Nicholas A. Lanzillo

Person

Troy, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked transistor layout for improved cell height scaling
- Patent number 12,363,965
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Grant
Dielectric caps for power and signal line routing
- Patent number 12,334,442
- Issue date Jun 17, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feed-forward design of three-dimensional quantum chips
- Patent number 12,293,140
- Issue date May 6, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Negative capacitance for ferroelectric capacitive memory cell
- Patent number 12,266,393
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Takashi Ando
- G11 - INFORMATION STORAGE
Information Patent Grant
Top via patterning using metal as hard mask and via conductor
- Patent number 12,261,056
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal RRAM device and architecture for variability reduction
- Patent number 12,156,486
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free resistance contacts and silicide with silicide stop layer
- Patent number 12,040,373
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial subtractive supervia enabling hyper-scaling
- Patent number 11,908,791
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect including integrally formed capacitor
- Patent number 11,908,738
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimizating semiconductor binning by feed-forward process adjustment
- Patent number 11,869,783
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fully aligned top vias
- Patent number 11,854,884
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside floating metal for increased capacitance
- Patent number 11,756,887
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topological semi-metal interconnects
- Patent number 11,749,602
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of barrier and liner layers from a bottom of a via
- Patent number 11,735,475
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio vias for integrated circuits
- Patent number 11,682,617
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,621,189
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via stack
- Patent number 11,600,565
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact scheme for pillar-based memory elements
- Patent number 11,488,863
- Issue date Nov 1, 2022
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL
- Publication number 20250218863
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING PATH USING FREE BACKSIDE WIRES
- Publication number 20250212523
- Publication date Jun 26, 2025
- International Business Machines Corporation
- James P. Mazza
Information Patent Application
SELF-ALIGNED BACKSIDE CHANNEL REMOVAL
- Publication number 20250204048
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Reinaldo Vega
Information Patent Application
REPLACEMENT FULLY ALIGNED VIA AND METAL LINE
- Publication number 20250201699
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONTSIDE-TO-BACKSIDE CONNECTION WITH CUT FOR STACKED TRANSISTOR
- Publication number 20250203974
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS
- Publication number 20250194210
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING
- Publication number 20250194199
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLY-OVER METAL JUMPER CONNECTION
- Publication number 20250192023
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS
- Publication number 20250192054
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC VIA BAR UNDER POWER RAIL
- Publication number 20250192046
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE STRUCTURES WITH VARYING LAYER CHARACTERISTICS
- Publication number 20250194182
- Publication date Jun 12, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE TIE-DOWN TO BACKSIDE POWER RAIL
- Publication number 20250194197
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED METAL JUMPER STRUCTURE FOR BEOL
- Publication number 20250192037
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING
- Publication number 20250183145
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED JUMPER CONNECTION
- Publication number 20250185291
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING ANGLED DIELECTRIC BARS ATTACHED TO...
- Publication number 20250169131
- Publication date May 22, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
REDUCED GATE EDGE CAPACITANCE
- Publication number 20250159963
- Publication date May 15, 2025
- International Business Machines Corporation
- Takashi Ando
Information Patent Application
VIA CONNECTION IN MIDDLE BEOL WIRING
- Publication number 20250140650
- Publication date May 1, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH ASYMMETRIC CELL BOUNDARY
- Publication number 20250133816
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE-VIA-LINE STRUCTURE FOR BSPDN
- Publication number 20250125250
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT
- Publication number 20250125193
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE STACKED TRANSISTOR
- Publication number 20250118630
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS
- Publication number 20250105061
- Publication date Mar 27, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT
- Publication number 20250096127
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TIP-TO-TIP SCALING
- Publication number 20250096132
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM CONTACT JUMPERS FOR STACKED FIELD EFFECT TRANSISTOR SEMICOND...
- Publication number 20250096128
- Publication date Mar 20, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE TRACKPLAN FOR POWER DELIVERY
- Publication number 20250054863
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE TRANSISTOR WITH CONCAVE AND CONVEX EDGES
- Publication number 20250048675
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS

Nicholas A. Lanzillo

Person

Patents Grantslast 30 patents

Stacked transistor layout for improved cell height scaling

Dielectric caps for power and signal line routing

Feed-forward design of three-dimensional quantum chips

Negative capacitance for ferroelectric capacitive memory cell

Top via patterning using metal as hard mask and via conductor

Single-mask alternating line deposition

Horizontal RRAM device and architecture for variability reduction

Memory cell in wafer backside

Self-aligning spacer tight pitch via

Liner-free resistance contacts and silicide with silicide stop layer

Top via interconnect having a line with a reduced bottom dimension

Interconnects having spacers for improved top via critical dimensio...

Partial subtractive supervia enabling hyper-scaling

Interconnect including integrally formed capacitor

Top via with damascene line and via

Top via process with damascene metal

Optimizating semiconductor binning by feed-forward process adjustment

Fully aligned top vias

Advanced metal interconnects with a replacement metal

Top via with next level line selective growth

Top via cut fill process for line extension reduction

Conductive lines with subtractive cuts

Backside floating metal for increased capacitance

Topological semi-metal interconnects

Removal of barrier and liner layers from a bottom of a via

High aspect ratio vias for integrated circuits

Stepped top via for via resistance reduction

Barrier-less prefilled via formation

Top via stack

Self-aligned contact scheme for pillar-based memory elements

Patents Applicationslast 30 patents

INTERCONNECT LINES WITH LINE WIDTH PROFILE

ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL

SIGNAL ROUTING PATH USING FREE BACKSIDE WIRES

SELF-ALIGNED BACKSIDE CHANNEL REMOVAL

REPLACEMENT FULLY ALIGNED VIA AND METAL LINE

FRONTSIDE-TO-BACKSIDE CONNECTION WITH CUT FOR STACKED TRANSISTOR

SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS

PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING

FLY-OVER METAL JUMPER CONNECTION

SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS

ASYMMETRIC VIA BAR UNDER POWER RAIL

STACKED DEVICE STRUCTURES WITH VARYING LAYER CHARACTERISTICS

GATE TIE-DOWN TO BACKSIDE POWER RAIL

BURIED METAL JUMPER STRUCTURE FOR BEOL

COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING

EMBEDDED JUMPER CONNECTION

SEMICONDUCTOR STRUCTURES HAVING ANGLED DIELECTRIC BARS ATTACHED TO...

REDUCED GATE EDGE CAPACITANCE

VIA CONNECTION IN MIDDLE BEOL WIRING

STACKED FET WITH ASYMMETRIC CELL BOUNDARY

LINE-VIA-LINE STRUCTURE FOR BSPDN

SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT

CUT SHAPES FOR BACKSIDE METALS

DUAL SIDE STACKED TRANSISTOR

SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS

BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT

METAL TIP-TO-TIP SCALING

BOTTOM CONTACT JUMPERS FOR STACKED FIELD EFFECT TRANSISTOR SEMICOND...

FLEXIBLE TRACKPLAN FOR POWER DELIVERY

MULTI-GATE TRANSISTOR WITH CONCAVE AND CONVEX EDGES