Ken Lam

Person

Colorado Springs, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package
- Patent number 9,905,498
- Issue date Feb 27, 2018
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided electronic package
- Patent number 9,704,812
- Issue date Jul 11, 2017
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for increasing the quantity of discrete electr...
- Patent number 8,860,195
- Issue date Oct 14, 2014
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method incorporating discrete passive components in a...
- Patent number 8,568,822
- Issue date Oct 29, 2013
- Atmel Corporation
- Ken M. Lam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Routable array metal integrated circuit package
- Patent number 8,531,022
- Issue date Sep 10, 2013
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stacking for integrated circuit electronic package
- Patent number 8,525,329
- Issue date Sep 3, 2013
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routable array metal integrated circuit package fabricated using pa...
- Patent number 8,487,424
- Issue date Jul 16, 2013
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routable array metal integrated circuit package fabricated using pa...
- Patent number 8,455,304
- Issue date Jun 4, 2013
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a multi-component electronic package
- Patent number 8,429,814
- Issue date Apr 30, 2013
- Atmel Corporation
- Ken M. Lam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked-die electronics package with planar and three-dimensional i...
- Patent number 8,324,023
- Issue date Dec 4, 2012
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable packages for three-dimensional packaging of semiconductor...
- Patent number 8,278,150
- Issue date Oct 2, 2012
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die package including substrate-ground coupling
- Patent number 8,264,075
- Issue date Sep 11, 2012
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with an integrated circuit device having post w...
- Patent number 8,258,599
- Issue date Sep 4, 2012
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stacking for integrated circuit electronic package
- Patent number 8,237,266
- Issue date Aug 7, 2012
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package with internally extended package leads
- Patent number 8,174,099
- Issue date May 8, 2012
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with alignment features and devices a...
- Patent number 8,044,526
- Issue date Oct 25, 2011
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal leadframe package with secure feature
- Patent number 8,022,516
- Issue date Sep 20, 2011
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level integrated circuit package with top and bottom side ele...
- Patent number 8,018,065
- Issue date Sep 13, 2011
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming packaged products
- Patent number 7,981,796
- Issue date Jul 19, 2011
- Atmel Corporation
- Ken M. Lam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked-die electronics package with planar and three-dimensional i...
- Patent number 7,932,590
- Issue date Apr 26, 2011
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged products, including stacked package modules, and methods o...
- Patent number 7,927,918
- Issue date Apr 19, 2011
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an integral electromagnetic radiation shield in...
- Patent number 7,880,193
- Issue date Feb 1, 2011
- Atmel Corporation
- Ken M. Lam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to provide substrate-ground coupling for semiconductor integ...
- Patent number 7,838,971
- Issue date Nov 23, 2010
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for increasing circuitry interconnection and comp...
- Patent number 7,821,122
- Issue date Oct 26, 2010
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable packages for three-dimensional packaging of semiconductor...
- Patent number 7,816,769
- Issue date Oct 19, 2010
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods using die attach paddle for mounting integrated circuit die
- Patent number 7,678,618
- Issue date Mar 16, 2010
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach paddle for mounting integrated circuit die
- Patent number 7,638,862
- Issue date Dec 29, 2009
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with integral electromagnetic radiation shield a...
- Patent number 7,626,247
- Issue date Dec 1, 2009
- Atmel Corporation
- Ken Lam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable integrated circuit structures and systems devices and met...
- Patent number 7,564,137
- Issue date Jul 21, 2009
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stacking for integrated circuit electronic package
- Patent number 7,342,308
- Issue date Mar 11, 2008
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20170323845
- Publication date Nov 9, 2017
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Stacking for Integrated Circuit Electronic Package
- Publication number 20120270367
- Publication date Oct 25, 2012
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...
- Publication number 20120178214
- Publication date Jul 12, 2012
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...
- Publication number 20120025375
- Publication date Feb 2, 2012
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked-Die Electronics Package with Planar and Three-Dimensional I...
- Publication number 20110193192
- Publication date Aug 11, 2011
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-DIE PACKAGE INCLUDING SUBSTRATE-GROUND COUPLING
- Publication number 20110062598
- Publication date Mar 17, 2011
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE PACKAGES FOR THREE-DIMENSIONAL PACKAGING OF SEMICONDUCTOR...
- Publication number 20110014747
- Publication date Jan 20, 2011
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT ELECTRONIC PACKAGE
- Publication number 20110001215
- Publication date Jan 6, 2011
- ATMEL CORPORATION
- Ken M. Lam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH ALIGNMENT FEATURES AND DEVICES A...
- Publication number 20100225009
- Publication date Sep 9, 2010
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE
- Publication number 20100224981
- Publication date Sep 9, 2010
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING PACKAGED PRODUCTS
- Publication number 20100172113
- Publication date Jul 8, 2010
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN INTEGRAL ELECTROMAGNETIC RADIATION SHIELD IN...
- Publication number 20100051343
- Publication date Mar 4, 2010
- ATMEL CORPORATION
- Ken LAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Leadless Package with Internally Extended Package Leads
- Publication number 20100038759
- Publication date Feb 18, 2010
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Leadframe Package with Secure Feature
- Publication number 20100038760
- Publication date Feb 18, 2010
- ATMEL CORPORATION
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED PRODUCTS, INCLUDING STACKED PACKAGE MODULES, AND METHODS O...
- Publication number 20090302449
- Publication date Dec 10, 2009
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR INCREASING THE QUANTITY OF DISCRETE ELECTR...
- Publication number 20090294957
- Publication date Dec 3, 2009
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Integrated Circuit Package with Top and Bottom Side Ele...
- Publication number 20090218698
- Publication date Sep 3, 2009
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING LOW COST SOLDER BUMPS ON INTEGRATED CIRCUIT WAFERS
- Publication number 20090206480
- Publication date Aug 20, 2009
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL ALIGNMENT FEATURES ON INTEGRATED CIRCUIT DEVICES FOR ACCUR...
- Publication number 20080160670
- Publication date Jul 3, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONE...
- Publication number 20080123318
- Publication date May 29, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT STACKING FOR INTEGRATED CIRCUIT ELECTRONIC PACKAGE
- Publication number 20080105985
- Publication date May 8, 2008
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD INCORPORATING DISCRETE PASSIVE COMPONENTS IN A...
- Publication number 20080075841
- Publication date Mar 27, 2008
- ATMEL CORPORATION
- Ken M. Lam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE
- Publication number 20080064145
- Publication date Mar 13, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE
- Publication number 20080061416
- Publication date Mar 13, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A STACKED-DIE ELECTRONICS PACKAGE WITH PLANAR AND THREE-DIMENSIONAL...
- Publication number 20080054428
- Publication date Mar 6, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE PACKAGES FOR THREE-DIMENSIONAL PACKAGING OF SEMICONDUCTOR...
- Publication number 20080048308
- Publication date Feb 28, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD TO PROVIDE SUBSTRATE-GROUND COUPLING FOR SEMICONDUCTOR INT...
- Publication number 20080044947
- Publication date Feb 21, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SA...
- Publication number 20070262435
- Publication date Nov 15, 2007
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT PACKAGE WITH BOTH TOP AND BOTTOM SIDE CONNECTION PA...
- Publication number 20070252255
- Publication date Nov 1, 2007
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for providing an integral radio frequency shield...
- Publication number 20070145539
- Publication date Jun 28, 2007
- Ken Lam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Electronic package

