Nicholas A. Lanzillo

Person

Troy, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Negative capacitance for ferroelectric capacitive memory cell
- Patent number 12,266,393
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Takashi Ando
- G11 - INFORMATION STORAGE
Information Patent Grant
Top via patterning using metal as hard mask and via conductor
- Patent number 12,261,056
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal RRAM device and architecture for variability reduction
- Patent number 12,156,486
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free resistance contacts and silicide with silicide stop layer
- Patent number 12,040,373
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial subtractive supervia enabling hyper-scaling
- Patent number 11,908,791
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect including integrally formed capacitor
- Patent number 11,908,738
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimizating semiconductor binning by feed-forward process adjustment
- Patent number 11,869,783
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fully aligned top vias
- Patent number 11,854,884
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside floating metal for increased capacitance
- Patent number 11,756,887
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topological semi-metal interconnects
- Patent number 11,749,602
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of barrier and liner layers from a bottom of a via
- Patent number 11,735,475
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio vias for integrated circuits
- Patent number 11,682,617
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,621,189
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via stack
- Patent number 11,600,565
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact scheme for pillar-based memory elements
- Patent number 11,488,863
- Issue date Nov 1, 2022
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line interconnect structures with varying aspect ratios
- Patent number 11,444,029
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 11,437,317
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier removal for conductor in top via integration scheme
- Patent number 11,430,735
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE STACKED TRANSISTOR
- Publication number 20250118630
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS
- Publication number 20250105061
- Publication date Mar 27, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT
- Publication number 20250096127
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TIP-TO-TIP SCALING
- Publication number 20250096132
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM CONTACT JUMPERS FOR STACKED FIELD EFFECT TRANSISTOR SEMICOND...
- Publication number 20250096128
- Publication date Mar 20, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE TRACKPLAN FOR POWER DELIVERY
- Publication number 20250054863
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE TRANSISTOR WITH CONCAVE AND CONVEX EDGES
- Publication number 20250048675
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METAL PATTERNING AND DAMASCENE-BASED INTERCONNECT
- Publication number 20250046703
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE FET WITH SELF-ALIGNED TAPERED ACTIVE REGION EDGE
- Publication number 20250048695
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS
- Publication number 20250038107
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BACKSIDE CONTACT IN STACK NANOSHEET
- Publication number 20250031430
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Shahrukh Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CHANGE BETWEEN METAL LINES
- Publication number 20250006638
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR BACKSIDE SIGNAL AND POWER
- Publication number 20240421087
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES WITH BACKSIDE CONTACTS
- Publication number 20240421038
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- Publication number 20240421078
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- Publication number 20240421079
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH
- Publication number 20240421069
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION WITH BACKSIDE POWER PLANES
- Publication number 20240421088
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FETs WITH BACKSIDE ANGLE CUT
- Publication number 20240413084
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTORS WITH METAL VIAS
- Publication number 20240413085
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONTSIDE TO BACKSIDE CONNECTION WITHIN DOUBLE DIFFUSION BREAK
- Publication number 20240404944
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Shravana Kumar Katakam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...
- Publication number 20240395822
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY
- Publication number 20240395711
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SELF ALIGNED SKIP VIA
- Publication number 20240371729
- Publication date Nov 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOUGED INTERCONNECT LINE
- Publication number 20240363524
- Publication date Oct 31, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CONTACT CONNECTION THROUGH DIFFUSION BREAK AREA
- Publication number 20240347423
- Publication date Oct 17, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FERROELECTRIC INSULATOR METAL STACK IN RRAM
- Publication number 20240349631
- Publication date Oct 17, 2024
- International Business Machines Corporation
- Takashi Ando
Information Patent Application
OFFSET VIA FORMATION FOR FLEXIBLE ROUTING
- Publication number 20240332165
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Nicholas A. Lanzillo

Person

Patents Grantslast 30 patents

Negative capacitance for ferroelectric capacitive memory cell

Top via patterning using metal as hard mask and via conductor

Single-mask alternating line deposition

Horizontal RRAM device and architecture for variability reduction

Memory cell in wafer backside

Self-aligning spacer tight pitch via

Liner-free resistance contacts and silicide with silicide stop layer

Top via interconnect having a line with a reduced bottom dimension

Interconnects having spacers for improved top via critical dimensio...

Partial subtractive supervia enabling hyper-scaling

Interconnect including integrally formed capacitor

Top via with damascene line and via

Top via process with damascene metal

Optimizating semiconductor binning by feed-forward process adjustment

Fully aligned top vias

Advanced metal interconnects with a replacement metal

Top via with next level line selective growth

Top via cut fill process for line extension reduction

Conductive lines with subtractive cuts

Backside floating metal for increased capacitance

Topological semi-metal interconnects

Removal of barrier and liner layers from a bottom of a via

High aspect ratio vias for integrated circuits

Stepped top via for via resistance reduction

Barrier-less prefilled via formation

Top via stack

Self-aligned contact scheme for pillar-based memory elements

Back-end-of-line interconnect structures with varying aspect ratios

Single-mask alternating line deposition

Barrier removal for conductor in top via integration scheme

Patents Applicationslast 30 patents

CUT SHAPES FOR BACKSIDE METALS

DUAL SIDE STACKED TRANSISTOR

SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS

BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT

METAL TIP-TO-TIP SCALING

BOTTOM CONTACT JUMPERS FOR STACKED FIELD EFFECT TRANSISTOR SEMICOND...

FLEXIBLE TRACKPLAN FOR POWER DELIVERY

MULTI-GATE TRANSISTOR WITH CONCAVE AND CONVEX EDGES

SUBTRACTIVE METAL PATTERNING AND DAMASCENE-BASED INTERCONNECT

MULTI-GATE FET WITH SELF-ALIGNED TAPERED ACTIVE REGION EDGE

INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS

EXTENDED BACKSIDE CONTACT IN STACK NANOSHEET

BACKSIDE LOCAL INTERCONNECT

PITCH CHANGE BETWEEN METAL LINES

STRUCTURE FOR BACKSIDE SIGNAL AND POWER

STACKED DEVICES WITH BACKSIDE CONTACTS

REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE

INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES

TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH

POWER DISTRIBUTION WITH BACKSIDE POWER PLANES

STACKED FETs WITH BACKSIDE ANGLE CUT

STACKED TRANSISTORS WITH METAL VIAS

FRONTSIDE TO BACKSIDE CONNECTION WITHIN DOUBLE DIFFUSION BREAK

BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...

SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY

BACKSIDE SELF ALIGNED SKIP VIA

GOUGED INTERCONNECT LINE

METAL CONTACT CONNECTION THROUGH DIFFUSION BREAK AREA

METAL FERROELECTRIC INSULATOR METAL STACK IN RRAM

OFFSET VIA FORMATION FOR FLEXIBLE ROUTING