Mutsumi Masumoto

Person

Oita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Frame design in embedded die package
- Patent number 12,154,861
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 12,125,799
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing thermoelectric conversion module
- Patent number 12,114,568
- Issue date Oct 8, 2024
- Lintec Corporation
- Yuta Seki
Information Patent Grant
Fan-out electronic device
- Patent number 11,410,875
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 11,183,460
- Issue date Nov 23, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer in embedded package
- Patent number 11,183,441
- Issue date Nov 23, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die package multichip module
- Patent number 11,158,595
- Issue date Oct 26, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer in embedded package
- Patent number 10,580,715
- Issue date Mar 3, 2020
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding a solder bump to a lead using compression and retraction fo...
- Patent number 8,381,967
- Issue date Feb 26, 2013
- Texas Instruments Incorporated
- Mutsumi Masumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having solder-free gold bump contacts for stab...
- Patent number 8,298,947
- Issue date Oct 30, 2012
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper pillar bonding for fine pitch flip chip devices
- Patent number 8,115,310
- Issue date Feb 14, 2012
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pattern formation method
- Patent number 7,947,602
- Issue date May 24, 2011
- Texas Instruments Incorporated
- Chizuko Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device singulation method
- Patent number 7,851,264
- Issue date Dec 14, 2010
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solder-free gold bump contacts for stab...
- Patent number 7,847,399
- Issue date Dec 7, 2010
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for thin semiconductor packages
- Patent number 7,754,528
- Issue date Jul 13, 2010
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting system
- Patent number 7,621,969
- Issue date Nov 24, 2009
- Toray Engineering Co., Ltd.
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,521,291
- Issue date Apr 21, 2009
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor device manufacturing method
- Patent number 7,459,339
- Issue date Dec 2, 2008
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor package, with a rerouted elect...
- Patent number 7,157,363
- Issue date Jan 2, 2007
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and electronic device
- Patent number 7,023,088
- Issue date Apr 4, 2006
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package production method and semiconductor package
- Patent number 6,969,919
- Issue date Nov 29, 2005
- Texas Instruments Incorporated
- Kiyoshi Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,929,971
- Issue date Aug 16, 2005
- Texas Instruments Incorporated
- Kensho Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 6,887,778
- Issue date May 3, 2005
- Texas Instruments Incorporated
- Masako Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,876,077
- Issue date Apr 5, 2005
- Texas Instruments Incorporated
- Kensho Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package, semiconductor device, electronic device, and...
- Patent number 6,835,595
- Issue date Dec 28, 2004
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging a low profile semiconductor device
- Patent number 6,830,956
- Issue date Dec 14, 2004
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor chip comprising multiple bo...
- Patent number 6,780,749
- Issue date Aug 24, 2004
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a thermoset bond
- Patent number 6,774,496
- Issue date Aug 10, 2004
- Texas Instruments Incorporated
- Kiyoshi Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,759,745
- Issue date Jul 6, 2004
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side coating of semiconductor wafers
- Patent number 6,734,532
- Issue date May 11, 2004
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE
- Publication number 20240023441
- Publication date Jan 18, 2024
- LINTEC CORPORATION
- Yuta SEKI
Information Patent Application
THERMOELECTRIC CONVERSION MODULE
- Publication number 20230380288
- Publication date Nov 23, 2023
- LINTEC CORPORATION
- Yuta SEKI
Information Patent Application
EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE
- Publication number 20220108955
- Publication date Apr 7, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME DESIGN IN EMBEDDED DIE PACKAGE
- Publication number 20210134729
- Publication date May 6, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-COVERED CHIP SCALE PACKAGES
- Publication number 20210125959
- Publication date Apr 29, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ELECTRONIC DEVICE
- Publication number 20200203219
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer in Embedded Package
- Publication number 20200203249
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE
- Publication number 20200091076
- Publication date Mar 19, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer in Embedded Package
- Publication number 20190385924
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGE MULTICHIP MODULE
- Publication number 20190013288
- Publication date Jan 10, 2019
- WOOCHAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
- Publication number 20160240392
- Publication date Aug 18, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...
- Publication number 20160005705
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
- Publication number 20150147845
- Publication date May 28, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE OF PANELIZED PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20150008566
- Publication date Jan 8, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Solder-Free Gold Bump Contacts for Stab...
- Publication number 20110045641
- Publication date Feb 24, 2011
- TEXAS INSTRUMENTS INCORPORATED
- MUTSUMI MASUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PILLAR BONDING FOR FINE PITCH FLIP CHIP DEVICES
- Publication number 20100314745
- Publication date Dec 16, 2010
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting Flip Chip and Substrate Used Therein
- Publication number 20100269333
- Publication date Oct 28, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi MASUMOTO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Manufacturing Method
- Publication number 20100255641
- Publication date Oct 7, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Noboru NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Thin Single or Multichip Semiconductor QFN...
- Publication number 20100237511
- Publication date Sep 23, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Part Manufacturing Method
- Publication number 20100090334
- Publication date Apr 15, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi MASUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembling of Electronic Members on IC Chip
- Publication number 20100032802
- Publication date Feb 11, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Shinichi Togawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Singulation Method
- Publication number 20090197373
- Publication date Aug 6, 2009
- TEXAS INSTRUMENTS INCORPORATED
- MUTSUMI MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SOLDER-FREE GOLD BUMP CONTACTS FOR STAB...
- Publication number 20090146298
- Publication date Jun 11, 2009
- TEXAS INSTRUMENTS INCORPORATED
- MUTSUMI MASUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR THIN SINGLE OR MULTICHIP SEMICONDUCTOR QFN...
- Publication number 20090087946
- Publication date Apr 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090017582
- Publication date Jan 15, 2009
- TEXAS INSTRUMENTS INCORPORATED
- MUTSUMI MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging system
- Publication number 20090011538
- Publication date Jan 8, 2009
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PATTERN FORMATION METHOD
- Publication number 20080199988
- Publication date Aug 21, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Chizuko Ito
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structure and method for thin single or multichip semiconductor QFN...
- Publication number 20070132075
- Publication date Jun 14, 2007
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Semiconductor Device Manufacturing Method
- Publication number 20070117264
- Publication date May 24, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Improved Stud Bump
- Publication number 20070117265
- Publication date May 24, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS

Mutsumi Masumoto

Person

Patents Grantslast 30 patents

Frame design in embedded die package

Embedded die packaging with integrated ceramic substrate

Method for manufacturing thermoelectric conversion module

Fan-out electronic device

Embedded die packaging with integrated ceramic substrate

Stress buffer layer in embedded package

Embedded die package multichip module

Stress buffer layer in embedded package

Bonding a solder bump to a lead using compression and retraction fo...

Semiconductor device having solder-free gold bump contacts for stab...

Copper pillar bonding for fine pitch flip chip devices

Conductive pattern formation method

Semiconductor device singulation method

Semiconductor device having solder-free gold bump contacts for stab...

Method for thin semiconductor packages

Mounting system

Method for manufacturing a semiconductor device

Flip-chip semiconductor device manufacturing method

Method for producing a semiconductor package, with a rerouted elect...

Semiconductor package, semiconductor device and electronic device

Semiconductor package production method and semiconductor package

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing method

Semiconductor device and its manufacturing method

Semiconductor package, semiconductor device, electronic device, and...

Method for packaging a low profile semiconductor device

Method of manufacturing a semiconductor chip comprising multiple bo...

Semiconductor package with a thermoset bond

Semiconductor device and manufacturing method thereof

Back side coating of semiconductor wafers

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE

THERMOELECTRIC CONVERSION MODULE

EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE

FRAME DESIGN IN EMBEDDED DIE PACKAGE

METAL-COVERED CHIP SCALE PACKAGES

FAN-OUT ELECTRONIC DEVICE

Stress Buffer Layer in Embedded Package

EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE

Stress Buffer Layer in Embedded Package

EMBEDDED DIE PACKAGE MULTICHIP MODULE

DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND

Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...

DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND

METHOD AND STRUCTURE OF PANELIZED PACKAGING OF SEMICONDUCTOR DEVICES

Semiconductor Device Having Solder-Free Gold Bump Contacts for Stab...

COPPER PILLAR BONDING FOR FINE PITCH FLIP CHIP DEVICES

Method for Mounting Flip Chip and Substrate Used Therein

Semiconductor Manufacturing Method

Structure and Method for Thin Single or Multichip Semiconductor QFN...

Electronic Part Manufacturing Method

Assembling of Electronic Members on IC Chip

Semiconductor Device Singulation Method

SEMICONDUCTOR DEVICE HAVING SOLDER-FREE GOLD BUMP CONTACTS FOR STAB...

STRUCTURE AND METHOD FOR THIN SINGLE OR MULTICHIP SEMICONDUCTOR QFN...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Packaging system

CONDUCTIVE PATTERN FORMATION METHOD

Structure and method for thin single or multichip semiconductor QFN...

Flip-Chip Semiconductor Device Manufacturing Method

Semiconductor Device with Improved Stud Bump