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Neil McLellan
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Danville, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating an integrated circuit (IC) package having a p...
Patent number
9,520,306
Issue date
Dec 13, 2016
UTAC HEADQUARTERS PTE. LTD.
Geraldine Tsui Yee Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package with improved thermal characteristics
Patent number
9,449,903
Issue date
Sep 20, 2016
UTAC Hong Kong Limited
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package with improved thermal characteristics
Patent number
8,610,262
Issue date
Dec 17, 2013
UTAC Hong Kong Limited
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having a plurality of spaced apart pad p...
Patent number
8,330,270
Issue date
Dec 11, 2012
UTAC Hong Kong Limited
Geraldine Tsui Yee Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cavity-type integrated circuit package
Patent number
7,732,914
Issue date
Jun 8, 2010
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier with contact standoff
Patent number
7,595,225
Issue date
Sep 29, 2009
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with partially exposed contact pads and...
Patent number
7,411,289
Issue date
Aug 12, 2008
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package and process for manufacturing same
Patent number
7,372,151
Issue date
May 13, 2008
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabricating an integrated circuit package with reduced...
Patent number
7,371,610
Issue date
May 13, 2008
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin array plastic package without die attach pad and process for f...
Patent number
7,358,119
Issue date
Apr 15, 2008
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced cavity-down integrated circuit package
Patent number
7,342,305
Issue date
Mar 11, 2008
ASAT Ltd.
Qizhong Diao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package that includes a collapsible spacer for sepa...
Patent number
7,315,080
Issue date
Jan 1, 2008
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless plastic chip carrier
Patent number
7,270,867
Issue date
Sep 18, 2007
ASAT Ltd.
Kin Pui Kwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabricating an integrated circuit package
Patent number
7,247,526
Issue date
Jul 24, 2007
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabricating a leadless plastic chip carrier
Patent number
7,226,811
Issue date
Jun 5, 2007
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip ball grid array package
Patent number
7,224,048
Issue date
May 29, 2007
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and process for fabricating the same
Patent number
7,091,581
Issue date
Aug 15, 2006
ASAT Limited
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package and process for manufacturing same
Patent number
6,987,032
Issue date
Jan 17, 2006
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced cavity-down integrated circuit package
Patent number
6,984,785
Issue date
Jan 10, 2006
ASAT Ltd.
Qizhong Diao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabricating a leadless plastic chip carrier
Patent number
6,946,324
Issue date
Sep 20, 2005
ASAT Ltd.
Neil McLellan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ball grid array package and process for manufacturing same
Patent number
6,933,176
Issue date
Aug 23, 2005
ASAT Ltd.
Mohan Kirloskar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for dressing molded array package saw blade
Patent number
6,903,304
Issue date
Jun 7, 2005
Asat LTD
Neil McLellan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME
Publication number
20160013075
Publication date
Jan 14, 2016
Geraldine Tsui Yee LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS
Publication number
20140183712
Publication date
Jul 3, 2014
UTAC Hong Kong Limited
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball grid array package and process for manufacturing same
Publication number
20060223229
Publication date
Oct 5, 2006
ASAT Ltd.
Mohan Kirloskar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin array plastic package without die attach pad and process for f...
Publication number
20060154403
Publication date
Jul 13, 2006
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS