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Kin Pui Kwan
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Kowloon, HK
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Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating an integrated circuit (IC) package having a p...
Patent number
9,520,306
Issue date
Dec 13, 2016
UTAC HEADQUARTERS PTE. LTD.
Geraldine Tsui Yee Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having a plurality of spaced apart pad p...
Patent number
8,330,270
Issue date
Dec 11, 2012
UTAC Hong Kong Limited
Geraldine Tsui Yee Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with contact standoff
Patent number
7,595,225
Issue date
Sep 29, 2009
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple leadframe laminated IC package
Patent number
7,449,771
Issue date
Nov 11, 2008
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin array plastic package without die attach pad and process for f...
Patent number
7,358,119
Issue date
Apr 15, 2008
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
7,271,032
Issue date
Sep 18, 2007
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier
Patent number
7,270,867
Issue date
Sep 18, 2007
ASAT Ltd.
Kin Pui Kwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabricating pad frame and integrated circuit package
Patent number
7,232,755
Issue date
Jun 19, 2007
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabricating a leadless plastic chip carrier
Patent number
7,226,811
Issue date
Jun 5, 2007
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin leadless plastic chip carrier
Patent number
7,081,403
Issue date
Jul 25, 2006
ASAT Ltd.
Mohan Kirloskar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin leadless plastic chip carrier
Patent number
7,009,286
Issue date
Mar 7, 2006
ASAT Ltd.
Mohan Kirloskar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
6,995,460
Issue date
Feb 7, 2006
ASAT Ltd.
Neil McLellan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
6,989,294
Issue date
Jan 24, 2006
Asat, Ltd.
Neil McLellan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for fabricating a leadless plastic chip carrier
Patent number
6,946,324
Issue date
Sep 20, 2005
ASAT Ltd.
Neil McLellan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation
Patent number
6,933,594
Issue date
Aug 23, 2005
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation and di...
Patent number
6,872,661
Issue date
Mar 29, 2005
ASAT Ltd.
Kin Pui Kwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple leadframe laminated IC package
Patent number
6,734,044
Issue date
May 11, 2004
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with etch back pad singulation and di...
Patent number
6,635,957
Issue date
Oct 21, 2003
Asat LTD
Kin Pui Kwan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME
Publication number
20160013075
Publication date
Jan 14, 2016
Geraldine Tsui Yee LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin array plastic package without die attach pad and process for f...
Publication number
20060154403
Publication date
Jul 13, 2006
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadless plastic chip carrier with etch back pad singulation and di...
Publication number
20010014538
Publication date
Aug 16, 2001
ASAT Ltd.
Kin Pui Kwan
H01 - BASIC ELECTRIC ELEMENTS