Lawrence A. Clevenger

Person

Rhinebeck, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
3D nanochannel interleaved devices
- Patent number 12,208,386
- Issue date Jan 28, 2025
- International Business Machines Corporation
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Horizontal RRAM device and architecture for variability reduction
- Patent number 12,156,486
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 12,106,963
- Issue date Oct 1, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with backside gate contacts
- Patent number 12,087,691
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated phase change memory using porous dielectrics
- Patent number 11,980,110
- Issue date May 7, 2024
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Circuit design watermarking
- Patent number 11,977,614
- Issue date May 7, 2024
- International Business Machines Corporation
- Carl Radens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts having a geometry to reduce resistance
- Patent number 11,875,987
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimizating semiconductor binning by feed-forward process adjustment
- Patent number 11,869,783
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fully aligned top vias
- Patent number 11,854,884
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side wafer modification
- Patent number 11,830,778
- Issue date Nov 28, 2023
- International Business Machines Corporation
- David Wolpert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-terminal phase change memory device
- Patent number 11,812,676
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change memory cell galvanic corrosion prevention
- Patent number 11,800,817
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Injo Ok
Information Patent Grant
Integrated diode memory device
- Patent number 11,800,819
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paint on micro chip touch screens
- Patent number 11,790,072
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Maryam Ashoori
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
3D nanochannel interleaved devices
- Patent number 11,779,918
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Backside floating metal for increased capacitance
- Patent number 11,756,887
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internet of things (IoT) real-time response to defined symptoms
- Patent number 11,744,981
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Mahmoud Amin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manipulation of a molecule using dipole moments
- Patent number 11,738,995
- Issue date Aug 29, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Contact Formation With Staggered Gate Patterning
- Publication number 20250040184
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Crackstop Interweave Architectural Design Using S...
- Publication number 20250006658
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CHANGE BETWEEN METAL LINES
- Publication number 20250006638
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR BACKSIDE SIGNAL AND POWER
- Publication number 20240421087
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED GATE CUT REGION
- Publication number 20240420959
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- Publication number 20240421078
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- Publication number 20240421079
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES WITH BACKSIDE CONTACTS
- Publication number 20240421038
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED GATE CUT REGION
- Publication number 20240420960
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION WITH BACKSIDE POWER PLANES
- Publication number 20240421088
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE WITH THINNER Si LAYER
- Publication number 20240413164
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PASSIVE DEVICE INTEGRATION FOR SILICON-ON-INSULATOR S...
- Publication number 20240395664
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...
- Publication number 20240395822
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY
- Publication number 20240395711
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SELF ALIGNED SKIP VIA
- Publication number 20240371729
- Publication date Nov 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOUGED INTERCONNECT LINE
- Publication number 20240363524
- Publication date Oct 31, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET VIA FORMATION FOR FLEXIBLE ROUTING
- Publication number 20240332165
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IRREGULAR-SHAPED POWER RAIL IN CELL POWER DISTRIBUTION
- Publication number 20240321748
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LITHO-ETCH-LITHO-ETCH MANDREL CUT PROCESS FOR ADVANCED...
- Publication number 20240321587
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Xiaoming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT
- Publication number 20240321687
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA IN DOUBLE DIFFUSION BREAK TO CONNECT TO BACKSIDE I...
- Publication number 20240312912
- Publication date Sep 19, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE INTERCONNECT STRUCTURES
- Publication number 20240297167
- Publication date Sep 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASS-THROUGH WIRING IN NOTCHED INTERCONNECT
- Publication number 20240290713
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS

Lawrence A. Clevenger

Person

Patents Grantslast 30 patents

3D nanochannel interleaved devices

Horizontal RRAM device and architecture for variability reduction

Memory cell in wafer backside

Self-aligning spacer tight pitch via

Self aligned pattern formation post spacer etchback in tight pitch...

Semiconductor structures with backside gate contacts

Top via interconnect having a line with a reduced bottom dimension

Insulated phase change memory using porous dielectrics

Circuit design watermarking

Interconnects having spacers for improved top via critical dimensio...

Semiconductor device including a porous dielectric layer, and metho...

Rework for metal interconnects using etch and thermal anneal

Top via with damascene line and via

Contacts having a geometry to reduce resistance

Top via process with damascene metal

Optimizating semiconductor binning by feed-forward process adjustment

Fully aligned top vias

Advanced metal interconnects with a replacement metal

Back-side wafer modification

Top via with next level line selective growth

Multi-terminal phase change memory device

Top via cut fill process for line extension reduction

Phase change memory cell galvanic corrosion prevention

Integrated diode memory device

Conductive lines with subtractive cuts

Paint on micro chip touch screens

3D nanochannel interleaved devices

Backside floating metal for increased capacitance

Internet of things (IoT) real-time response to defined symptoms

Manipulation of a molecule using dipole moments

Patents Applicationslast 30 patents

Contact Formation With Staggered Gate Patterning

BACKSIDE LOCAL INTERCONNECT

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

Three Dimensional Crackstop Interweave Architectural Design Using S...

PITCH CHANGE BETWEEN METAL LINES

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

STRUCTURE FOR BACKSIDE SIGNAL AND POWER

INVERTED GATE CUT REGION

REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE

INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES

STACKED DEVICES WITH BACKSIDE CONTACTS

INVERTED GATE CUT REGION

POWER DISTRIBUTION WITH BACKSIDE POWER PLANES

PASSIVE DEVICE WITH THINNER Si LAYER

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR PASSIVE DEVICE INTEGRATION FOR SILICON-ON-INSULATOR S...

BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...

SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY

BACKSIDE SELF ALIGNED SKIP VIA

GOUGED INTERCONNECT LINE

OFFSET VIA FORMATION FOR FLEXIBLE ROUTING

IRREGULAR-SHAPED POWER RAIL IN CELL POWER DISTRIBUTION

SELF-ALIGNED LITHO-ETCH-LITHO-ETCH MANDREL CUT PROCESS FOR ADVANCED...

BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT

SELF-ALIGNED VIA IN DOUBLE DIFFUSION BREAK TO CONNECT TO BACKSIDE I...

SELF-ALIGNED BACKSIDE INTERCONNECT STRUCTURES

PASS-THROUGH WIRING IN NOTCHED INTERCONNECT