Keisuke Shimizu

Person

Gifu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 10,186,486
- Issue date Jan 22, 2019
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 10,090,238
- Issue date Oct 2, 2018
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with cavity for built-in electronic component and meth...
- Patent number 9,832,878
- Issue date Nov 28, 2017
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element built-in wiring board and method for manufact...
- Patent number 9,793,219
- Issue date Oct 17, 2017
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,723,728
- Issue date Aug 1, 2017
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,474,158
- Issue date Oct 18, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,391,044
- Issue date Jul 12, 2016
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component and method for manufac...
- Patent number 9,288,910
- Issue date Mar 15, 2016
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,113,575
- Issue date Aug 18, 2015
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 9,101,070
- Issue date Aug 4, 2015
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 8,952,507
- Issue date Feb 10, 2015
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 8,785,788
- Issue date Jul 22, 2014
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and method for manufacturing the same
- Patent number 8,525,041
- Issue date Sep 3, 2013
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board including a capacitor section
- Patent number 8,471,153
- Issue date Jun 25, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,222,539
- Issue date Jul 17, 2012
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20240237204
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240237203
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237221
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240234326
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240136294
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230069980
- Publication date Mar 9, 2023
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230076560
- Publication date Mar 9, 2023
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220404564
- Publication date Dec 22, 2022
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220346240
- Publication date Oct 27, 2022
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD
- Publication number 20180033732
- Publication date Feb 1, 2018
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170256470
- Publication date Sep 7, 2017
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170256478
- Publication date Sep 7, 2017
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACT...
- Publication number 20160233167
- Publication date Aug 11, 2016
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160073515
- Publication date Mar 10, 2016
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METH...
- Publication number 20160044789
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160037647
- Publication date Feb 4, 2016
- IBIDEN CO., LTD.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFAC...
- Publication number 20150156881
- Publication date Jun 4, 2015
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150034374
- Publication date Feb 5, 2015
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150016079
- Publication date Jan 15, 2015
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20140144686
- Publication date May 29, 2014
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PIECE SUBSTRATE
- Publication number 20140146500
- Publication date May 29, 2014
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20140042602
- Publication date Feb 13, 2014
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PIECE SUBSTRATE
- Publication number 20130107481
- Publication date May 2, 2013
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20120241205
- Publication date Sep 27, 2012
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20120186861
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110271524
- Publication date Nov 10, 2011
- IBIDEN CO., LTD.
- Hironori TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100224397
- Publication date Sep 9, 2010
- IBIDEN CO., LTD.
- Keisuke Shimizu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100212946
- Publication date Aug 26, 2010
- IBIDEN CO., LTD.
- Keisuke Shimizu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100214752
- Publication date Aug 26, 2010
- IBIDEN CO., LTD.
- Keisuke Shimizu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Keisuke Shimizu

Person

Patents Grantslast 30 patents

Wiring board

Wiring substrate and method for manufacturing the same

Wiring board with cavity for built-in electronic component and meth...

Semiconductor element built-in wiring board and method for manufact...

Wiring board with built-in electronic component and method for manu...

Printed wiring board

Printed wiring board and method for manufacturing printed wiring board

Substrate with built-in electronic component and method for manufac...

Wiring board with built-in electronic component and method for manu...

Method for manufacturing multilayer printed wiring board

Wiring board and method for manufacturing wiring board

Wiring board with built-in electronic component and method for manu...

Multilayer wiring board and method for manufacturing the same

Multilayer printed wiring board including a capacitor section

Wiring board and method for manufacturing the same

Patents Applicationslast 30 patents

WIRING SUBSTRATE

WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR ELEMENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACT...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METH...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFAC...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

MULTI-PIECE SUBSTRATE

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

MULTI-PIECE SUBSTRATE

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME