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Mukta G. Farooq
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Hopewell Junction, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Sintering a nanoparticle paste for semiconductor chip join
Patent number
12,199,059
Issue date
Jan 14, 2025
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate thinning for a backside power distribution network
Patent number
12,106,969
Issue date
Oct 1, 2024
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with early buried power rail (BPR) and backsid...
Patent number
12,057,371
Issue date
Aug 6, 2024
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection and wiring layers, package structures,...
Patent number
12,015,003
Issue date
Jun 18, 2024
International Business Machines Corporation
John Knickerbocker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked FET integration with BSPDN
Patent number
11,984,401
Issue date
May 14, 2024
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple die assembly
Patent number
11,973,058
Issue date
Apr 30, 2024
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temperature hierarchy solder bonding
Patent number
11,887,956
Issue date
Jan 30, 2024
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge chip with through via
Patent number
11,848,273
Issue date
Dec 19, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly of a chip to a substrate
Patent number
11,824,037
Issue date
Nov 21, 2023
International Business Machines Corporation
Katsuyuki Sakuma
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor circuit power delivery
Patent number
11,817,394
Issue date
Nov 14, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory and logic chip stack with a translator chip
Patent number
11,791,326
Issue date
Oct 17, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective surface layer on under bump metallurgy for solder joining
Patent number
11,682,640
Issue date
Jun 20, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mitigating cooldown peeling stress during chip package assembly
Patent number
11,545,444
Issue date
Jan 3, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for bridge chip assembly with capillary underfill
Patent number
11,404,379
Issue date
Aug 2, 2022
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Oxide-bonded wafer pair separation using laser debonding
Patent number
11,355,379
Issue date
Jun 7, 2022
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual redistribution layer structure
Patent number
11,315,831
Issue date
Apr 26, 2022
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integration structure and planar joining
Patent number
11,282,716
Issue date
Mar 22, 2022
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cu—Cu bonding for interconnects on bridge chip attached to chips an...
Patent number
11,239,167
Issue date
Feb 1, 2022
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous integration structure for artificial intelligence com...
Patent number
11,211,378
Issue date
Dec 28, 2021
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Simultaneous plating of varying size features on semiconductor subs...
Patent number
11,171,006
Issue date
Nov 9, 2021
International Business Machines Corporation
Mukta Ghate Farooq
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor wafer having trenches with varied dimensions for mult...
Patent number
11,049,844
Issue date
Jun 29, 2021
International Business Machines Corporation
Ravi K. Bonam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planar wafer level fan-out of multi-chip modules having different s...
Patent number
10,943,883
Issue date
Mar 9, 2021
International Business Machines Corporation
Ravi K. Bonam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SOI wafers with buried dielectric layers to prevent CU diffusion
Patent number
10,923,427
Issue date
Feb 16, 2021
GLOBALFOUNDRIES U.S. INC.
Anthony K. Stamper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electromigration monitor
Patent number
10,794,948
Issue date
Oct 6, 2020
International Business Machines Corporation
Fen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ionizing radiation blocking in IC chip to reduce soft errors
Patent number
10,784,200
Issue date
Sep 22, 2020
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electromigration monitor
Patent number
10,677,833
Issue date
Jun 9, 2020
International Business Machines Corporation
Fen Chen
G01 - MEASURING TESTING
Information
Patent Grant
Methods of forming integrated circuit structure for joining wafers...
Patent number
10,636,759
Issue date
Apr 28, 2020
GLOBALFOUNDRIES Inc.
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-to-chip and chip-to-substrate interconnections in multi-chip s...
Patent number
10,438,894
Issue date
Oct 8, 2019
GLOBALFOUNDRIES Inc.
Mukta Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thru-silicon-via structures
Patent number
10,388,567
Issue date
Aug 20, 2019
GLOBALFOUNDRIES Inc.
Fen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming multi-sized through-silicon-via (TSV) structures
Patent number
10,296,698
Issue date
May 21, 2019
GLOBALFOUNDRIES Inc.
Mukta G. Farooq
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
DIFFERENTIAL ETCH RATES OF COPPER FEATURES
Publication number
20250046654
Publication date
Feb 6, 2025
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
Publication number
20250006699
Publication date
Jan 2, 2025
International Business Machines Corporation
John Knickerbocker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROMIGRATION RESISTANT SEMICONDUCTOR STRUCTURE
Publication number
20240387426
Publication date
Nov 21, 2024
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...
Publication number
20240332121
Publication date
Oct 3, 2024
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY
Publication number
20240332239
Publication date
Oct 3, 2024
International Business Machines Corporation
Nicholas Alexander Polomoff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
Publication number
20240334616
Publication date
Oct 3, 2024
International Business Machines Corporation
Keiji Matsumoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP MODULE ASSEMBLY
Publication number
20240332194
Publication date
Oct 3, 2024
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION
Publication number
20240321593
Publication date
Sep 26, 2024
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING
Publication number
20240290730
Publication date
Aug 29, 2024
International Business Machines Corporation
Sathyanarayanan Raghavan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
Publication number
20240282658
Publication date
Aug 22, 2024
International Business Machines Corporation
John Knickerbocker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN
Publication number
20240243062
Publication date
Jul 18, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID SIGNAL ROUTING WITH BACKSIDE INTERCONNECT
Publication number
20240242012
Publication date
Jul 18, 2024
International Business Machines Corporation
Ruilong Xie
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION
Publication number
20240215270
Publication date
Jun 27, 2024
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER DIES WITH THERMALLY CONDUCTING PERIMETER REGIONS
Publication number
20240194555
Publication date
Jun 13, 2024
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN
Publication number
20240170288
Publication date
May 23, 2024
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
Publication number
20240153894
Publication date
May 9, 2024
International Business Machines Corporation
John Knickerbocker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATING HEAT SPREADER
Publication number
20240120705
Publication date
Apr 11, 2024
International Business Machines Corporation
Keiji Matsumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
Publication number
20240113055
Publication date
Apr 4, 2024
International Business Machines Corporation
Nicholas Alexander Polomoff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION
Publication number
20240103065
Publication date
Mar 28, 2024
International Business Machines Corporation
Arvind Kumar
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ASSEMBLY OF A CHIP TO A SUBSTRATE
Publication number
20240063171
Publication date
Feb 22, 2024
International Business Machines Corporation
Katsuyuki Sakuma
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STACKED SEMICONDUCTOR DEVICES WITH TOPSIDE AND BACKSIDE INTERCONNEC...
Publication number
20230352406
Publication date
Nov 2, 2023
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER
Publication number
20230268275
Publication date
Aug 24, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TSV and Backside Power Distribution Structure
Publication number
20230230901
Publication date
Jul 20, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION
Publication number
20230197595
Publication date
Jun 22, 2023
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPERATURE HIERARCHY SOLDER BONDING
Publication number
20230197657
Publication date
Jun 22, 2023
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE DIE ASSEMBLY
Publication number
20230163100
Publication date
May 25, 2023
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bridge Chip with Through Via
Publication number
20230154854
Publication date
May 18, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH EARLY BURIED POWER RAIL (BPR) AND BACKSID...
Publication number
20230132353
Publication date
Apr 27, 2023
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CIRCUIT POWER DELIVERY
Publication number
20230113296
Publication date
Apr 13, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...
Publication number
20230100769
Publication date
Mar 30, 2023
International Business Machines Corporation
John Knickerbocker
H01 - BASIC ELECTRIC ELEMENTS