Jurgen Weichart

Person

Balzers, LI

People

Patents Grantslast 30 patents

Information Patent Grant
Chamber for degassing substrates
- Patent number 11,776,825
- Issue date Oct 3, 2023
- EVATEC AG
- Rogier Lodder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF capacitive coupled etch reactor
- Patent number 11,742,187
- Issue date Aug 29, 2023
- EVATEC AG
- Johannes Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum plasma workpiece treatment apparatus
- Patent number 11,469,085
- Issue date Oct 11, 2022
- EVATEC AG
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF capacitive coupled dual frequency etch reactor
- Patent number 11,217,434
- Issue date Jan 4, 2022
- EVATEC AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arc suppression and pulsing in high power impulse magnetron sputter...
- Patent number 11,211,234
- Issue date Dec 28, 2021
- EVATEC AG
- Stanislav Kadlec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum treatment chamber and method of manufacturing a vacuum treat...
- Patent number 11,145,495
- Issue date Oct 12, 2021
- EVATEC AG
- Frantisek Balon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF substrate bias with high power impulse magnetron sputtering (HIP...
- Patent number 10,692,707
- Issue date Jun 23, 2020
- EVATEC AG
- Jürgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chamber for degassing substrates
- Patent number 10,580,671
- Issue date Mar 3, 2020
- EVATEC AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber for degassing substrates
- Patent number 10,403,522
- Issue date Sep 3, 2019
- EVATEC AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for depositing a layer on a substrate in a processing gas
- Patent number 10,388,559
- Issue date Aug 20, 2019
- EVATEC AG
- Sven Uwe Rieschl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chamber for degassing substrates
- Patent number 9,934,992
- Issue date Apr 3, 2018
- EVATEC AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Target shaping
- Patent number 9,611,537
- Issue date Apr 4, 2017
- EVATEC AG
- Stanislav Kadlec
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing a directional layer by cathode sputtering, and...
- Patent number 9,587,306
- Issue date Mar 7, 2017
- EVATEC AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for depositing a layer onto a substrate
- Patent number 9,490,166
- Issue date Nov 8, 2016
- EVATEC AG
- Sven Uwe Rieschl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Arc suppression and pulsing in high power impulse magnetron sputter...
- Patent number 9,355,824
- Issue date May 31, 2016
- EVATEC AG
- Stanislav Kadlec
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing magnetron coated substrates and magnetron...
- Patent number 8,778,144
- Issue date Jul 15, 2014
- Oerlikon Advanced Technologies AG
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Procedure and device for the production of a plasma
- Patent number 8,613,828
- Issue date Dec 24, 2013
- OC Oerlikon Balzers AG
- Jürgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of HIPIMS to through silicon via metallization in three...
- Patent number 8,475,634
- Issue date Jul 2, 2013
- OC Oerlikon Balzers AF
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF substrate bias with high power impulse magnetron sputtering (HIP...
- Patent number 8,435,389
- Issue date May 7, 2013
- OC Oerlikon Balzers AG
- Stanislav Kadlec
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF sputtering arrangement
- Patent number 8,268,142
- Issue date Sep 18, 2012
- OC Oerlikon Balzers AG
- Jürgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Installation for processing a substrate
- Patent number 7,736,462
- Issue date Jun 15, 2010
- OC Oerlikon Balzers AG
- Jurgen Weichart
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Procedure and device for the production of a plasma
- Patent number 7,476,301
- Issue date Jan 13, 2009
- OC Oerlikon Balzers AG
- Jürgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHAMBER FOR DEGASSING SUBSTRATES
- Publication number 20230395402
- Publication date Dec 7, 2023
- Evatec AG
- Rogier Lodder
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
VACUUM PROCESS TREATMENT CHAMBER AND METHOD OF TREATING A SUBSTRATE...
- Publication number 20220396864
- Publication date Dec 15, 2022
- Evatec AG
- Jürgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION (PEALD) APPARATUS
- Publication number 20210348274
- Publication date Nov 11, 2021
- Evatec AG
- Jörg PATSCHEIDER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APARATUS FOR LOW PARTICLE PLASMA ETCHING
- Publication number 20210319984
- Publication date Oct 14, 2021
- Evatec AG
- Jürgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR TREATING A SUBSTRATE
