Leonard E. Mess

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of fabrication thereof
- Patent number 8,049,342
- Issue date Nov 1, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including semiconductor dice in laterally off...
- Patent number 7,999,378
- Issue date Aug 16, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies, electronic devices including the s...
- Patent number 7,998,792
- Issue date Aug 16, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable ceramic FBGA for high thermal applications
- Patent number 7,829,991
- Issue date Nov 9, 2010
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 7,704,794
- Issue date Apr 27, 2010
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly for stacked BGA packages
- Patent number 7,408,255
- Issue date Aug 5, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module assembly for stacked BGA packages
- Patent number 7,400,032
- Issue date Jul 15, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module assembly and method for stacked BGA packages
- Patent number 7,396,702
- Issue date Jul 8, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked mass storage flash memory package
- Patent number 7,375,419
- Issue date May 20, 2008
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable ceramic FBGA for high thermal applications
- Patent number 7,285,442
- Issue date Oct 23, 2007
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module assembly and method for stacked BGA packages
- Patent number 7,279,797
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked mass storage flash memory package
- Patent number 7,262,506
- Issue date Aug 28, 2007
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment and orientation features for a semiconductor package
- Patent number 7,229,905
- Issue date Jun 12, 2007
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing warpage during application and curing of encaps...
- Patent number 7,166,252
- Issue date Jan 23, 2007
- Micron Technology, Inc.
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked mass storage flash memory package
- Patent number 6,900,528
- Issue date May 31, 2005
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment and orientation features for a semiconductor package
- Patent number 6,869,869
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for electronically coupling a device to an electrical apparatus
- Patent number 6,864,700
- Issue date Mar 8, 2005
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable ceramic FBGA for high thermal applications
- Patent number 6,858,926
- Issue date Feb 22, 2005
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module assembly for stacked BGA packages
- Patent number 6,838,768
- Issue date Jan 4, 2005
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing warpage during application and curing of encaps...
- Patent number 6,830,719
- Issue date Dec 14, 2004
- Micron Technology, Inc.
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulation method in a molding machine for an electronic device
- Patent number 6,815,261
- Issue date Nov 9, 2004
- Micron Technology, Inc.
- Leonard E. Mess
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interposer for electrically coupling a semiconductive device to an...
- Patent number 6,777,965
- Issue date Aug 17, 2004
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing warpage during application and cu...
- Patent number 6,764,549
- Issue date Jul 20, 2004
- Micron Technology, Inc.
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink with alignment and retaining features
- Patent number 6,760,224
- Issue date Jul 6, 2004
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing a semiconductor device
- Patent number 6,690,188
- Issue date Feb 10, 2004
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable ceramic fbga for high thermal applications
- Patent number 6,650,007
- Issue date Nov 18, 2003
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for reducing warpage during application and curing of enc...
- Patent number 6,592,670
- Issue date Jul 15, 2003
- Micron Technology, Inc.
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment and orientation features for a semiconductor package
- Patent number 6,577,019
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module assembly for stacked BGA packages
- Patent number 6,563,217
- Issue date May 13, 2003
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods of packaging and testing die
- Patent number 6,558,966
- Issue date May 6, 2003
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SEMICONDUCTOR DICE IN LATERALLY OFF...
- Publication number 20100148331
- Publication date Jun 17, 2010
- ROUND ROCK RESEARCH, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES, ELECTRONIC DEVICES INCLUDING THE S...
- Publication number 20100078793
- Publication date Apr 1, 2010
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MASS STORAGE FLASH MEMORY PACKAGE
- Publication number 20090286356
- Publication date Nov 19, 2009
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS
- Publication number 20080042252
- Publication date Feb 21, 2008
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked mass storage flash memory package
- Publication number 20070065987
- Publication date Mar 22, 2007
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module assembly and method for stacked BGA packages
- Publication number 20060060957
- Publication date Mar 23, 2006
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module assembly and method for stacked BGA packages
- Publication number 20060049504
- Publication date Mar 9, 2006
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module assembly and method for stacked BGA packages
- Publication number 20060051953
- Publication date Mar 9, 2006
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stackable ceramic FBGA for high thermal applications
- Publication number 20050146010
- Publication date Jul 7, 2005
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment and orientation features for a semiconductor package
- Publication number 20050148116
- Publication date Jul 7, 2005
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module assembly and method for stacked BGA packages
- Publication number 20050110135
- Publication date May 26, 2005
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for reducing warpage during application and curing of encaps...
- Publication number 20050087909
- Publication date Apr 28, 2005
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked mass storage flash memory package
- Publication number 20050029645
- Publication date Feb 10, 2005
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable ceramic FBGA for high thermal applications
- Publication number 20040104408
- Publication date Jun 3, 2004
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for reducing warpage during application and cu...
- Publication number 20040011283
- Publication date Jan 22, 2004
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Alignment and orientation features for a semiconductor package
- Publication number 20030205795
- Publication date Nov 6, 2003
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module assembly for stacked BGA packages
- Publication number 20030197271
- Publication date Oct 23, 2003
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked mass storage flash memory package
- Publication number 20030137042
- Publication date Jul 24, 2003
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink with alignment and retaining features
- Publication number 20030128523
- Publication date Jul 10, 2003
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing warpage during application and curing of encaps...
- Publication number 20030111766
- Publication date Jun 19, 2003
- Derek J. Gochnour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball grid array (BGA) encapsulation mold
- Publication number 20030003631
- Publication date Jan 2, 2003
- Leonard E. Mess
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Stacked mass storage flash memory package
- Publication number 20020195697
- Publication date Dec 26, 2002
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module assembly for stacked BGA packages
- Publication number 20020125571
- Publication date Sep 12, 2002
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods of packaging and testing die
- Publication number 20020043658
- Publication date Apr 18, 2002
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink with alignment and retaining features
- Publication number 20020024798
- Publication date Feb 28, 2002
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable ceramic fbga for high thermal applications
- Publication number 20010048152
- Publication date Dec 6, 2001
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array (BGA) encapsulation mold
- Publication number 20010044171
- Publication date Nov 22, 2001
- Leonard E. Mess
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Apparatus and methods of packaging and testing die
- Publication number 20010040279
- Publication date Nov 15, 2001
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of testing a semiconductive device
- Publication number 20010035763
- Publication date Nov 1, 2001
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for testing a semiconductor device
- Publication number 20010035764
- Publication date Nov 1, 2001
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS

