Martin Standing

Person

Tonbridge, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with integrated semiconductor devices and pas...
- Patent number 9,837,393
- Issue date Dec 5, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 9,633,951
- Issue date Apr 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and passive component integration in a semicon...
- Patent number 9,147,644
- Issue date Sep 29, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package
- Patent number 9,048,196
- Issue date Jun 2, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package
- Patent number 9,041,191
- Issue date May 26, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,786,072
- Issue date Jul 22, 2014
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mountable semiconductor device package
- Patent number 8,686,554
- Issue date Apr 1, 2014
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 8,466,546
- Issue date Jun 18, 2013
- International Rectifier Corporation
- Andy Farlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste for forming an interconnect and interconnect formed from the...
- Patent number 8,368,223
- Issue date Feb 5, 2013
- International Rectifier Corporation
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderable top metalization and passivation for source mounted package
- Patent number 8,368,211
- Issue date Feb 5, 2013
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase voltage regulation module
- Patent number 8,264,073
- Issue date Sep 11, 2012
- International Rectifier Corporation
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective barrier layer for semiconductor device electrodes
- Patent number 8,125,083
- Issue date Feb 28, 2012
- International Rectifier Corporation
- Martin Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive chip-scale package
- Patent number 8,097,938
- Issue date Jan 17, 2012
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste for forming an interconnect and interconnect formed from the...
- Patent number 8,083,832
- Issue date Dec 27, 2011
- International Rectifier Corporation
- Martin Standing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of fabricating a semiconductor package
- Patent number 8,061,023
- Issue date Nov 22, 2011
- International Rectifier Corporation
- Martin Standing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Universal pad arrangement for surface mounted semiconductor devices
- Patent number 7,968,984
- Issue date Jun 28, 2011
- International Rectifier Corporation
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 7,592,688
- Issue date Sep 22, 2009
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 7,524,701
- Issue date Apr 28, 2009
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package utilizing proud interconnect material
- Patent number 7,482,681
- Issue date Jan 27, 2009
- International Rectifier Corporation
- Martin Standing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 7,476,979
- Issue date Jan 13, 2009
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device housing with increased clearance...
- Patent number 7,476,964
- Issue date Jan 13, 2009
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package
- Patent number 7,466,012
- Issue date Dec 16, 2008
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package fabrication
- Patent number 7,402,507
- Issue date Jul 22, 2008
- International Rectifier Corporation
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 7,368,325
- Issue date May 6, 2008
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 7,364,949
- Issue date Apr 29, 2008
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package utilizing proud interconnect material
- Patent number 7,315,081
- Issue date Jan 1, 2008
- International Rectifier Corporation
- Martin Standing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounted package with die bottom spaced from support board
- Patent number 7,285,866
- Issue date Oct 23, 2007
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 7,253,090
- Issue date Aug 7, 2007
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,230,333
- Issue date Jun 12, 2007
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 7,122,887
- Issue date Oct 17, 2006
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED SEMICONDUCTOR DEVICES AND PAS...
- Publication number 20170062395
- Publication date Mar 2, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderable Contact and Passivation for Semiconductor Dies
- Publication number 20130140701
- Publication date Jun 6, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Reliable Solderable Contact
- Publication number 20130143399
- Publication date Jun 6, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20120061725
- Publication date Mar 15, 2012
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and passive component integration in a semicon...
- Publication number 20100102327
- Publication date Apr 29, 2010
- INTERNATIONAL RECTIFIER CORPORATION (EL SEGUNDO, CA)
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE
- Publication number 20090174058
- Publication date Jul 9, 2009
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE VOLTAGE REGULATION MODULE
- Publication number 20090108821
- Publication date Apr 30, 2009
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor package
- Publication number 20090008804
- Publication date Jan 8, 2009
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASTE FOR FORMING AN INTERCONNECT AND INTERCONNECT FORMED FROM THE...
- Publication number 20080230152
- Publication date Sep 25, 2008
- Martin Standing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20080230889
- Publication date Sep 25, 2008
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically mountable semiconductor device package
- Publication number 20080224286
- Publication date Sep 18, 2008
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20080066303
- Publication date Mar 20, 2008
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package utilizing proud interconnect material
- Publication number 20070284722
- Publication date Dec 13, 2007
- International Rectifier Corporation
- Martin Standing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip-scale package
- Publication number 20070215997
- Publication date Sep 20, 2007
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20070202631
- Publication date Aug 30, 2007
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor package
- Publication number 20070164423
- Publication date Jul 19, 2007
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package including a semiconductor die having redistri...
- Publication number 20070108585
- Publication date May 17, 2007
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PAD ARRANGEMENT FOR SURFACE MOUNTED SEMICONDUCTOR DEVICES
- Publication number 20070091546
- Publication date Apr 26, 2007
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Protective barrier layer for semiconductor device electrodes
- Publication number 20070052099
- Publication date Mar 8, 2007
- Martin Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-scale package
- Publication number 20060249836
- Publication date Nov 9, 2006
- Andy Farlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package
- Publication number 20060240598
- Publication date Oct 26, 2006
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20060237840
- Publication date Oct 26, 2006
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mounted device and process of manufacture
- Publication number 20060220123
- Publication date Oct 5, 2006
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package fabrication
- Publication number 20060205112
- Publication date Sep 14, 2006
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor package
- Publication number 20060131760
- Publication date Jun 22, 2006
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package
- Publication number 20060128067
- Publication date Jun 15, 2006
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preparation of front contact for surface mounting
- Publication number 20050269677
- Publication date Dec 8, 2005
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mounted package with die bottom spaced from support board
- Publication number 20050224960
- Publication date Oct 13, 2005
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderable top metalization and passivation for source mounted package
- Publication number 20050200011
- Publication date Sep 15, 2005
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mounted device and process of manufacture
- Publication number 20050186707
- Publication date Aug 25, 2005
- International Rectifier Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