- Publication number 20210202282
- Publication date Jul 1, 2021
- Evatec AG
- Johannes Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF CAPACITIVE COUPLED DUAL FREQUENCY ETCH REACTOR
- Publication number 20200312624
- Publication date Oct 1, 2020
- Evatec AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMEATION-BARRIER
- Publication number 20200230643
- Publication date Jul 23, 2020
- Evatec AG
- Rico Benz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PERMEATION-BARRIER
- Publication number 20200216955
- Publication date Jul 9, 2020
- Evatec AG
- Rico BENZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER FOR DEGASSING SUBSTRATES
- Publication number 20190348311
- Publication date Nov 14, 2019
- Evatec AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PLASMA WORKPIECE TREATMENT APPARATUS
- Publication number 20190341234
- Publication date Nov 7, 2019
- Evatec AG
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF CAPACITIVE COUPLED ETCH REACTOR
- Publication number 20190341231
- Publication date Nov 7, 2019
- Evatec AG
- Johannes Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM TREATMENT CHAMBER AND METHOD OF MANUFACTURING A VACUUM TREAT...
- Publication number 20190252160
- Publication date Aug 15, 2019
- Evatec AG
- Frantisek Balon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER FOR DEGASSING SUBSTRATES
- Publication number 20190096715
- Publication date Mar 28, 2019
- Evatec AG
- Rogier Lodder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD ESPECIALLY FOR DEGASSING OF SUBSTRATES
- Publication number 20180261473
- Publication date Sep 13, 2018
- Evatec AG
- Jürgen WEICHART
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER FOR DEGASSING SUBSTRATES
- Publication number 20180174872
- Publication date Jun 21, 2018
- Evatec AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTERING SOURCE ARRANGEMENT, SPUTTERING SYSTEM AND METHOD OF MANU...
- Publication number 20170175247
- Publication date Jun 22, 2017
- Evatec AG
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR DEPOSITING A LAYER ON A SUBSTRATE IN A PROCESSING GAS
- Publication number 20170011951
- Publication date Jan 12, 2017
- Evatec AG
- Sven Uwe Rieschl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER FOR DEGASSING SUBSTRATES
- Publication number 20160336204
- Publication date Nov 17, 2016
- Evatec AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARC SUPPRESSION AND PULSING IN HIGH POWER IMPULSE MAGNETRON SPUTTER...
- Publication number 20160237554
- Publication date Aug 18, 2016
- Evatec AG
- Stanislav Kadlec
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FILLING VIAS AND SUBSTRATE-VIA FILLING VACUUM PROCESSING...
- Publication number 20160108515
- Publication date Apr 21, 2016
- EVATEC ADVANCED TECHNOLOGIES AG
- MOHAMED ELGHAZZALI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF COATING BY PULSED BIPOLAR SPUTTERING
- Publication number 20150184284
- Publication date Jul 2, 2015
- Oerlikon Advanced Technologies AG
- Mohamed Elghazzali
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PVD APPARATUS FOR DIRECTIONAL MATERIAL DEPOSITION, METHODS AND WORK...
- Publication number 20150114826
- Publication date Apr 30, 2015
- Oerlikon Advanced Technologies AG
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING CHAMBER
- Publication number 20140349011
- Publication date Nov 27, 2014
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE
- Publication number 20130288477
- Publication date Oct 31, 2013
- OC OERLIKON BALZERS AG
- Sven Uwe Rieschl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF SUBSTRATE BIAS WITH HIGH POWER IMPULSE MAGNETRON SPUTTERING (HIP...
- Publication number 20130220802
- Publication date Aug 29, 2013
- OC OERLIKON BALZERS AG
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TARGET SHAPING
- Publication number 20110203920
- Publication date Aug 25, 2011
- OC OERLIKON BALZERS AG
- Stanislav Kadlec
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF SPUTTERING ARRANGEMENT
- Publication number 20100155238
- Publication date Jun 24, 2010
- OC OERLIKON BALZERS AG
- Jürgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING CHAMBER
- Publication number 20090252892
- Publication date Oct 8, 2009
- OC OERLIKON BALZERS AG
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Procedure and device for the production of a plasma
- Publication number 20090145554
- Publication date Jun 11, 2009
- OC Oerlikon Balzers AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a directional layer by cathode sputtering, and...
- Publication number 20090134011
- Publication date May 28, 2009
- OC Oerlikon Balzers AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Jurgen Weichart

