Lawrence A. Clevenger

Person

Rhinebeck, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Insulated phase change memory using porous dielectrics
- Patent number 11,980,110
- Issue date May 7, 2024
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Circuit design watermarking
- Patent number 11,977,614
- Issue date May 7, 2024
- International Business Machines Corporation
- Carl Radens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts having a geometry to reduce resistance
- Patent number 11,875,987
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimizating semiconductor binning by feed-forward process adjustment
- Patent number 11,869,783
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fully aligned top vias
- Patent number 11,854,884
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side wafer modification
- Patent number 11,830,778
- Issue date Nov 28, 2023
- International Business Machines Corporation
- David Wolpert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-terminal phase change memory device
- Patent number 11,812,676
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change memory cell galvanic corrosion prevention
- Patent number 11,800,817
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Injo Ok
Information Patent Grant
Integrated diode memory device
- Patent number 11,800,819
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paint on micro chip touch screens
- Patent number 11,790,072
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Maryam Ashoori
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
3D nanochannel interleaved devices
- Patent number 11,779,918
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Backside floating metal for increased capacitance
- Patent number 11,756,887
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internet of things (IoT) real-time response to defined symptoms
- Patent number 11,744,981
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Mahmoud Amin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manipulation of a molecule using dipole moments
- Patent number 11,738,995
- Issue date Aug 29, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrical device having conductive lines with air gaps therebetwee...
- Patent number 11,735,524
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio vias for integrated circuits
- Patent number 11,682,617
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 11,676,854
- Issue date Jun 13, 2023
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 11,670,510
- Issue date Jun 6, 2023
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned pattern formation for a semiconductor device
- Patent number 11,646,221
- Issue date May 9, 2023
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cognitive system for localized LIDAR pollution detection using auto...
- Patent number 11,636,353
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DIAGONAL WIRING LEVEL WITH SKIP-LEVEL VIA CONNECTIONS
- Publication number 20240153867
- Publication date May 9, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH METAL VIA STRUCTURES
- Publication number 20240153866
- Publication date May 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR (VTFET) WITH BACKSIDE WR...
- Publication number 20240145311
- Publication date May 2, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS
- Publication number 20240136253
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY
- Publication number 20240136414
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...
- Publication number 20240136287
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside BPR/BSPDN Intergration with Backside Local Interconnect.
- Publication number 20240120256
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA WITH LATERAL LINE CONNECTION
- Publication number 20240120271
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRAIN
- Publication number 20240113176
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRAIN
- Publication number 20240112985
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE MRAM WITH FRONTSIDE DEVICES
- Publication number 20240114699
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRA...
- Publication number 20240113219
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
- Publication number 20240113013
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VTFETS WITH WRAP-AROUND BACKSIDE CONTACTS
- Publication number 20240113178
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTORS WITH HIGH PERFORMANCE O...
- Publication number 20240105841
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE
- Publication number 20240105583
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOCAL FRONTSIDE POWER RAIL WITH GLOBAL BACKSIDE POWER DELIVERY
- Publication number 20240105608
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SIGNAL INTEGRATION THROUGH VIA TO SIGNAL LINE CONNECTION
- Publication number 20240105611
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA
- Publication number 20240105506
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE GATE CONTACT
- Publication number 20240105610
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20240096627
- Publication date Mar 21, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VTFET CIRCUIT WITH OPTIMIZED OUTPUT
- Publication number 20240096794
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT
- Publication number 20240096801
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT
- Publication number 20240096786
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...
- Publication number 20240096692
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20240096693
- Publication date Mar 21, 2024
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE EXTENSION FOR SKIP-LEVEL VIA LANDING
- Publication number 20240088018
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE T...
- Publication number 20240088037
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY
- Publication number 20240088036
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT WITH FULL WRAP-AROUND CONTACT
- Publication number 20240088038
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Lawrence A. Clevenger

Person

Patents Grantslast 30 patents

Insulated phase change memory using porous dielectrics

Circuit design watermarking

Interconnects having spacers for improved top via critical dimensio...

Semiconductor device including a porous dielectric layer, and metho...

Rework for metal interconnects using etch and thermal anneal

Top via with damascene line and via

Contacts having a geometry to reduce resistance

Top via process with damascene metal

Optimizating semiconductor binning by feed-forward process adjustment

Fully aligned top vias

Advanced metal interconnects with a replacement metal

Back-side wafer modification

Top via with next level line selective growth

Multi-terminal phase change memory device

Top via cut fill process for line extension reduction

Phase change memory cell galvanic corrosion prevention

Integrated diode memory device

Conductive lines with subtractive cuts

Paint on micro chip touch screens

3D nanochannel interleaved devices

Backside floating metal for increased capacitance

Internet of things (IoT) real-time response to defined symptoms

Manipulation of a molecule using dipole moments

Electrical device having conductive lines with air gaps therebetwee...

High aspect ratio vias for integrated circuits

Selective ILD deposition for fully aligned via with airgap

Self aligned pattern formation post spacer etchback in tight pitch...

Stepped top via for via resistance reduction

Self-aligned pattern formation for a semiconductor device

Cognitive system for localized LIDAR pollution detection using auto...

Patents Applicationslast 30 patents

DIAGONAL WIRING LEVEL WITH SKIP-LEVEL VIA CONNECTIONS

INTERCONNECT WITH METAL VIA STRUCTURES

VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR (VTFET) WITH BACKSIDE WR...

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY

Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...

Backside BPR/BSPDN Intergration with Backside Local Interconnect.

SKIP VIA WITH LATERAL LINE CONNECTION

FIELD EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRAIN

FIELD EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRAIN

BACKSIDE MRAM WITH FRONTSIDE DEVICES

VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRA...

SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS

VTFETS WITH WRAP-AROUND BACKSIDE CONTACTS

VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTORS WITH HIGH PERFORMANCE O...

INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE

LOCAL FRONTSIDE POWER RAIL WITH GLOBAL BACKSIDE POWER DELIVERY

BACKSIDE SIGNAL INTEGRATION THROUGH VIA TO SIGNAL LINE CONNECTION

LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA

VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE GATE CONTACT

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

VTFET CIRCUIT WITH OPTIMIZED OUTPUT

POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT

SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT

HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

LINE EXTENSION FOR SKIP-LEVEL VIA LANDING

INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE T...

A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY

BACKSIDE CONTACT WITH FULL WRAP-AROUND CONTACT