Michael J. Palmer

Person

Waldon, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lightweight electronic equipment conductor with coolant permeable s...
- Patent number 6,734,363
- Issue date May 11, 2004
- International Business Machines Corporation
- Raymond Robert Horton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coated means for connecting a chip and a card
- Patent number 6,403,892
- Issue date Jun 11, 2002
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical alignment of superpositioned objects
- Patent number 6,295,128
- Issue date Sep 25, 2001
- International Business Machines Corporation
- Raymond Robert Horton
- G02 - OPTICS
Information Patent Grant
Diffusion bonding of lead interconnections using precise laser-ther...
- Patent number 5,948,286
- Issue date Sep 7, 1999
- International Business Machines Corporation
- Pedro A. Chalco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High efficiency thermal interposer
- Patent number 5,915,462
- Issue date Jun 29, 1999
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightweight packaging
- Patent number 5,847,926
- Issue date Dec 8, 1998
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging shaped beam lead fabrication
- Patent number 5,768,770
- Issue date Jun 23, 1998
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging shaped beam lead fabrication
- Patent number 5,734,196
- Issue date Mar 31, 1998
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch bonding
- Patent number 5,687,078
- Issue date Nov 11, 1997
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for multilayer conductor chip packaging
- Patent number 5,675,884
- Issue date Oct 14, 1997
- International Business Machines Corporation
- Raymond Robert Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellated nozzle and method of use thereof
- Patent number 5,676,301
- Issue date Oct 14, 1997
- International Business Machines Corporation
- Bernie Hernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency thermal interposer
- Patent number 5,669,437
- Issue date Sep 23, 1997
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled temperature bonding
- Patent number 5,641,114
- Issue date Jun 24, 1997
- International Business Machines Corporation
- Raymond Robert Horton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Castellated nozzle and method of use therof
- Patent number 5,593,083
- Issue date Jan 14, 1997
- International Business Machines Corporation
- Bernie Hernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying flex tape protective coating onto a flex product
- Patent number 5,546,655
- Issue date Aug 20, 1996
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method employing organometallic interconnectors
- Patent number 5,503,698
- Issue date Apr 2, 1996
- International Business Machines Corporation
- Martin J. Goldberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder application system using helix to control solder meniscus
- Patent number 5,446,261
- Issue date Aug 29, 1995
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex tape protective coating
- Patent number 5,360,946
- Issue date Nov 1, 1994
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate multiple location conductor attachment technology
- Patent number 5,322,204
- Issue date Jun 21, 1994
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond removal apparatus using alternating fluid stream
- Patent number 5,263,620
- Issue date Nov 23, 1993
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for injection molding solder and applications...
- Patent number 5,244,143
- Issue date Sep 14, 1993
- International Business Machines Corporation
- Thomas G. Ference
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding in integrated circuit packaging
- Patent number 5,242,569
- Issue date Sep 7, 1993
- International Business Machines Corporation
- Sung K. Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate multiple location conductor attachment technology
- Patent number 5,233,221
- Issue date Aug 3, 1993
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding dielectric mounted conductors to semiconductor c...
- Patent number 5,229,328
- Issue date Jul 20, 1993
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fluxless solder bonding
- Patent number 5,205,461
- Issue date Apr 27, 1993
- International Business Machines Corporation
- Harry R. Bickford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device elastomeric mounting and interconnection technology
- Patent number 5,186,632
- Issue date Feb 16, 1993
- International Business Machines Corporation
- Raymond R. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding in integrated circuit packaging
- Patent number 5,148,261
- Issue date Sep 15, 1992
- International Business Machines Corporation
- Sung K. Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding in integrated circuit packaging
- Patent number 5,135,155
- Issue date Aug 4, 1992
- International Business Machines Corporation
- Sung K. Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum bump, reworkable bump, and titanium nitride structure for...
- Patent number 5,134,460
- Issue date Jul 28, 1992
- International Business Machines Corporation
- Michael J. Brady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical solder comprising a metal salt, polyphthalaldehyde and a s...
- Patent number 5,132,351
- Issue date Jul 21, 1992
- International Business Machines Corporation
- Martin J. Goldberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Michael J. Palmer

Person

Patents Grantslast 30 patents

Lightweight electronic equipment conductor with coolant permeable s...

Coated means for connecting a chip and a card

Optical alignment of superpositioned objects

Diffusion bonding of lead interconnections using precise laser-ther...

High efficiency thermal interposer

Lightweight packaging

Electronic packaging shaped beam lead fabrication

Electronic packaging shaped beam lead fabrication

Fine pitch bonding

Apparatus for multilayer conductor chip packaging

Castellated nozzle and method of use thereof

High efficiency thermal interposer

Controlled temperature bonding

Castellated nozzle and method of use therof

Method of applying flex tape protective coating onto a flex product

Bonding method employing organometallic interconnectors

Solder application system using helix to control solder meniscus

Flex tape protective coating

Electronic substrate multiple location conductor attachment technology

Wirebond removal apparatus using alternating fluid stream

Apparatus and method for injection molding solder and applications...

Thermocompression bonding in integrated circuit packaging

Electronic substrate multiple location conductor attachment technology

Method for bonding dielectric mounted conductors to semiconductor c...

Method and apparatus for fluxless solder bonding

Electronic device elastomeric mounting and interconnection technology

Thermocompression bonding in integrated circuit packaging

Thermocompression bonding in integrated circuit packaging

Aluminum bump, reworkable bump, and titanium nitride structure for...

Chemical solder comprising a metal salt, polyphthalaldehyde and a s...