Leonard E. Mess

Person

Patents Grantslast 30 patents

Semiconductor device and method of fabrication thereof

Semiconductor devices including semiconductor dice in laterally off...

Semiconductor device assemblies, electronic devices including the s...

Stackable ceramic FBGA for high thermal applications

Method of forming a semiconductor device

Assembly for stacked BGA packages

Module assembly for stacked BGA packages

Module assembly and method for stacked BGA packages

Stacked mass storage flash memory package

Stackable ceramic FBGA for high thermal applications

Module assembly and method for stacked BGA packages

Stacked mass storage flash memory package

Alignment and orientation features for a semiconductor package

Method for reducing warpage during application and curing of encaps...

Stacked mass storage flash memory package

Alignment and orientation features for a semiconductor package

System for electronically coupling a device to an electrical apparatus

Stackable ceramic FBGA for high thermal applications

Module assembly for stacked BGA packages

Method for reducing warpage during application and curing of encaps...

Encapsulation method in a molding machine for an electronic device

Interposer for electrically coupling a semiconductive device to an...

Method and apparatus for reducing warpage during application and cu...

Heat sink with alignment and retaining features

Method of testing a semiconductor device

Stackable ceramic fbga for high thermal applications

Apparatus for reducing warpage during application and curing of enc...

Alignment and orientation features for a semiconductor package

Module assembly for stacked BGA packages

Apparatus and methods of packaging and testing die

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING SEMICONDUCTOR DICE IN LATERALLY OFF...

SEMICONDUCTOR DEVICE ASSEMBLIES, ELECTRONIC DEVICES INCLUDING THE S...

STACKED MASS STORAGE FLASH MEMORY PACKAGE

STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS

Stacked mass storage flash memory package

Module assembly and method for stacked BGA packages

Module assembly and method for stacked BGA packages

Module assembly and method for stacked BGA packages

Stackable ceramic FBGA for high thermal applications

Alignment and orientation features for a semiconductor package

Module assembly and method for stacked BGA packages

Method for reducing warpage during application and curing of encaps...

Stacked mass storage flash memory package

Stackable ceramic FBGA for high thermal applications

Method and apparatus for reducing warpage during application and cu...

Alignment and orientation features for a semiconductor package

Module assembly for stacked BGA packages

Stacked mass storage flash memory package

Heat sink with alignment and retaining features

Method for reducing warpage during application and curing of encaps...

Ball grid array (BGA) encapsulation mold

Stacked mass storage flash memory package

Module assembly for stacked BGA packages

Apparatus and methods of packaging and testing die

Heat sink with alignment and retaining features

Stackable ceramic fbga for high thermal applications

Ball grid array (BGA) encapsulation mold

Apparatus and methods of packaging and testing die

Method of testing a semiconductive device

System for testing a semiconductor device