Lianzhong Yu

Person

Stafford, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level packaged MEMS device
- Patent number 8,685,776
- Issue date Apr 1, 2014
- Honeywell International Inc.
- Peter H. LaFond
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Methods of creating a micro electro-mechanical systems acceleromete...
- Patent number 8,481,354
- Issue date Jul 9, 2013
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Single silicon-on-insulator (SOI) wafer accelerometer fabrication
- Patent number 8,057,690
- Issue date Nov 15, 2011
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Single SOI wafer accelerometer fabrication process
- Patent number 7,976,714
- Issue date Jul 12, 2011
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making dimple structure for prevention of MEMS device sti...
- Patent number 7,482,192
- Issue date Jan 27, 2009
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Comb structure fabrication methods and systems
- Patent number 7,479,402
- Issue date Jan 20, 2009
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS vertical comb drive with improved vibration performance
- Patent number 7,469,588
- Issue date Dec 30, 2008
- Honeywell International Inc.
- Peter H. LaFond
- G01 - MEASURING TESTING
Information Patent Grant
System and method for uniform multi-plane silicon oxide layer forma...
- Patent number 7,442,589
- Issue date Oct 28, 2008
- Honeywell International Inc.
- Lianzhong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance MEMS packaging architecture
- Patent number 7,238,999
- Issue date Jul 3, 2007
- Honeywell International Inc.
- Peter H. LaFond
- G01 - MEASURING TESTING
Information Patent Grant
Integrated and multi-axis sensor assembly and packaging
- Patent number 7,152,473
- Issue date Dec 26, 2006
- Input/Output, Inc.
- Larry Rushefsky
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibrating beam accelerometer
- Patent number 7,024,934
- Issue date Apr 11, 2006
- Honeywell International, Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibrating beam accelerometer two-wafer fabrication process
- Patent number 6,938,334
- Issue date Sep 6, 2005
- Honeywell International, Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Accelerometer with folded beams
- Patent number 6,805,008
- Issue date Oct 19, 2004
- Input/Output, Inc.
- Arjun Selvakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Merged-mask micro-machining process
- Patent number 6,617,098
- Issue date Sep 9, 2003
- Input/Output, Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Temporary bridge for micro machined structures
- Patent number 6,458,513
- Issue date Oct 1, 2002
- Input/Output, Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual axis micro machined mirror device
- Patent number 6,454,421
- Issue date Sep 24, 2002
- Input/Output, Inc.
- Duli Yu
- G02 - OPTICS
Information Patent Grant
Micro machined mirror
- Patent number 6,315,423
- Issue date Nov 13, 2001
- Input/Output, Inc.
- Duli Yu
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF CREATING A MICRO ELECTRO-MECHANICAL SYSTEMS ACCELEROMETE...
- Publication number 20110300658
- Publication date Dec 8, 2011
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGED MEMS DEVICE
- Publication number 20110092018
- Publication date Apr 21, 2011
- Honeywell International Inc.
- Peter H. LaFond
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
SINGLE SILICON-ON-INSULATOR (SOI) WAFER ACCELEROMETER FABRICATION
- Publication number 20100233882
- Publication date Sep 16, 2010
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR VERTICAL STACKED SEMICONDUCTOR DEVICES
- Publication number 20090283917
- Publication date Nov 19, 2009
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGLE SOI WAFER ACCELEROMETER FABRICATION PROCESS
- Publication number 20090176370
- Publication date Jul 9, 2009
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGED MEMS DEVICE
- Publication number 20090085194
- Publication date Apr 2, 2009
- Honeywell International Inc.
- Peter H. LaFond
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
THICK ACTIVE LAYER FOR MEMS DEVICE USING WAFER DISSOLVE PROCESS
- Publication number 20090001499
- Publication date Jan 1, 2009
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MAKING DIMPLE STRUCTURE FOR PREVENTION OF MEMS DEVICE STI...
- Publication number 20070269920
- Publication date Nov 22, 2007
- Honeywell International Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS VERTICAL COMB DRIVE WITH IMPROVED VIBRATION PERFORMANCE
- Publication number 20070266787
- Publication date Nov 22, 2007
- Honeywell International Inc.
- Peter H. LaFond
- G01 - MEASURING TESTING
Information Patent Application
MECHANICAL ISOLATION FOR MEMS DEVICES
- Publication number 20070246665
- Publication date Oct 25, 2007
- Peter H. LaFond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMB STRUCTURE FABRICATION METHODS AND SYSTEMS
- Publication number 20070215961
- Publication date Sep 20, 2007
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR UNIFORM MULTI-PLANE SILICON OXIDE LAYER FORMA...
- Publication number 20070167027
- Publication date Jul 19, 2007
- Honeywell International Inc.
- Lianzhong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for direct silicon epitaxy thickness measuring
- Publication number 20070004056
- Publication date Jan 4, 2007
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
High performance MEMS packaging architecture
- Publication number 20060163679
- Publication date Jul 27, 2006
- Honeywell International, Inc.
- Peter H. LaFond
- G01 - MEASURING TESTING
Information Patent Application
Vibrating beam accelerometer
- Publication number 20050160816
- Publication date Jul 28, 2005
- Honeywell International, Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vibrating beam accelerometer two-wafer fabrication process
- Publication number 20050091843
- Publication date May 5, 2005
- Honeywell International, Inc.
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Accelerometer with folded beams
- Publication number 20040255675
- Publication date Dec 23, 2004
- Input/Output, Inc.
- Arjun Selvakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Accelerometer with folded beams
- Publication number 20020178817
- Publication date Dec 5, 2002
- Input/Output, Inc.
- Arjun Selvakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Accelerometer with re-entrant grooves
- Publication number 20020104379
- Publication date Aug 8, 2002
- Input/Output, Inc.
- Robert Ried
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Dual axis micro-machined mirror device
- Publication number 20020012180
- Publication date Jan 31, 2002
- Duli Yu
- G02 - OPTICS

