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Kuriyama Fumio

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  • Yokohama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electroplating method
    • Patent number 9,376,758
    • Issue date Jun 28, 2016
    • Ebara Corporation
    • Shingo Yasuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating method and electroplating apparatus for through-hole
    • Patent number 9,297,088
    • Issue date Mar 29, 2016
    • Ebara Corporation
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus and plating method for forming magnetic film
    • Patent number 8,877,030
    • Issue date Nov 4, 2014
    • Ebara Corporation
    • Yasuhiko Endo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 8,784,636
    • Issue date Jul 22, 2014
    • Ebara Corporation
    • Mizuki Nagai
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating method and apparatus
    • Patent number 8,317,993
    • Issue date Nov 27, 2012
    • Ebara Corporation
    • Fumio Kuriyama
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Plating apparatus
    • Patent number 8,252,167
    • Issue date Aug 28, 2012
    • Ebara Corporation
    • Fumio Kuriyama
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Apparatus and method for plating a substrate
    • Patent number 8,048,282
    • Issue date Nov 1, 2011
    • Ebara Corporation
    • Masahiko Sekimoto
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus
    • Patent number 7,875,158
    • Issue date Jan 25, 2011
    • Ebara Corporation
    • Fumio Kuriyama
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Anode holder
    • Patent number 7,507,319
    • Issue date Mar 24, 2009
    • Ebara Corporation
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electrolytic plating anode
    • Patent number D583779
    • Issue date Dec 30, 2008
    • Ebara Corporation
    • Fumio Kuriyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Anode shaft
    • Patent number D572673
    • Issue date Jul 8, 2008
    • Ebara Corporation
    • Fumio Kuriyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Plating apparatus
    • Patent number RE39123
    • Issue date Jun 13, 2006
    • Ebara Corporation
    • Fumio Kuriyama
    • 205 - Electrolysis: processes, compositions used therein, and methods of prep...
  • Information Patent Grant

    Lead free bump and method of forming the same
    • Patent number 7,012,333
    • Issue date Mar 14, 2006
    • Ebara Corporation
    • Masashi Shimoyama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Substrate plating apparatus
    • Patent number 6,929,722
    • Issue date Aug 16, 2005
    • Ebara Corporation
    • Akihisa Hongo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method and apparatus for plating a substrate
    • Patent number 6,544,585
    • Issue date Apr 8, 2003
    • Ebara Corporation
    • Fumio Kuriyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Substrate plating apparatus
    • Patent number 6,495,004
    • Issue date Dec 17, 2002
    • Ebara Corporation
    • Fumio Kuriyama
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plating apparatus
    • Patent number 6,379,520
    • Issue date Apr 30, 2002
    • Ebara Corporation
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Substrate plating apparatus
    • Patent number 6,294,059
    • Issue date Sep 25, 2001
    • Ebara Corporation
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Liquid feed vaporization system and gas injection device
    • Patent number 6,269,221
    • Issue date Jul 31, 2001
    • Ebara Corporation
    • Kuniaki Horie
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Liquid feed vaporization system and gas injection device
    • Patent number 6,195,504
    • Issue date Feb 27, 2001
    • Ebara Corporation
    • Kuniaki Horie
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method and apparatus for plating a substrate
    • Patent number 6,123,984
    • Issue date Sep 26, 2000
    • Ebara Corporation
    • Kuriyama Fumio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Vaporizer apparatus and film deposition apparatus therewith
    • Patent number 5,951,923
    • Issue date Sep 14, 1999
    • Ebara Corporation
    • Kuniaki Horie
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Evacuation apparatus and evacuation method
    • Patent number 5,062,271
    • Issue date Nov 5, 1991
    • Kabushiki Kaisha Toshiba
    • Katsuya Okumura
    • F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
  • Information Patent Grant

    Turbomolecular pump and method of operating the same
    • Patent number 4,926,648
    • Issue date May 22, 1990
    • Toshiba Corp.
    • Katsuya Okumura
    • F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR FORMING CONDUCTIVE STRUCTURE, AND PLATING APPARATUS AND...
    • Publication number 20140287580
    • Publication date Sep 25, 2014
    • Mizuki Nagai
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING METHOD AND ELECTROPLATING APPARATUS FOR THROUGH-HOLE
    • Publication number 20140042032
    • Publication date Feb 13, 2014
    • EBARA CORPORATION
    • Masashi SHIMOYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20130015075
    • Publication date Jan 17, 2013
    • Masahiko SEKIMOTO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING METHOD
    • Publication number 20120152749
    • Publication date Jun 21, 2012
    • Shingo YASUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD AND PLATING APPARATUS
    • Publication number 20110180412
    • Publication date Jul 28, 2011
    • Masashi SHIMOYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20110073482
    • Publication date Mar 31, 2011
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method for forming magnetic film
    • Publication number 20100006444
    • Publication date Jan 14, 2010
    • EBARA CORPORATION
    • Yasuhiko Endo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method and apparatus
    • Publication number 20090311429
    • Publication date Dec 17, 2009
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20090301395
    • Publication date Dec 10, 2009
    • Masahiko SEKIMOTO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus
    • Publication number 20090218231
    • Publication date Sep 3, 2009
    • Toshikazu Yajima
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20090139870
    • Publication date Jun 4, 2009
    • Mizuki Nagai
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Apparatus and method for plating a substrate
    • Publication number 20090045068
    • Publication date Feb 19, 2009
    • Masahiko Sekimoto
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Anode holder
    • Publication number 20080017505
    • Publication date Jan 24, 2008
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method and apparatus
    • Publication number 20070117365
    • Publication date May 24, 2007
    • EBARA CORPORATION
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20060141157
    • Publication date Jun 29, 2006
    • Masahiko Sekimoto
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus
    • Publication number 20060113185
    • Publication date Jun 1, 2006
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20060081478
    • Publication date Apr 20, 2006
    • Tsuyoshi Sahoda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Method of forming a lead-free bump and a plating apparatus therefor
    • Publication number 20050279640
    • Publication date Dec 22, 2005
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating device
    • Publication number 20040262150
    • Publication date Dec 30, 2004
    • Toshikazu Yajima
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Apparatus and method for plating a substrate
    • Publication number 20040245112
    • Publication date Dec 9, 2004
    • Masahiko Sekimoto
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Lead free bump and method of forming the same
    • Publication number 20040219775
    • Publication date Nov 4, 2004
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Substrate plating apparatus
    • Publication number 20040163947
    • Publication date Aug 26, 2004
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Substrate plating apparatus
    • Publication number 20020005359
    • Publication date Jan 17, 2002
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR