Kwok Cheung Tsang

Person

Fauling, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating an integrated circuit (IC) package having a p...
- Patent number 9,520,306
- Issue date Dec 13, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Geraldine Tsui Yee Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with improved thermal characteristics
- Patent number 8,610,262
- Issue date Dec 17, 2013
- UTAC Hong Kong Limited
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having a plurality of spaced apart pad p...
- Patent number 8,330,270
- Issue date Dec 11, 2012
- UTAC Hong Kong Limited
- Geraldine Tsui Yee Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components such as thin array plastic packages and proce...
- Patent number 7,482,690
- Issue date Jan 27, 2009
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin ball grid array package
- Patent number 7,439,099
- Issue date Oct 21, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package and process for manufacturing same
- Patent number 7,372,151
- Issue date May 13, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin array plastic package without die attach pad and process for f...
- Patent number 7,358,119
- Issue date Apr 15, 2008
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation
- Patent number 7,271,032
- Issue date Sep 18, 2007
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier
- Patent number 7,270,867
- Issue date Sep 18, 2007
- ASAT Ltd.
- Kin Pui Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating pad frame and integrated circuit package
- Patent number 7,232,755
- Issue date Jun 19, 2007
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin leadless plastic chip carrier
- Patent number 7,081,403
- Issue date Jul 25, 2006
- ASAT Ltd.
- Mohan Kirloskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin leadless plastic chip carrier
- Patent number 7,009,286
- Issue date Mar 7, 2006
- ASAT Ltd.
- Mohan Kirloskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation
- Patent number 6,995,460
- Issue date Feb 7, 2006
- ASAT Ltd.
- Neil McLellan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation
- Patent number 6,989,294
- Issue date Jan 24, 2006
- Asat, Ltd.
- Neil McLellan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components such as thin array plastic packages and proce...
- Patent number 6,964,918
- Issue date Nov 15, 2005
- ASAT Ltd.
- Chun Ho Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation
- Patent number 6,933,594
- Issue date Aug 23, 2005
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation and di...
- Patent number 6,872,661
- Issue date Mar 29, 2005
- ASAT Ltd.
- Kin Pui Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin ball grid array package
- Patent number 6,781,242
- Issue date Aug 24, 2004
- Asat, Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation and di...
- Patent number 6,635,957
- Issue date Oct 21, 2003
- Asat LTD
- Kin Pui Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up tape ball grid array package
- Patent number 6,586,834
- Issue date Jul 1, 2003
- ASAT Ltd.
- Ming Wang Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil laminated IC package
- Patent number 6,429,048
- Issue date Aug 6, 2002
- Asat LTD
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20160013075
- Publication date Jan 14, 2016
- Geraldine Tsui Yee LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin array plastic package without die attach pad and process for f...
- Publication number 20060154403
- Publication date Jul 13, 2006
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL LAMINATED IC PACKAGE
- Publication number 20020068378
- Publication date Jun 6, 2002
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless plastic chip carrier with etch back pad singulation and di...
- Publication number 20010014538
- Publication date Aug 16, 2001
- ASAT Ltd.
- Kin Pui Kwan
- H01 - BASIC ELECTRIC ELEMENTS

Kwok Cheung Tsang

Person

Patents Grantslast 30 patents

Method of fabricating an integrated circuit (IC) package having a p...

Ball grid array package with improved thermal characteristics

Integrated circuit package having a plurality of spaced apart pad p...

Electronic components such as thin array plastic packages and proce...

Thin ball grid array package

Ball grid array package and process for manufacturing same

Thin array plastic package without die attach pad and process for f...

Leadless plastic chip carrier with etch back pad singulation

Leadless plastic chip carrier

Process for fabricating pad frame and integrated circuit package

Thin leadless plastic chip carrier

Thin leadless plastic chip carrier

Leadless plastic chip carrier with etch back pad singulation

Leadless plastic chip carrier with etch back pad singulation

Electronic components such as thin array plastic packages and proce...

Leadless plastic chip carrier with etch back pad singulation

Leadless plastic chip carrier with etch back pad singulation and di...

Thin ball grid array package

Leadless plastic chip carrier with etch back pad singulation and di...

Die-up tape ball grid array package

Metal foil laminated IC package

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME

Thin array plastic package without die attach pad and process for f...

METAL FOIL LAMINATED IC PACKAGE

Leadless plastic chip carrier with etch back pad singulation and di...