Double-sided electronic package

Apparatus and method for increasing the quantity of discrete electr...

Apparatus and method incorporating discrete passive components in a...

Routable array metal integrated circuit package

Component stacking for integrated circuit electronic package

Routable array metal integrated circuit package fabricated using pa...

Routable array metal integrated circuit package fabricated using pa...

Method of assembling a multi-component electronic package

Stacked-die electronics package with planar and three-dimensional i...

Stackable packages for three-dimensional packaging of semiconductor...

Stacked-die package including substrate-ground coupling

Electronics package with an integrated circuit device having post w...

Component stacking for integrated circuit electronic package

Leadless package with internally extended package leads

Integrated circuit assemblies with alignment features and devices a...

Metal leadframe package with secure feature

Wafer-level integrated circuit package with top and bottom side ele...

Methods for forming packaged products

Stacked-die electronics package with planar and three-dimensional i...

Packaged products, including stacked package modules, and methods o...

Method for forming an integral electromagnetic radiation shield in...

Method to provide substrate-ground coupling for semiconductor integ...

Method and system for increasing circuitry interconnection and comp...

Stackable packages for three-dimensional packaging of semiconductor...

Methods using die attach paddle for mounting integrated circuit die

Die attach paddle for mounting integrated circuit die

Electronic package with integral electromagnetic radiation shield a...

Stackable integrated circuit structures and systems devices and met...

Component stacking for integrated circuit electronic package

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

Component Stacking for Integrated Circuit Electronic Package

ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...

ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE FABRICATED USING PA...

Stacked-Die Electronics Package with Planar and Three-Dimensional I...

STACKED-DIE PACKAGE INCLUDING SUBSTRATE-GROUND COUPLING

STACKABLE PACKAGES FOR THREE-DIMENSIONAL PACKAGING OF SEMICONDUCTOR...

MULTI-COMPONENT ELECTRONIC PACKAGE

INTEGRATED CIRCUIT ASSEMBLIES WITH ALIGNMENT FEATURES AND DEVICES A...

ROUTABLE ARRAY METAL INTEGRATED CIRCUIT PACKAGE

METHODS FOR FORMING PACKAGED PRODUCTS

METHOD FOR FORMING AN INTEGRAL ELECTROMAGNETIC RADIATION SHIELD IN...

Leadless Package with Internally Extended Package Leads

Metal Leadframe Package with Secure Feature

PACKAGED PRODUCTS, INCLUDING STACKED PACKAGE MODULES, AND METHODS O...

APPARATUS AND METHOD FOR INCREASING THE QUANTITY OF DISCRETE ELECTR...

Wafer-Level Integrated Circuit Package with Top and Bottom Side Ele...

FABRICATING LOW COST SOLDER BUMPS ON INTEGRATED CIRCUIT WAFERS

PHYSICAL ALIGNMENT FEATURES ON INTEGRATED CIRCUIT DEVICES FOR ACCUR...

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONE...

COMPONENT STACKING FOR INTEGRATED CIRCUIT ELECTRONIC PACKAGE

APPARATUS AND METHOD INCORPORATING DISCRETE PASSIVE COMPONENTS IN A...

DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE

DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE

A STACKED-DIE ELECTRONICS PACKAGE WITH PLANAR AND THREE-DIMENSIONAL...

STACKABLE PACKAGES FOR THREE-DIMENSIONAL PACKAGING OF SEMICONDUCTOR...

A METHOD TO PROVIDE SUBSTRATE-GROUND COUPLING FOR SEMICONDUCTOR INT...

THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SA...

MULTI-COMPONENT PACKAGE WITH BOTH TOP AND BOTTOM SIDE CONNECTION PA...

Method and system for providing an integral radio frequency shield...