Kazuo Teshirogi

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 9,010,615
- Issue date Apr 21, 2015
- Fujitsu Semiconductor Limited
- Kazuhiro Yoshimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bumps, semiconductor device and method for manuf...
- Patent number 8,962,470
- Issue date Feb 24, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and surface protectiv...
- Patent number 8,444,799
- Issue date May 21, 2013
- Fujitsu Semiconductor Limited
- Hironori Fukaya
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor device with spraying fluid
- Patent number 8,440,545
- Issue date May 14, 2013
- Fujitsu Semiconductor Limited
- Hironori Fukaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film bonding method, film bonding apparatus, and semiconductor devi...
- Patent number 8,016,973
- Issue date Sep 13, 2011
- Fujitsu Semiconductor Limited
- Yoshiaki Shinjo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor wafer storage case and semiconductor wafer storing me...
- Patent number 7,857,140
- Issue date Dec 28, 2010
- Fujitsu Semiconductor Limited
- Yoshiaki Shinjo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,820,487
- Issue date Oct 26, 2010
- Fujitsu Semiconductor Limited
- Kazuo Teshirogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,704,856
- Issue date Apr 27, 2010
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,655,505
- Issue date Feb 2, 2010
- Fujitsu Microelectronics Limited
- Kazuo Teshirogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,648,907
- Issue date Jan 19, 2010
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum fixing jig for semiconductor device
- Patent number 7,571,538
- Issue date Aug 11, 2009
- Fujitsu Microelectronics Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Film lamination apparatus and method and a manufacturing method of...
- Patent number 7,563,343
- Issue date Jul 21, 2009
- Fujitsu Microelectronics Limited
- Kazuo Teshirogi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,485,962
- Issue date Feb 3, 2009
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having transparent member and manufacturing me...
- Patent number 7,479,627
- Issue date Jan 20, 2009
- Fujitsu Microelectronics Limited
- Kazuhiro Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 7,432,114
- Issue date Oct 7, 2008
- Fujitsu Limited
- Kazuo Teshirogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for a semiconductor substrate
- Patent number 7,395,847
- Issue date Jul 8, 2008
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 7,109,561
- Issue date Sep 19, 2006
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making semiconductor device that has improved structural...
- Patent number 6,951,800
- Issue date Oct 4, 2005
- Fujitsu Limited
- Yoshiaki Shinjo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 6,902,944
- Issue date Jun 7, 2005
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device of peeling semiconductor device using annular con...
- Patent number 6,824,643
- Issue date Nov 30, 2004
- Fujitsu Limited
- Kazuhiro Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 6,750,074
- Issue date Jun 15, 2004
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device having protruding electrodes higher than a sea...
- Patent number 6,528,348
- Issue date Mar 4, 2003
- Fujitsu Limited
- Fumihiko Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip removing and conveying method and device
- Patent number 6,461,942
- Issue date Oct 8, 2002
- Fujitsu Limited
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having protruding electrodes higher than a sea...
- Patent number 6,388,333
- Issue date May 14, 2002
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20150132865
- Publication date May 14, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20140217153
- Publication date Aug 7, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SURFACE PROTECTIV...
- Publication number 20110048615
- Publication date Mar 3, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Hironori Fukaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20110011919
- Publication date Jan 20, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Yoshimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090239355
- Publication date Sep 24, 2009
- Fujitsu Microelectronics Limited
- Hironori FUKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20090186425
- Publication date Jul 23, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090186451
- Publication date Jul 23, 2009
- Fujitsu Microelectronics Limited
- Kazuo TESHIROGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER STORAGE CASE AND SEMICONDUCTOR WAFER STORING ME...
- Publication number 20080230438
- Publication date Sep 25, 2008
- Fujitsu Limited
- Yoshiaki SHINJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, wiring substrate forming method, and substrat...
- Publication number 20070287282
- Publication date Dec 13, 2007
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20070231961
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Kazuo Teshirogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20070215673
- Publication date Sep 20, 2007
- FUJITSU LIMITED
- Kazuhiro Yoshimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film bonding method, film bonding apparatus, and semiconductor devi...
- Publication number 20070196588
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Yoshiaki Shinjo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20070196954
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Kazuo Teshirogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, wiring substrate forming method, and substrat...
- Publication number 20070184646
- Publication date Aug 9, 2007
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20070181792
- Publication date Aug 9, 2007
- FUJITSU LIMITED
- Kazuhiro Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221587
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221589
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221588
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor device, wiring substrate forming method, and substrat...
- Publication number 20050170640
- Publication date Aug 4, 2005
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming bumps, semiconductor device and method for manuf...
- Publication number 20050161814
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat-object holder and method of using the same
- Publication number 20050085171
- Publication date Apr 21, 2005
- Yuzo Shimobeppu
- B24 - GRINDING POLISHING
Information Patent Application
Method of Manufacturing a Semiconductor Device and a Method for Fix...
- Publication number 20040161882
- Publication date Aug 19, 2004
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Film lamination apparatus and method and a manufacturing method of...
- Publication number 20040106301
- Publication date Jun 3, 2004
- Fujitsu Limited,
- Kazuo Teshirogi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of making semiconductor device that has improved structural...
- Publication number 20030077880
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Yoshiaki Shinjo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device of peeling semiconductor device using annular con...
- Publication number 20030075271
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Kazuhiro Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat-object holder and method of using the same
- Publication number 20030077993
- Publication date Apr 24, 2003
- Yuzo Shimobeppu
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor substrate jig and method of manufacturing a semicondu...
- Publication number 20030077854
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor device having protruding electrodes higher than a sea...
- Publication number 20020074630
- Publication date Jun 20, 2002
- Fujitsu Limited
- Fumihiko Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip removing and conveying method and device
- Publication number 20010049160
- Publication date Dec 6, 2001
- FUJITSU LIMITED
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Kazuo Teshirogi

