Kurosawa Inetaro

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,224,717
- Issue date Dec 29, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,093,435
- Issue date Jul 28, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,969,133
- Issue date Mar 3, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of making interconnect element having metal tr...
- Patent number 8,736,064
- Issue date May 27, 2014
- Invensas Corporation
- Hideki Kotake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,618,659
- Issue date Dec 31, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20220375891
- Publication date Nov 24, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
- Publication number 20210050322
- Publication date Feb 18, 2021
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20170287733
- Publication date Oct 5, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20160211237
- Publication date Jul 21, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20150091118
- Publication date Apr 2, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20130203216
- Publication date Aug 8, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20120280386
- Publication date Nov 8, 2012
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure And Method Of Making Interconnect Element Having Metal Tr...
- Publication number 20110057324
- Publication date Mar 10, 2011
- Tessera Interconnect Materials, Inc.
- Hideki Kotake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method of making interconnect element having metal tr...
- Publication number 20080169568
- Publication date Jul 17, 2008
- Tessera Interconnect Materials, Inc.
- Hideki Kotake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method of making interconnect element having metal tr...
- Publication number 20080136041
- Publication date Jun 12, 2008
- Tessera Interconnect Materials, Inc.
- Hideki Kotake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a multi-layer wiring board using a metal me...
- Publication number 20080128288
- Publication date Jun 5, 2008
- Tessera Interconnect Materials, Inc.
- Yukio Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for distributing a liquid onto a surface of an...
- Publication number 20070221329
- Publication date Sep 27, 2007
- Tessera Interconnect Materials, Inc.
- Kazuo Sakuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer wiring board, method for producing multi-layer wiring b...
- Publication number 20050097727
- Publication date May 12, 2005
- Tomoo Iijima
- B24 - GRINDING POLISHING

Kurosawa Inetaro

Person

Patents Grantslast 30 patents

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Structure and method of making interconnect element having metal tr...

Package-on-package assembly with wire bonds to encapsulation surface

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Package-On-Package Assembly With Wire Bonds To Encapsulation Surface

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Structure And Method Of Making Interconnect Element Having Metal Tr...

Structure and method of making interconnect element having metal tr...

Structure and method of making interconnect element having metal tr...

Method of manufacturing a multi-layer wiring board using a metal me...

Apparatus and method for distributing a liquid onto a surface of an...

Multi-layer wiring board, method for producing multi-layer wiring b...