Neng-Tai Shih

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses including dummy dice
- Patent number 11,735,540
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices
- Patent number 11,062,984
- Issue date Jul 13, 2021
- Micron Technology, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices including dummy dice
- Patent number 10,937,749
- Issue date Mar 2, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including redistribution layers
- Patent number 10,818,536
- Issue date Oct 27, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package structures including redistribution layers
- Patent number 10,566,229
- Issue date Feb 18, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming and operating microelectronic devices including...
- Patent number 10,446,509
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,121,734
- Issue date Nov 6, 2018
- Micron Technology, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including dummy chips
- Patent number 10,043,769
- Issue date Aug 7, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a semiconductor package structure including...
- Patent number 9,916,999
- Issue date Mar 13, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 9,748,106
- Issue date Aug 29, 2017
- Micron Technology, Inc.
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and fabrication method thereof
- Patent number 9,520,333
- Issue date Dec 13, 2016
- Inotera Memories, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method therefor
- Patent number 9,496,358
- Issue date Nov 15, 2016
- Inotera Memories, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer and fabrication method thereof
- Patent number 9,455,243
- Issue date Sep 27, 2016
- Inotera Memories, Inc.
- Shih-Fan Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly and method for manufacturing the same
- Patent number 9,449,953
- Issue date Sep 20, 2016
- Inotera Memories, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly and method for manufacturing the same
- Patent number 9,437,583
- Issue date Sep 6, 2016
- Inotera Memories, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 9,171,847
- Issue date Oct 27, 2015
- Inotera Memories, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Authentication method for network connection and network device and...
- Patent number 9,071,591
- Issue date Jun 30, 2015
- Wistron Corp.
- Neng-Chieh Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES INCLUDING DUMMY DICE
- Publication number 20210175188
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20200168497
- Publication date May 28, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AND OPERATING MICROELECTRONIC DEVICES INCLUDING...
- Publication number 20190371749
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190074246
- Publication date Mar 7, 2019
- Micron Technology, Inc.
- Tzung-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AND OPERATING SEMICONDUCTOR DEVICES INCLUDING DU...
- Publication number 20180323160
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR WITH ENHANCED CAPACITANCE
- Publication number 20180190761
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Hsu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20180190531
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20170213740
- Publication date Jul 27, 2017
- Micron Technology, Inc.
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170207154
- Publication date Jul 20, 2017
- Micron Technology, Inc.
- Tzung-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOVERABLE DEVICE FOR MEMORY BASE PRODUCT
- Publication number 20170012028
- Publication date Jan 12, 2017
- Inotera Memories, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160372395
- Publication date Dec 22, 2016
- Inotera Memories, Inc.
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160365334
- Publication date Dec 15, 2016
- Inotera Memories, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160358865
- Publication date Dec 8, 2016
- Inotera Memories, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160358847
- Publication date Dec 8, 2016
- Inotera Memories, Inc.
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160351462
- Publication date Dec 1, 2016
- Inotera Memories, Inc.
- Shih-Fan Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160104782
- Publication date Apr 14, 2016
- INOTERA MEMORIES, INC.
- TZUNG-HAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20150349072
- Publication date Dec 3, 2015
- INOTERA MEMORIES, INC.
- TZUNG-HAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150348871
- Publication date Dec 3, 2015
- INOTERA MEMORIES, INC.
- Hsu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTHENTICATION METHOD FOR NETWORK CONNECTION AND NETWORK DEVICE AND...
- Publication number 20120297448
- Publication date Nov 22, 2012
- WISTRON CORP.
- Neng-Chieh Shih
- G06 - COMPUTING CALCULATING COUNTING

Neng-Tai Shih

Person

Patents Grantslast 30 patents

Apparatuses including dummy dice

Methods for forming semiconductor devices

Methods of forming microelectronic devices including dummy dice

Microelectronic devices including redistribution layers

Microelectronic package structures including redistribution layers

Methods of forming and operating microelectronic devices including...

Semiconductor device

Semiconductor devices including dummy chips

Methods of fabricating a semiconductor package structure including...

Method for fabricating semiconductor package

Wafer level package and fabrication method thereof

Semiconductor device and fabrication method therefor

Silicon interposer and fabrication method thereof

Package-on-package assembly and method for manufacturing the same

Package-on-package assembly and method for manufacturing the same

Semiconductor structure

Authentication method for network connection and network device and...

Patents Applicationslast 30 patents

APPARATUSES INCLUDING DUMMY DICE

MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS

METHODS OF FORMING AND OPERATING MICROELECTRONIC DEVICES INCLUDING...

SEMICONDUCTOR DEVICE

METHODS OF FORMING AND OPERATING SEMICONDUCTOR DEVICES INCLUDING DU...

MIM CAPACITOR WITH ENHANCED CAPACITANCE

SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

RECOVERABLE DEVICE FOR MEMORY BASE PRODUCT

WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF

TRANSISTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

AUTHENTICATION METHOD FOR NETWORK CONNECTION AND NETWORK DEVICE AND...