Person

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Method for forming bumps, semiconductor device and method for manuf...

Method for manufacturing semiconductor device and surface protectiv...

Method of manufacturing semiconductor device with spraying fluid

Film bonding method, film bonding apparatus, and semiconductor devi...

Semiconductor wafer storage case and semiconductor wafer storing me...

Manufacturing method of semiconductor device

Semiconductor device, wiring substrate forming method, and substrat...

Manufacturing method of semiconductor device

Semiconductor device, wiring substrate forming method, and substrat...

Vacuum fixing jig for semiconductor device

Film lamination apparatus and method and a manufacturing method of...

Semiconductor device, wiring substrate forming method, and substrat...

Semiconductor device having transparent member and manufacturing me...

Semiconductor device manufacturing method

Jig for a semiconductor substrate

Method of manufacturing a semiconductor device and a method for fix...

Method of making semiconductor device that has improved structural...

Method of manufacturing a semiconductor device and a method for fix...

Method and device of peeling semiconductor device using annular con...

Method of manufacturing a semiconductor device and a method for fix...

Semiconductor device having protruding electrodes higher than a sea...

Semiconductor chip removing and conveying method and device

Semiconductor device having protruding electrodes higher than a sea...

Patents Applicationslast 30 patents

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

BONDING APPARATUS AND BONDING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SURFACE PROTECTIV...

BONDING APPARATUS AND BONDING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER STORAGE CASE AND SEMICONDUCTOR WAFER STORING ME...

Semiconductor device, wiring substrate forming method, and substrat...

Semiconductor device manufacturing method

Bonding apparatus and bonding method

Film bonding method, film bonding apparatus, and semiconductor devi...

Manufacturing method of semiconductor device

Semiconductor device, wiring substrate forming method, and substrat...

Semiconductor device and manufacturing method of the same

Method of manufacturing a semiconductor device and a method for fix...

Method of manufacturing a semiconductor device and a method for fix...

Method of manufacturing a semiconductor device and a method for fix...

Semiconductor device, wiring substrate forming method, and substrat...

Method for forming bumps, semiconductor device and method for manuf...

Flat-object holder and method of using the same

Method of Manufacturing a Semiconductor Device and a Method for Fix...

Film lamination apparatus and method and a manufacturing method of...

Method of making semiconductor device that has improved structural...

Method and device of peeling semiconductor device using annular con...

Flat-object holder and method of using the same

Semiconductor substrate jig and method of manufacturing a semicondu...

Semiconductor device having protruding electrodes higher than a sea...

Semiconductor chip removing and conveying method and device