Ludovico E. Bancod

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,057,434
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,488,934
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,872,879
- Issue date Dec 22, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,163,867
- Issue date Dec 25, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex circuit package and method
- Patent number 8,536,462
- Issue date Sep 17, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable plasma cleaned via package and method
- Patent number 8,338,229
- Issue date Dec 25, 2012
- Amkor Technology, Inc.
- Ludovico E. Bancod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable treated via package and method
- Patent number 8,300,423
- Issue date Oct 30, 2012
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset etched corner leads for semiconductor package
- Patent number 7,598,598
- Issue date Oct 6, 2009
- Amkor Technology, Inc.
- Ludovico Bancod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure digital memory card using land grid array structure
- Patent number 7,485,491
- Issue date Feb 3, 2009
- Amkor Technology, Inc.
- Jeffrey Alan Miks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure digital memory card using land grid array structure
- Patent number 7,112,875
- Issue date Sep 26, 2006
- Amkor Technology, Inc.
- Jeffrey Alan Miks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip having enhanced testability
- Patent number 7,008,825
- Issue date Mar 7, 2006
- Amkor Technology, Inc.
- Ludovico E. Bancod
- G01 - MEASURING TESTING
Information Patent Grant
Reduced copper lead frame for saw-singulated chip package
- Patent number 6,885,086
- Issue date Apr 26, 2005
- Amkor Technology, Inc.
- Harry J. Fogelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset etched corner leads for semiconductor package
- Patent number 6,847,099
- Issue date Jan 25, 2005
- Amkor Technology Inc.
- Ludovico Bancod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Saw and etch singulation method for a chip package
- Patent number 6,841,414
- Issue date Jan 11, 2005
- Amkor Technology, Inc.
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with singulation crease
- Patent number 6,611,047
- Issue date Aug 26, 2003
- Amkor Technology, Inc.
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with plated end leads
- Patent number 6,608,366
- Issue date Aug 19, 2003
- Harry J. Fogelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device package and leadframe
- Patent number 6,339,252
- Issue date Jan 15, 2002
- Amkor Technology, Inc.
- Eulogia A. Niones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and leadframe and method for making the p...
- Patent number 6,258,629
- Issue date Jul 10, 2001
- Amkor Technology, Inc.
- Eulogia A. Niones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230118400
- Publication date Apr 20, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210217725
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180323170
- Publication date Nov 8, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180138155
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR SIDEWALL PROTECTION
- Publication number 20150340332
- Publication date Nov 26, 2015
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin integrated circuit device packages for improved radio frequenc...
- Publication number 20070176287
- Publication date Aug 2, 2007
- Sean T. Crowley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with singulation crease
- Publication number 20030073265
- Publication date Apr 17, 2003
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS

Ludovico E. Bancod

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Copper pillar sidewall protection

Flex circuit package and method

Stackable plasma cleaned via package and method

Stackable treated via package and method

Offset etched corner leads for semiconductor package

Secure digital memory card using land grid array structure

Secure digital memory card using land grid array structure

Leadframe strip having enhanced testability

Reduced copper lead frame for saw-singulated chip package

Offset etched corner leads for semiconductor package

Saw and etch singulation method for a chip package

Semiconductor package with singulation crease

Lead frame with plated end leads

Electronic device package and leadframe

Electronic device package and leadframe and method for making the p...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

COPPER PILLAR SIDEWALL PROTECTION

Thin integrated circuit device packages for improved radio frequenc...

Semiconductor package with singulation crease