Martin Standing

Person

Patents Grantslast 30 patents

Semiconductor package with integrated semiconductor devices and pas...

Semiconductor package including a semiconductor die having redistri...

Semiconductor device and passive component integration in a semicon...

Power semiconductor package

Power semiconductor package

Semiconductor package

Vertically mountable semiconductor device package

Chip-scale package

Paste for forming an interconnect and interconnect formed from the...

Solderable top metalization and passivation for source mounted package

Multi-phase voltage regulation module

Protective barrier layer for semiconductor device electrodes

Conductive chip-scale package

Paste for forming an interconnect and interconnect formed from the...

Process of fabricating a semiconductor package

Universal pad arrangement for surface mounted semiconductor devices

Semiconductor package

Chip-scale package

Semiconductor device package utilizing proud interconnect material

Chip scale surface mounted device and process of manufacture

High voltage semiconductor device housing with increased clearance...

Power semiconductor package

Semiconductor package fabrication

Semiconductor package

Semiconductor device package

Semiconductor device package utilizing proud interconnect material

Surface mounted package with die bottom spaced from support board

Chip scale surface mounted device and process of manufacture

Semiconductor package

Chip scale surface mounted device and process of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH INTEGRATED SEMICONDUCTOR DEVICES AND PAS...

Solderable Contact and Passivation for Semiconductor Dies

Method for Forming a Reliable Solderable Contact

Power Semiconductor Package

Semiconductor device and passive component integration in a semicon...

CHIP SCALE PACKAGE

MULTI-PHASE VOLTAGE REGULATION MODULE

Power semiconductor package

PASTE FOR FORMING AN INTERCONNECT AND INTERCONNECT FORMED FROM THE...

SEMICONDUCTOR PACKAGE

Vertically mountable semiconductor device package

SEMICONDUCTOR PACKAGE

Semiconductor device package utilizing proud interconnect material

Chip-scale package

Semiconductor package

Multi-chip semiconductor package

Semiconductor package including a semiconductor die having redistri...

UNIVERSAL PAD ARRANGEMENT FOR SURFACE MOUNTED SEMICONDUCTOR DEVICES

Protective barrier layer for semiconductor device electrodes

Chip-scale package

Chip scale package

Semiconductor package

Chip scale surface mounted device and process of manufacture

Semiconductor package fabrication

Power semiconductor package

Semiconductor device package

Preparation of front contact for surface mounting

Surface mounted package with die bottom spaced from support board

Solderable top metalization and passivation for source mounted package

Chip scale surface mounted device and process of manufacture