Person

Patents Grantslast 30 patents

Chamber for degassing substrates

RF capacitive coupled etch reactor

Vacuum plasma workpiece treatment apparatus

RF capacitive coupled dual frequency etch reactor

Arc suppression and pulsing in high power impulse magnetron sputter...

Vacuum treatment chamber and method of manufacturing a vacuum treat...

RF substrate bias with high power impulse magnetron sputtering (HIP...

Chamber for degassing substrates

Chamber for degassing substrates

Apparatus for depositing a layer on a substrate in a processing gas

Chamber for degassing substrates

Target shaping

Method for producing a directional layer by cathode sputtering, and...

Apparatus and method for depositing a layer onto a substrate

Arc suppression and pulsing in high power impulse magnetron sputter...

Method for manufacturing magnetron coated substrates and magnetron...

Procedure and device for the production of a plasma

Application of HIPIMS to through silicon via metallization in three...

RF substrate bias with high power impulse magnetron sputtering (HIP...

RF sputtering arrangement

Installation for processing a substrate

Procedure and device for the production of a plasma

Patents Applicationslast 30 patents

CHAMBER FOR DEGASSING SUBSTRATES

VACUUM PROCESS TREATMENT CHAMBER AND METHOD OF TREATING A SUBSTRATE...

PLASMA ENHANCED ATOMIC LAYER DEPOSITION (PEALD) APPARATUS

METHOD AND APARATUS FOR LOW PARTICLE PLASMA ETCHING

METHOD AND APPARATUS FOR TREATING A SUBSTRATE

RF CAPACITIVE COUPLED DUAL FREQUENCY ETCH REACTOR

PERMEATION-BARRIER

PERMEATION-BARRIER

CHAMBER FOR DEGASSING SUBSTRATES

VACUUM PLASMA WORKPIECE TREATMENT APPARATUS

RF CAPACITIVE COUPLED ETCH REACTOR

VACUUM TREATMENT CHAMBER AND METHOD OF MANUFACTURING A VACUUM TREAT...

CHAMBER FOR DEGASSING SUBSTRATES

APPARATUS AND METHOD ESPECIALLY FOR DEGASSING OF SUBSTRATES

CHAMBER FOR DEGASSING SUBSTRATES

SPUTTERING SOURCE ARRANGEMENT, SPUTTERING SYSTEM AND METHOD OF MANU...

APPARATUS FOR DEPOSITING A LAYER ON A SUBSTRATE IN A PROCESSING GAS

CHAMBER FOR DEGASSING SUBSTRATES

ARC SUPPRESSION AND PULSING IN HIGH POWER IMPULSE MAGNETRON SPUTTER...

METHOD FOR FILLING VIAS AND SUBSTRATE-VIA FILLING VACUUM PROCESSING...

METHOD OF COATING BY PULSED BIPOLAR SPUTTERING

PVD APPARATUS FOR DIRECTIONAL MATERIAL DEPOSITION, METHODS AND WORK...

PROCESSING CHAMBER

APPARATUS AND METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE

RF SUBSTRATE BIAS WITH HIGH POWER IMPULSE MAGNETRON SPUTTERING (HIP...

TARGET SHAPING

RF SPUTTERING ARRANGEMENT

PROCESSING CHAMBER

Procedure and device for the production of a plasma

Method for producing a directional layer by cathode sputtering, and...