Lianzhong Yu

Person

Patents Grantslast 30 patents

Wafer level packaged MEMS device

Methods of creating a micro electro-mechanical systems acceleromete...

Single silicon-on-insulator (SOI) wafer accelerometer fabrication

Single SOI wafer accelerometer fabrication process

Method of making dimple structure for prevention of MEMS device sti...

Comb structure fabrication methods and systems

MEMS vertical comb drive with improved vibration performance

System and method for uniform multi-plane silicon oxide layer forma...

High performance MEMS packaging architecture

Integrated and multi-axis sensor assembly and packaging

Vibrating beam accelerometer

Vibrating beam accelerometer two-wafer fabrication process

Accelerometer with folded beams

Merged-mask micro-machining process

Temporary bridge for micro machined structures

Dual axis micro machined mirror device

Micro machined mirror

Patents Applicationslast 30 patents

METHODS OF CREATING A MICRO ELECTRO-MECHANICAL SYSTEMS ACCELEROMETE...

WAFER LEVEL PACKAGED MEMS DEVICE

SINGLE SILICON-ON-INSULATOR (SOI) WAFER ACCELEROMETER FABRICATION

SYSTEMS AND METHODS FOR VERTICAL STACKED SEMICONDUCTOR DEVICES

SINGLE SOI WAFER ACCELEROMETER FABRICATION PROCESS

WAFER LEVEL PACKAGED MEMS DEVICE

THICK ACTIVE LAYER FOR MEMS DEVICE USING WAFER DISSOLVE PROCESS

METHOD OF MAKING DIMPLE STRUCTURE FOR PREVENTION OF MEMS DEVICE STI...

MEMS VERTICAL COMB DRIVE WITH IMPROVED VIBRATION PERFORMANCE

MECHANICAL ISOLATION FOR MEMS DEVICES

COMB STRUCTURE FABRICATION METHODS AND SYSTEMS

SYSTEM AND METHOD FOR UNIFORM MULTI-PLANE SILICON OXIDE LAYER FORMA...

Systems and methods for direct silicon epitaxy thickness measuring

High performance MEMS packaging architecture

Vibrating beam accelerometer

Vibrating beam accelerometer two-wafer fabrication process

Accelerometer with folded beams

Accelerometer with folded beams

Accelerometer with re-entrant grooves

Dual axis micro-machined mirror device