Lawrence A. Clevenger

Person

Rhinebeck, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked transistor layout for improved cell height scaling
- Patent number 12,363,965
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Grant
Advanced metal interconnect
- Patent number 12,341,066
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-cut and separation techniques for enabling independent gate co...
- Patent number 12,336,294
- Issue date Jun 17, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Grant
Dielectric caps for power and signal line routing
- Patent number 12,334,442
- Issue date Jun 17, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a backside power rail
- Patent number 12,272,648
- Issue date Apr 8, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via patterning using metal as hard mask and via conductor
- Patent number 12,261,056
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistors with different channel widths
- Patent number 12,230,544
- Issue date Feb 18, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 12,218,003
- Issue date Feb 4, 2025
- Adeia Semiconductor Solutions LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D nanochannel interleaved devices
- Patent number 12,208,386
- Issue date Jan 28, 2025
- International Business Machines Corporation
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Horizontal RRAM device and architecture for variability reduction
- Patent number 12,156,486
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 12,106,963
- Issue date Oct 1, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with backside gate contacts
- Patent number 12,087,691
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated phase change memory using porous dielectrics
- Patent number 11,980,110
- Issue date May 7, 2024
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Circuit design watermarking
- Patent number 11,977,614
- Issue date May 7, 2024
- International Business Machines Corporation
- Carl Radens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts having a geometry to reduce resistance
- Patent number 11,875,987
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimizating semiconductor binning by feed-forward process adjustment
- Patent number 11,869,783
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fully aligned top vias
- Patent number 11,854,884
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side wafer modification
- Patent number 11,830,778
- Issue date Nov 28, 2023
- International Business Machines Corporation
- David Wolpert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-terminal phase change memory device
- Patent number 11,812,676
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Timothy Mathew Philip

Patents Applicationslast 30 patents

Information Patent Application
ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL
- Publication number 20250218863
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT FULLY ALIGNED VIA AND METAL LINE
- Publication number 20250201699
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS
- Publication number 20250194210
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...
- Publication number 20250191995
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLY-OVER METAL JUMPER CONNECTION
- Publication number 20250192023
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING
- Publication number 20250194199
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC VIA BAR UNDER POWER RAIL
- Publication number 20250192046
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE TIE-DOWN TO BACKSIDE POWER RAIL
- Publication number 20250194197
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED METAL JUMPER STRUCTURE FOR BEOL
- Publication number 20250192037
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING
- Publication number 20250183145
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTORS WITH DIFFERENT CHANNEL WIDTHS
- Publication number 20250169157
- Publication date May 22, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING ANGLED DIELECTRIC BARS ATTACHED TO...
- Publication number 20250169131
- Publication date May 22, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
VIA CONNECTION IN MIDDLE BEOL WIRING
- Publication number 20250140650
- Publication date May 1, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20250140606
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH ASYMMETRIC CELL BOUNDARY
- Publication number 20250133816
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE-VIA-LINE STRUCTURE FOR BSPDN
- Publication number 20250125250
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS
- Publication number 20250112121
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE RESISTOR CONNECTED TO BACKSIDE BACK END OF LINE NETWORK
- Publication number 20250098288
- Publication date Mar 20, 2025
- International Business Machines Corporation
- JENS HAETTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT
- Publication number 20250096127
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TIP-TO-TIP SCALING
- Publication number 20250096132
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE OFFSET GATE CONTACT FOR BACKSIDE SPACING
- Publication number 20250096074
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250096126
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Dan Moy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20250062126
- Publication date Feb 20, 2025
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE TRACKPLAN FOR POWER DELIVERY
- Publication number 20250054863
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE CONTACT OVER LOCALLY RAISED GATE
- Publication number 20250040168
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Formation With Staggered Gate Patterning
- Publication number 20250040184
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS

Lawrence A. Clevenger

Person

Patents Grantslast 30 patents

Stacked transistor layout for improved cell height scaling

Advanced metal interconnect

Gate-cut and separation techniques for enabling independent gate co...

Dielectric caps for power and signal line routing

Semiconductor device having a backside power rail

Top via patterning using metal as hard mask and via conductor

Single-mask alternating line deposition

Stacked transistors with different channel widths

Selective ILD deposition for fully aligned via with airgap

3D nanochannel interleaved devices

Horizontal RRAM device and architecture for variability reduction

Memory cell in wafer backside

Self-aligning spacer tight pitch via

Self aligned pattern formation post spacer etchback in tight pitch...

Semiconductor structures with backside gate contacts

Top via interconnect having a line with a reduced bottom dimension

Insulated phase change memory using porous dielectrics

Circuit design watermarking

Interconnects having spacers for improved top via critical dimensio...

Semiconductor device including a porous dielectric layer, and metho...

Rework for metal interconnects using etch and thermal anneal

Top via with damascene line and via

Contacts having a geometry to reduce resistance

Top via process with damascene metal

Optimizating semiconductor binning by feed-forward process adjustment

Fully aligned top vias

Advanced metal interconnects with a replacement metal

Back-side wafer modification

Top via with next level line selective growth

Multi-terminal phase change memory device

Patents Applicationslast 30 patents

ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL

REPLACEMENT FULLY ALIGNED VIA AND METAL LINE

SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS

THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...

FLY-OVER METAL JUMPER CONNECTION

PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING

ASYMMETRIC VIA BAR UNDER POWER RAIL

GATE TIE-DOWN TO BACKSIDE POWER RAIL

BURIED METAL JUMPER STRUCTURE FOR BEOL

COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING

STACKED TRANSISTORS WITH DIFFERENT CHANNEL WIDTHS

SEMICONDUCTOR STRUCTURES HAVING ANGLED DIELECTRIC BARS ATTACHED TO...

VIA CONNECTION IN MIDDLE BEOL WIRING

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

STACKED FET WITH ASYMMETRIC CELL BOUNDARY

LINE-VIA-LINE STRUCTURE FOR BSPDN

CUT SHAPES FOR BACKSIDE METALS

ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS

BACKSIDE RESISTOR CONNECTED TO BACKSIDE BACK END OF LINE NETWORK

BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT

METAL TIP-TO-TIP SCALING

BACKSIDE OFFSET GATE CONTACT FOR BACKSIDE SPACING

BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

FLEXIBLE TRACKPLAN FOR POWER DELIVERY

SELF-ALIGNED GATE CONTACT OVER LOCALLY RAISED GATE

Contact Formation With Staggered Gate Patterning

BACKSIDE LOCAL INTERCONNECT

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE