Bonding apparatus and bonding method

Abstract

To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view for explaining a schematic configuration of a bonding apparatus of a first embodiment of the present invention.

FIG. 2 is a plan view for explaining a schematic configuration of a load detection mechanism in the bonding apparatus of the first embodiment of the present invention.

FIG. 3A is a first schematic explanatory diagram of an example of a modification of the load detection mechanism in the bonding apparatus of the first embodiment of the present invention.

FIG. 3B is a second schematic explanatory diagram of an example of a modification of the load detection mechanism in the bonding apparatus of the first embodiment of the present invention.

FIG. 3C is a third schematic explanatory diagram of an example of a modification of the load detection mechanism in the bonding apparatus of the first embodiment of the present invention.

FIG. 4 is a flowchart for explaining an operation (bonding method) of the bonding apparatus of the first embodiment of the present invention.

FIG. 5A is a first schematic explanatory diagram showing a bonding operation by means of a bonding method using the bonding apparatus of the first embodiment of the present invention.

FIG. 5B is a second schematic explanatory diagram showing the bonding operation by means of a bonding method using the bonding apparatus of the first embodiment of the present invention.

FIG. 6A is graph showing an example of a plot of reference load vs. time in the bonding apparatus of the first embodiment of the present invention.

FIG. 6B is graph showing an example of a plot of load vs. time, the load detected by an individual load sensor of the bonding apparatus of the first embodiment of the present invention.

FIG. 7A is a first schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.

FIG. 7B is a second schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.

FIG. 7C is a third schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.

FIG. 7D is a fourth schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.

FIG. 7E is a fifth schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.

FIG. 7F is a sixth schematic explanatory diagram showing a example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.

FIG. 8A is a first graph showing another plot of load vs. time, the loads detected by the individual load sensors of the bonding apparatus of the first embodiment of the present invention.

FIG. 8B is a second graph showing still another plot of load vs. time, the loads detected by the individual load sensors of the bonding apparatus of the first embodiment of the present invention.

FIG. 9A is a first step view for explaining a substrate transportation operation carried out in the bonding apparatus of the first embodiment of the present invention.

FIG. 9B is a second step view for explaining the substrate transportation operation carried out in the bonding apparatus of the first embodiment of the present invention.

FIG. 9C is a third step view for explaining the substrate transportation operation carried out in the bonding apparatus of the first embodiment of the present invention.

FIG. 9D is a fourth step view for explaining the substrate transportation operation carried out in the bonding apparatus of the first embodiment of the present invention.

FIG. 10A is a cross-sectional view for explaining an example of the schematic configuration of a conventional bonding apparatus.

FIG. 10B is a cross-sectional view for explaining another example of the schematic configuration of a conventional bonding apparatus.

Claims

1. A bonding apparatus, comprising: a bonding head configured to press an electronic component against a substrate to bond the electronic component to the substrate;a plurality of load detection mechanisms that are substantially equally spaced so as to face one another under a substrate stage which supports the substrate arranged to face the electronic component; anda pressure detection unit configured to detect a pressure on a bonding surface between the electronic component and the substrate on the basis of pressure values detected by the individual load detection mechanisms.

2. The bonding apparatus according to claim 1, wherein the electronic component has a polygonal shape, and the load detection mechanisms are disposed at positions corresponding to the corners of the electronic component.

3. The bonding apparatus according to claim 2, wherein the electronic component has a square shape, and the load detection mechanism are disposed at positions corresponding to the corners of the electronic component.

4. The bonding apparatus according to claim 1, wherein the load detection mechanisms are disposed in a matrix form.

5. The bonding apparatus according to claim 1, further comprising: a pressure adjustment unit configured to adjust a pressing force of the bonding head; anda control unit configured to control the pressure adjustment unit,wherein the control unit performs feedback control on the pressure adjustment unit while comparing a predetermined reference pressure value with the total of the pressure values detected by the individual load detection mechanisms.

6. The bonding apparatus according to claim 5, wherein upper and lower thresholds for a pressing force on each of the load detection mechanisms are previously set in the control unit on the basis of the pressure values detected by the individual load detection mechanisms.

7. The bonding apparatus according to claim 5, wherein upper and lower thresholds for a pressing force on each row of the load detection mechanisms are previously set in the control unit on the basis of the pressure values detected by the individual load detection mechanisms.

8. The bonding apparatus according to claim 6, wherein the occurrence of abnormality is indicated when the pressure value detected by the load detection mechanism has exceeded the threshold.

9. The bonding apparatus according to claim 8, wherein the operation of the bonding apparatus is halted.

10. A bonding method, comprising: pressing an electronic component against a substrate by means of a bonding head to bond the electronic component to the substrate;detecting a pressure at a bonding surface between the electronic component and the substrate on the basis of pressure values detected by a plurality of load detection mechanisms that are substantially equally spaced so as to face one another under a substrate stage which supports the substrate arranged to face the electronic component.

11. The bonding method according to claim 10, wherein the electronic component has a polygonal shape, and the load detection mechanisms are disposed at positions corresponding to the corners of the electronic component.

12. The bonding method according to claim 11, wherein the electronic component has a square shape, and the load detection mechanisms are disposed at positions corresponding to the corners of the electronic component.

13. The bonding method according to claim 10, wherein the load detection mechanisms are disposed in a matrix form.

14. The bonding method according to claim 10, further comprising: adjusting a pressing force of the bonding head; andperforming feedback control on the pressing force while comparing a predetermined reference pressure value with the total of the pressure values detected by the individual load detection mechanisms.

15. The bonding method according to claim 14, wherein in the feedback control step upper and lower thresholds for a pressing force on each of the load detection mechanisms are previously set on the basis of the pressure values detected by the individual load detection mechanisms.

16. The bonding method according to claim 14, wherein in the feedback control step upper and lower thresholds for a pressing force on each row of the load detection mechanisms are previously set on the basis of the pressure values detected by the individual load detection mechanisms.

17. The bonding method according to claim 15, wherein the occurrence of abnormality is detected when the pressure value detected by the load detection mechanism has exceeded the threshold.

18. The bonding method according to claim 17, wherein the operation of the pressing step is halted.

19. The bonding method according to claim 10, wherein traceability is ensured for the bonding status of the bonding surface between the electronic component and the substrate on the basis of the pressure values detected by the individual load detection mechanisms.