- Gary G. Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stress release mechanism in MEMS device and method of making same
- Publication number 20070024156
- Publication date Feb 1, 2007
- Gary G. Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEM structure having reduced spring stiction
- Publication number 20050229706
- Publication date Oct 20, 2005
- Jan E. Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jonathan H. Hammond

Person

Patents Grantslast 30 patents

Wafer-level fan-out package with enhanced performance

Wafer-level fan-out package with enhanced performance

Wafer-level fan-out package with enhanced performance

Wafer-level fan-out package with enhanced performance

Wafer-level package with enhanced performance and manufacturing met...

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Switch arrangements for microelectromechanical systems

Method for processing product wafers using carrier substrates

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Patents Applicationslast 30 patents

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

SWITCH ARRANGEMENTS FOR MICROELECTROMECHANICAL SYSTEMS

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

CONTACT MEMS ARCHITECTURE FOR IMPROVED CYCLE COUNT AND HOT-SWITCHIN...

FLIP CHIP MODULE WITH ENHANCED PROPERTIES

RADIO FREQUENCY (RF) MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES...

ENCAPSULATED MICRO-ELECTROMECHANICAL SYSTEM SWITCH AND METHOD OF MA...

GLASS WAFER ASSEMBLY

METHOD FOR PROCESSING PRODUCT WAFERS USING CARRIER SUBSTRATES

RF FRONT-END CIRCUITRY WITH TRANSISTOR AND MICROELECTROMECHANICAL M...

CONTACT MEMS ARCHITECTURE FOR IMPROVED CYCLE COUNT AND HOT-SWITCHIN...

SHUNT SWITCH AT COMMON PORT TO REDUCE HOT SWITCHING

CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER

ACTUATION SIGNAL FOR MICROACTUATOR BOUNCE AND RING SUPPRESSION

ENCAPSULATED MICRO-ELECTROMECHANICAL SYSTEM SWITCH AND METHOD OF MA...

MEMS device and method of fabrication

Stress release mechanism in MEMS device and method of making same

MEM structure having reduced spring stiction