Mukta G. Farooq

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sintering a nanoparticle paste for semiconductor chip join
- Patent number 12,199,059
- Issue date Jan 14, 2025
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate thinning for a backside power distribution network
- Patent number 12,106,969
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with early buried power rail (BPR) and backsid...
- Patent number 12,057,371
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked FET integration with BSPDN
- Patent number 11,984,401
- Issue date May 14, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature hierarchy solder bonding
- Patent number 11,887,956
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge chip with through via
- Patent number 11,848,273
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of a chip to a substrate
- Patent number 11,824,037
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor circuit power delivery
- Patent number 11,817,394
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory and logic chip stack with a translator chip
- Patent number 11,791,326
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating cooldown peeling stress during chip package assembly
- Patent number 11,545,444
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for bridge chip assembly with capillary underfill
- Patent number 11,404,379
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide-bonded wafer pair separation using laser debonding
- Patent number 11,355,379
- Issue date Jun 7, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual redistribution layer structure
- Patent number 11,315,831
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration structure and planar joining
- Patent number 11,282,716
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu—Cu bonding for interconnects on bridge chip attached to chips an...
- Patent number 11,239,167
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration structure for artificial intelligence com...
- Patent number 11,211,378
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous plating of varying size features on semiconductor subs...
- Patent number 11,171,006
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Mukta Ghate Farooq
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer having trenches with varied dimensions for mult...
- Patent number 11,049,844
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar wafer level fan-out of multi-chip modules having different s...
- Patent number 10,943,883
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafers with buried dielectric layers to prevent CU diffusion
- Patent number 10,923,427
- Issue date Feb 16, 2021
- GLOBALFOUNDRIES U.S. INC.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration monitor
- Patent number 10,794,948
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionizing radiation blocking in IC chip to reduce soft errors
- Patent number 10,784,200
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration monitor
- Patent number 10,677,833
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Methods of forming integrated circuit structure for joining wafers...
- Patent number 10,636,759
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-to-chip and chip-to-substrate interconnections in multi-chip s...
- Patent number 10,438,894
- Issue date Oct 8, 2019
- GLOBALFOUNDRIES Inc.
- Mukta Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thru-silicon-via structures
- Patent number 10,388,567
- Issue date Aug 20, 2019
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming multi-sized through-silicon-via (TSV) structures
- Patent number 10,296,698
- Issue date May 21, 2019
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DIFFERENTIAL ETCH RATES OF COPPER FEATURES
- Publication number 20250046654
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
- Publication number 20250006699
- Publication date Jan 2, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT SEMICONDUCTOR STRUCTURE
- Publication number 20240387426
- Publication date Nov 21, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...
- Publication number 20240332121
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY
- Publication number 20240332239
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP MODULE ASSEMBLY
- Publication number 20240332194
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION
- Publication number 20240321593
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING
- Publication number 20240290730
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Sathyanarayanan Raghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN
- Publication number 20240243062
- Publication date Jul 18, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SIGNAL ROUTING WITH BACKSIDE INTERCONNECT
- Publication number 20240242012
- Publication date Jul 18, 2024
- International Business Machines Corporation
- Ruilong Xie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION
- Publication number 20240215270
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DIES WITH THERMALLY CONDUCTING PERIMETER REGIONS
- Publication number 20240194555
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN
- Publication number 20240170288
- Publication date May 23, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATING HEAT SPREADER
- Publication number 20240120705
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION
- Publication number 20240103065
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Arvind Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ASSEMBLY OF A CHIP TO A SUBSTRATE
- Publication number 20240063171
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SEMICONDUCTOR DEVICES WITH TOPSIDE AND BACKSIDE INTERCONNEC...
- Publication number 20230352406
- Publication date Nov 2, 2023
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER
- Publication number 20230268275
- Publication date Aug 24, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV and Backside Power Distribution Structure
- Publication number 20230230901
- Publication date Jul 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION
- Publication number 20230197595
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE HIERARCHY SOLDER BONDING
- Publication number 20230197657
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE ASSEMBLY
- Publication number 20230163100
- Publication date May 25, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bridge Chip with Through Via
- Publication number 20230154854
- Publication date May 18, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EARLY BURIED POWER RAIL (BPR) AND BACKSID...
- Publication number 20230132353
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT POWER DELIVERY
- Publication number 20230113296
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...
- Publication number 20230100769
- Publication date Mar 30, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS

Mukta G. Farooq

Person

Patents Grantslast 30 patents

Sintering a nanoparticle paste for semiconductor chip join

Substrate thinning for a backside power distribution network

Semiconductor device with early buried power rail (BPR) and backsid...

High density interconnection and wiring layers, package structures,...

Stacked FET integration with BSPDN

Multiple die assembly

Temperature hierarchy solder bonding

Bridge chip with through via

Assembly of a chip to a substrate

Semiconductor circuit power delivery

Memory and logic chip stack with a translator chip

Protective surface layer on under bump metallurgy for solder joining

Mitigating cooldown peeling stress during chip package assembly

Structure and method for bridge chip assembly with capillary underfill

Oxide-bonded wafer pair separation using laser debonding

Dual redistribution layer structure

Integration structure and planar joining

Cu—Cu bonding for interconnects on bridge chip attached to chips an...

Heterogeneous integration structure for artificial intelligence com...

Simultaneous plating of varying size features on semiconductor subs...

Semiconductor wafer having trenches with varied dimensions for mult...

Planar wafer level fan-out of multi-chip modules having different s...

SOI wafers with buried dielectric layers to prevent CU diffusion

Electromigration monitor

Ionizing radiation blocking in IC chip to reduce soft errors

Electromigration monitor

Methods of forming integrated circuit structure for joining wafers...

Chip-to-chip and chip-to-substrate interconnections in multi-chip s...

Thru-silicon-via structures

Forming multi-sized through-silicon-via (TSV) structures

Patents Applicationslast 30 patents

DIFFERENTIAL ETCH RATES OF COPPER FEATURES

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

ELECTROMIGRATION RESISTANT SEMICONDUCTOR STRUCTURE

ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...

HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY

HEAT SPREADER FOR MODIFIED EDGE COOLING

CHIP MODULE ASSEMBLY

DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION

DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN

HYBRID SIGNAL ROUTING WITH BACKSIDE INTERCONNECT

HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION

WAFER DIES WITH THERMALLY CONDUCTING PERIMETER REGIONS

INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

ISOLATING HEAT SPREADER

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION

ASSEMBLY OF A CHIP TO A SUBSTRATE

STACKED SEMICONDUCTOR DEVICES WITH TOPSIDE AND BACKSIDE INTERCONNEC...

RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER

TSV and Backside Power Distribution Structure

MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION

TEMPERATURE HIERARCHY SOLDER BONDING

MULTIPLE DIE ASSEMBLY

Bridge Chip with Through Via

SEMICONDUCTOR DEVICE WITH EARLY BURIED POWER RAIL (BPR) AND BACKSID...

SEMICONDUCTOR CIRCUIT POWER DELIVERY

HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...